Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Learn More

Our customer service ready for your PCB

Sales@PCBsync.com

Prototype Assembly

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

- Maria Rodriguez CTO

Electronic Manufacturing

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

- Ben Carter Operations Director

HDI PCB Gerber Review – Microvia DRC & DFM Check

Product Details

Our comprehensive HDI PCB Gerber Review evaluates your High-Density Interconnect designs to ensure structural integrity and manufacturability. Engineered for hardware developers and procurement managers, this service performs an in-depth analysis of your manufacturing data. By executing precise microvia DRC and DFM checks, we identify potential fabrication bottlenecks, impedance mismatch risks, and layer stack-up discrepancies before the physical board build commences.

Microvia Validation: Detailed Design Rule Checks (DRC) for blind, buried, and staggered microvia structures.
DFM Verification: Thorough Design for Manufacturability analysis referencing current IPC standards.
Layer Stack-up Analysis: Impedance calculation verification, copper weight assessment, and material compatibility checks.
Clearance & Annular Ring Checks: Precise evaluation of trace widths, spacing, and pad-to-hole ratios for high-density layouts.
Actionable Reporting: Comprehensive feedback highlighting specific design adjustments required for successful fabrication.