Engineered for performance. Built for reliability.
Introducing the PCBSync 12-Layer Rigid-Flex PCB with ENIG Finish — the ultimate solution for engineers and designers demanding precision, durability, and high-density interconnect capability in one compact package.
Superior Multi-Layer Architecture
Our 12-layer rigid-flex PCB combines the structural integrity of rigid boards with the dynamic flexibility of flex circuits. This hybrid design eliminates bulky connectors and reduces assembly points, making it ideal for aerospace, medical devices, wearables, military electronics, and advanced consumer technology where space and weight are critical.
ENIG Surface Finish — Gold-Level Protection
The Electroless Nickel Immersion Gold (ENIG) finish delivers a flat, corrosion-resistant surface that ensures excellent solderability and long-term reliability. ENIG is the preferred finish for fine-pitch components, BGA packages, and applications requiring multiple reflow cycles without oxidation concerns.
Key Features & Specifications
- 12 conductive layers for high-density routing and signal integrity
- ENIG surface finish for superior flatness and oxidation resistance
- Rigid-flex construction — bend-to-install or dynamic flex capability
- IPC Class 2 / Class 3 compliance available
- RoHS-compliant materials throughout
- Controlled impedance and blind/buried via support
- Operating temperature range: -40°C to +130°C
Why Choose PCBSync?
PCBSync delivers ISO-certified manufacturing, fast turnaround, and tight tolerance control on every board. Whether you’re prototyping or scaling to full production, our rigid-flex PCBs are tested to exceed industry standards.
Boost your design’s performance with a board built to handle the most demanding environments.
