Achieve next-level circuit performance with the PCBSync 12-Layer Rigid-Flex PCB, the premium choice for engineers demanding precision, reliability, and longevity in aerospace, medical devices, military electronics, and high-end consumer applications.
Superior 12-Layer Stackup for Complex Designs Our 12-layer rigid-flex architecture combines the structural stability of rigid PCB zones with the dynamic flexibility of polyimide flex sections — enabling 3D packaging, reduced connector counts, and streamlined assembly. Whether you’re designing compact wearables or ruggedized industrial controllers, this stackup supports high-density interconnects (HDI) with controlled impedance routing up to 100Ω differential pairs.
ENEPIG Surface Finish — The Gold Standard Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) surface finish delivers exceptional wire bondability, solderability, and corrosion resistance. Unlike HASL or OSP alternatives, ENEPIG eliminates the “black pad” defect associated with standard ENIG, making it ideal for both SMT components and wire bonding applications. Extended shelf life ensures board integrity across long storage cycles.
Key Specifications:
- Layers: 12 (Rigid-Flex Hybrid)
- Surface Finish: ENEPIG (RoHS Compliant)
- Min. Trace/Space: 3/3 mil
- Board Thickness: Customizable (0.8mm–3.2mm rigid zones)
- Flex Material: Polyimide (PI)
- IPC Class: 2 / Class 3 available
- Lead Time: 5–10 business days
Why Choose PCBSync? PCBSync manufactures to IPC-6013 standards with 100% AOI, X-ray inspection, and electrical testing on every panel. Request a free DFM review with every order.
Order today and receive a dedicated engineering support consultation.
