Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

<a href="https://pcbsync.com/hdi-pcb/">HDI PCB</a> Capabilities | Microvia, Any-Layer & Build-Up, <a href="https://pcbsync.com/ipc-2226/">IPC-2226</a> — PCBSync
Capabilities  ›  HDI PCB
Capabilities · HDI PCB

HDI PCB Capabilities,
more interconnect, less board.

High-density interconnect from our 5,000㎡ Shenzhen factory — laser microvias, sequential build-up and any-layer constructions for fine-pitch BGAs and miniaturized designs, built to IPC-2226 & IPC-6016.

Send an inquiry View full spec
IPC-2226IPC-6016IPC-6012Any-layer HDI
HDI build-up construction
Build-up layer Stacked microvia Staggered µvia Buried via Core
any-layer
HDI structures
0.1 mm
Laser microvia
3 mil
Min line / space
25 µm
Hole plating
±7%
Impedance ctrl
18+
Blind/buried layers
Why HDI

Pack more into a smaller, faster board

HDI replaces large through-holes with tiny laser microvias and build-up layers, so traces route in less space. The result: smaller, lighter boards, fan-out for fine-pitch BGAs, shorter high-speed signal paths and higher reliability — essential for smartphones, wearables, modules and advanced electronics.

Process capability

HDI specifications

HDI structure and microvia parameters, plus the detailed process & reliability window (shown as Mass Production and extended Prototype tiers). Pushing the limits on via size or build-up count? Ask us.

HDI structure & microvias

ParameterSpecification
HDI structures1+N+1, 2+N+2, 3+N+3, any-layer (every-layer interconnect)
Laser microvia diameter0.1 mm (4 mil)  · finer on advanced builds
Microvia capture padfrom ~0.25 mm
Microvia typesStacked, staggered & skip vias
Via fillCopper-filled & stacked · resin-filled, capped & planarized (via-in-pad / VIPPO)
Build-upSequential lamination · multiple build-up layers
Min. blind / buried via0.1 mm (within 1–18 layers)
Aspect ratioThrough-hole up to ~10:1

Lines, spacing & holes

ParameterMass productionPrototype (extended)
Min. inner-layer clearance3 mil3 mil
Min. line width3 mil (0.075 mm)3 mil (0.075 mm)
Min. line space3 mil (0.075 mm)3 mil (0.075 mm)
Min. mechanical hole0.1 mm0.1 mm
Min. plated hole copper25 µm25 µm
PTH dia. tolerance±0.076 mm (±3 mil)±0.076 mm (±3 mil)
NPTH dia. tolerance±0.05 mm (±2 mil)±0.05 mm (±2 mil)
Hole position deviation±0.05 mm (±2 mil)±0.05 mm (±2 mil)

Layers, copper & legend

ParameterMass productionPrototype (extended)
Layer count (overall build)1–24 layers1–78 layers
Heavy copper4 oz (140 µm)up to 12 oz
Min. solder-mask bridge0.1 mm (4 mil)0.1 mm (4 mil)
Solder-mask colourGreen, Black, Blue, White, Yellow, RedGreen, Black, Blue, White, Yellow, Red
Silkscreen colourWhite, Yellow, Red, BlackWhite, Yellow, Red, Black
ENIG ENEPIG OSP Immersion Silver / Tin Hard Gold

Outline & mechanical

ParameterMass productionPrototype (extended)
Outline methodRouting, V-groove, beveling, punchRouting, V-groove, beveling, punch
Outline tolerance±0.15 mm (±6 mil)±0.15 mm (±6 mil)
Peelable maskTop, bottom, double-sidedTop, bottom, double-sided

Electrical & reliability

ParameterMass productionPrototype (extended)
Controlled impedance±10%±7%
Insulation resistance1 × 10¹² Ω (normal)1 × 10¹² Ω (normal)
Through-hole resistance< 300 Ω (normal)< 300 Ω (normal)
Thermal shock3 × 10 sec @ 288 ℃3 × 10 sec @ 288 ℃
Warp & twist≤ 0.7%≤ 0.7%
Electric strength> 1.3 kV/mm> 1.4 kV/mm
Flammability94V-094V-0
Test voltage50–330 V50–330 V

Have an HDI board to build?

Send your Gerbers, stackup and via map — our engineers confirm manufacturability against this spec and reply with a quote, usually within 24 hours, plus a free DFM review.

Send your inquiry Get a quote
Beyond the basics

Advanced & high-end HDI processes

The build-up, via and fine-line toolkit for the most demanding miniaturized and high-speed designs.

Any-layer HDI

Every-layer interconnect with stacked copper-filled microvias for the highest routing density and shortest paths.

i-VPD / any-layer

Stacked & filled microvias

Copper-filled, stacked or staggered laser microvias for reliable layer-to-layer transitions under fine-pitch parts.

Cu-filled

Via-in-pad (VIPPO)

Resin-filled, capped and planarized vias directly in the pad for fine-pitch BGA and tight component areas.

Plated over

Sequential lamination

Multiple build-up cycles to create complex 2+N+2, 3+N+3 and higher HDI stackups.

Multi build-up

Fine line / mSAP

Modified semi-additive process for ultra-fine lines and spaces beyond standard subtractive etching.

≤ 3 mil

High-speed & impedance

Low-loss materials, back drilling and controlled impedance for high-frequency and high-speed digital designs.

To ±7%

Materials

Laminates and build-up films for HDI and high-speed applications:

High-Tg FR4 (150 / 170)Low-loss / low-Dk (e.g. Megtron)High-frequency (Rogers) Halogen-freeRCC / build-up filmThin-core laminates
Quality & compliance

Standards we build & test to

HDI boards are designed to IPC-2226 and qualified to IPC-6016 for the microvia / build-up construction, with IPC-6012 and IPC-A-600 for the board — all under one quality system.

IPC-2226HDI design spec
IPC-6016HDI qualification
IPC-6012Rigid board
IPC-A-600Board acceptability
IPC-A-610Assembly Class 2/3
ISO 9001Quality management
UL · 94V-0Listed
RoHS / REACHEU compliant
ISO 13485Medical-capable
IATF / AS9100Auto & aero capable
AOI Flying-probe / E-test Impedance (TDR) X-ray Thermal stress Microsection
Send your inquiry

Get an HDI PCB quote in 24 hours

Tell us about your HDI board and our engineers reply with pricing, lead time and a free design-for-manufacturing review — no obligation, NDA on request.

  • Gerbers + drill, stackup and a via map (which layers each via spans).
  • HDI structure (1+N+1, 2+N+2, any-layer), layer count and quantity.
  • Material, finish & impedance requirements, plus any via-in-pad needs.

HDI PCB inquiry

Reply within 24 hours · free DFM review
or
Upload Gerber files →
Submitting opens your email app with the details prefilled. Files are attached on the upload page.
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Answers

HDI PCB capability — FAQ

The full range — 1+N+1, 2+N+2, 3+N+3 and any-layer (every-layer interconnect) — using laser microvias, sequential lamination and stacked or staggered via constructions.

Laser microvias down to 0.1 mm (4 mil), with finer diameters on advanced builds, and line width / space down to 3 mil (0.075 mm). Blind and buried vias are supported within 1–18 layers.

Yes — copper-filled and stacked microvias, and resin-filled, capped and planarized via-in-pad (VIPPO) for fine-pitch BGA fan-out, with controlled impedance and high-speed materials available.

Designed to IPC-2226 and qualified to IPC-6016 for the HDI / microvia construction, and IPC-6012 with IPC-A-600 for the board, under an ISO 9001 system. They can be produced UL, RoHS and REACH compliant, with ISO 13485, IATF 16949 and AS9100 support.

Use the inquiry form above or upload your Gerbers, stackup and via map on our contact page. We reply with a quote — usually within 24 hours — plus a free DFM review.

Let's build your HDI board.

From a 1+N+1 build-up to a full any-layer stackup — send your files and get a quote with a free DFM review, usually within 24 hours.

Send your inquiry All capabilities

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.