Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

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Sales@PCBsync.com

Prototype Assembly

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

- Maria Rodriguez CTO

Electronic Manufacturing

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

- Ben Carter Operations Director

Buried + Blind Via HDI PCB – Combined Microvia Stackup

Product Details

The Buried + Blind Via HDI PCB delivers superior routing density and thermal performance for complex, space-critical electronic designs. By utilizing a combined microvia stackup, this high-density interconnect board allows engineers to interconnect multiple layers without consuming valuable surface real estate. It is specifically engineered for high-speed digital designs, RF modules, and fine-pitch BGA components where structural integrity and signal clarity are paramount.

Key Features of our HDI PCB Stackup

Combined Microvia Architecture: Utilizes laser-drilled blind vias and mechanical buried vias to maximize routing density across multi-layer designs.
Advanced Materials: Available in High-Tg FR-4, halogen-free materials, and low-loss high-speed laminates (such as Rogers or Megtron).
Fine Line and Space: Supports trace widths and spacing down to 3 mil (75 µm) for high-density BGA escapes.
Via-in-Pad Technology: Resin-filled and copper-capped vias (POVH) to optimize thermal dissipation and save surface area.
Compliance & Quality: Manufactured in accordance with IPC-A-600 Class 2 or Class 3 standards.

High-Density Interconnect Applications

Telecommunications: 5G network modules, high-speed routers, and switching systems.
Computing & IoT: Ultra-thin wearables, compact IoT gateways, and high-performance computing (HPC) motherboards.
Medical Devices: Handheld diagnostic equipment, implantable monitors, and high-resolution imaging systems.
Aerospace & Automotive: ADAS radar modules, engine control units (ECUs), and avionics telemetry boards.

Why Choose PCBSYNC

PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.

Partner with an experienced EMS provider for your next complex hardware deployment. Contact the PCBSYNC engineering team today to review your Gerber files or request a technical quote for your microvia stackup project.