Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Rigid PCB Capabilities | Up to 78 Layers, 3 mil Lines, IPC Class 3 — PCBSync
Capabilities  ›  Rigid PCB
Capabilities · Rigid PCB

Rigid PCB Capabilities,
from prototype to 78 layers.

The full process window of our 5,000㎡ Shenzhen factory — fine lines, heavy copper, tight impedance and advanced materials, all built and inspected to IPC Class 2 & 3.

Send an inquiry View full spec
IPC-6012 Class 2 & 3IPC-A-600UL · RoHS · 94V-01–78 layers
Multilayer rigid stackup
Solder mask Copper foil ≤ 12 oz FR4 core · Tg ≤ 170 Prepreg Plated through-hole · Ø 0.1 mm
1–78
Layers
3 mil
Min line / space
0.1 mm
Min hole
12 oz
Heavy copper
±7%
Impedance ctrl
8.5 mm
Max thickness
Process capability

Rigid PCB specifications

Two capability tiers — Mass Production for repeatable, high-yield volume, and an extended Prototype window for pushing the limits. Need something beyond these? Ask us — we build to spec.

Layers & dimensions

ParameterMass productionPrototype (extended)
Layer count1–24 layers1–78 layers
Max. panel size600 × 770 mm (23.62″ × 30.31″)600 × 770 mm & 500 × 1200 mm (19.69″ × 47.24″)
Max. board thickness8.5 mm8.5 mm
Min. board thickness2L: 0.3 mm · 4L: 0.4 mm · 6L: 0.8 mm2L: 0.1 mm · 4L: 0.3 mm · 6L: 0.6 mm

Lines & spacing

ParameterMass productionPrototype (extended)
Min. inner-layer clearance3 mil3 mil
Min. line width3 mil (0.075 mm)3 mil (0.075 mm)
Min. line space3 mil (0.075 mm)3 mil (0.075 mm)

Holes & vias

ParameterMass productionPrototype (extended)
Min. hole size0.1 mm0.1 mm
Min. plated hole copper25 µm25 µm
Min. blind / buried via0.1 mm0.1 mm (1–18 layers)
PTH dia. tolerance±0.076 mm (±3 mil)±0.076 mm (±3 mil)
NPTH dia. tolerance±0.05 mm (±2 mil)±0.05 mm (±2 mil)
Hole position deviation±0.05 mm (±2 mil)±0.05 mm (±2 mil)

Copper, solder mask & legend

ParameterMass productionPrototype (extended)
Heavy copper4 oz (140 µm)up to 12 oz
Min. solder-mask bridge0.1 mm (4 mil)0.1 mm (4 mil)
Solder-mask colourGreen, Black, Blue, White, Yellow, RedGreen, Black, Blue, White, Yellow, Red
Silkscreen colourWhite, Yellow, Red, BlackWhite, Yellow, Red, Black
Peelable maskTop, bottom, double-sidedTop, bottom, double-sided
HASL / Lead-free HASL ENIG ENEPIG OSP Immersion Silver / Tin Hard Gold / Gold fingers

Outline & mechanical

ParameterMass productionPrototype (extended)
Outline methodRouting, V-groove, beveling, punchRouting, V-groove, beveling, punch
Outline tolerance±0.15 mm (±6 mil)±0.15 mm (±6 mil)

Electrical & reliability

ParameterMass productionPrototype (extended)
Controlled impedance±10%±7%
Insulation resistance1 × 10¹² Ω (normal)1 × 10¹² Ω (normal)
Through-hole resistance< 300 Ω (normal)< 300 Ω (normal)
Thermal shock3 × 10 sec @ 288 ℃3 × 10 sec @ 288 ℃
Warp & twist≤ 0.7%≤ 0.7%
Electric strength> 1.3 kV/mm> 1.4 kV/mm
Peel strength1.4 N/mm1.4 N/mm
Solder-mask abrasion> 6H> 6H
Flammability94V-094V-0
Test voltage50–330 V50–330 V

Have a rigid board to build?

Send your Gerbers and stackup — our engineers confirm manufacturability against this spec and reply with a quote, usually within 24 hours, plus a free DFM review.

Send your inquiry Get a quote
Beyond the basics

Advanced & high-end rigid processes

When your design pushes the envelope, our advanced process toolkit keeps it manufacturable and reliable.

HDI & any-layer

Laser-drilled microvias, stacked & staggered vias and sequential lamination for dense, high-pin-count designs.

Blind/buried to 18+ layers

Heavy copper

High-current and thermal designs with thick inner and outer copper, mixed with fine-line layers.

Up to 12 oz

Controlled impedance

Single-ended and differential impedance with stackup design support and TDR verification.

Tolerance to ±7%

Back drilling

Removal of via stubs for clean high-speed signal paths in thick multilayer boards.

High-speed designs

Via-in-pad & filling

Resin- or copper-filled, capped and planarized vias for fine-pitch BGA fan-out.

Plugged & plated over

Edge & half-hole plating

Castellated / half-plated holes and plated edges for board-to-board and module mounting.

Castellation

Base materials

A broad laminate range for standard to demanding applications:

FR4 standard (Tg 130)High-Tg FR4 (Tg 150 / 170)Halogen-free High-CTIHigh-frequency (Rogers, Taconic, etc.)High-speed low-loss Polyimide (high-temp)Metal-backed / thermal
Quality & compliance

Standards we build & test to

Every rigid board is fabricated, inspected and documented to recognized industry standards.

IPC-6012Rigid board · Class 2 & 3
IPC-A-600Acceptability of boards
ISO 9001Quality management
ULListed · 94V-0
RoHS / REACHEU compliant
ISO 13485Medical-capable
IATF 16949Automotive-capable
AS9100Aerospace-capable
TraceabilityLot & date control
J-STD-001Soldering-ready
AOI Flying-probe / E-test Impedance (TDR) X-ray Thermal stress Microsection
Send your inquiry

Get a rigid PCB quote in 24 hours

Tell us about your board and our engineers reply with pricing, lead time and a free design-for-manufacturing review — no obligation, NDA on request.

  • Gerbers (RS-274X) + NC drill and your stackup / layer count.
  • Quantity, material, finish, copper weight and any special process.
  • Impedance or other controlled requirements, if any.

Rigid PCB inquiry

Reply within 24 hours · free DFM review
or
Upload Gerber files →
Submitting opens your email app with the details prefilled. Files are attached on the upload page.
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Related capabilities

All CapabilitiesFull factory spec Multilayer PCB4 to 78 layers HDI PCBMicrovia & build-up PCB ManufacturingFabrication services PCB Manufacturing CostWhat drives the price Get a QuoteFabrication quote in 24h
Answers

Rigid PCB capability — FAQ

1–24 layers in mass production and up to 78 layers for prototypes and advanced builds, including blind, buried and HDI structures.

Down to 3 mil (0.075 mm) line width and space, and a minimum hole of 0.1 mm with at least 25 µm of plated copper in the barrel.

Yes — heavy copper up to 12 oz, and controlled impedance to ±10% in mass production or ±7% on advanced builds, with TDR verification and stackup support.

Fabricated and inspected to IPC-A-600 and IPC-6012 Class 2 and 3 under an ISO 9001 system, and produced UL listed, RoHS, REACH and 94V-0 compliant, with ISO 13485, IATF 16949 and AS9100 support.

Use the inquiry form above or upload your Gerbers on our contact page. We reply with a quote — usually within 24 hours — plus a free DFM review.

Let's build your rigid PCB.

From a 2-layer prototype to a 78-layer high-end board — send your files and get a quote with a free DFM review, usually within 24 hours.

Send your inquiry All capabilities

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.