Upgrade your electronic designs with the PCBSync HDI Rigid-Flex PCB with FR4 Stiffener and ENIG — a premium interconnect solution built for engineers and manufacturers who demand the highest standards in flexible circuit technology.
Designed using High-Density Interconnect (HDI) technology, this rigid-flex PCB enables tighter trace routing, reduced layer counts, and superior signal integrity — making it ideal for space-constrained applications such as medical devices, aerospace systems, wearables, and advanced consumer electronics.
The integrated FR4 stiffener provides targeted mechanical reinforcement to connector zones and component areas, preventing flex fatigue, maintaining proper alignment during assembly, and extending the overall lifespan of the board under repeated bending cycles.
Finished with ENIG (Electroless Nickel Immersion Gold), the PCBSync rigid-flex board delivers a flat, solderable surface with excellent oxidation resistance. ENIG ensures consistent pad coplanarity for fine-pitch SMT components, reliable wire bonding, and long-term shelf stability — critical for high-reliability production environments.
Key Features:
- HDI rigid-flex construction for compact, lightweight designs
- FR4 stiffener for mechanical support and durability
- ENIG surface finish for superior solderability and corrosion resistance
- Fine-pitch via-in-pad and blind/buried via capability
- RoHS compliant materials
- Custom layer stack-up available on request
Whether you’re prototyping a next-generation wearable or scaling up production for industrial electronics, the PCBSync HDI Rigid-Flex PCB delivers the performance, precision, and reliability your project requires.
Request a custom quote today and let our engineering team support your next design challenge.
