The XCVU37P-3FSVH2892E is a premium-grade Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ HBM family. This advanced programmable logic device delivers exceptional processing power, massive memory bandwidth, and high-speed connectivity for demanding applications in data center acceleration, artificial intelligence, high-performance computing, and telecommunications infrastructure.
As a leading Xilinx FPGA solution, the XCVU37P-3FSVH2892E represents the pinnacle of FPGA technology, combining cutting-edge 16nm FinFET process technology with revolutionary High Bandwidth Memory (HBM) integration.
XCVU37P-3FSVH2892E Key Features and Benefits
Massive Logic Capacity for Complex Designs
The XCVU37P-3FSVH2892E provides extraordinary logic resources that enable implementation of the most complex digital designs. With approximately 2.85 million system logic cells, this FPGA offers sufficient capacity for demanding applications that require extensive parallel processing and sophisticated algorithm implementation.
Integrated High Bandwidth Memory (HBM) Technology
One of the most significant advantages of the XCVU37P-3FSVH2892E is its integrated 8GB High Bandwidth Memory (HBM Gen2). This revolutionary architecture delivers up to 460 GB/s of memory bandwidth, providing 20X more bandwidth than traditional DDR4 DIMM solutions. The integrated HBM controller and switch reduce logic size by approximately 250K LUTs while minimizing development time.
Superior DSP Processing Performance
With 3,096 DSP slices optimized for both fixed and floating-point operations, the XCVU37P-3FSVH2892E delivers exceptional digital signal processing capabilities. These resources enable efficient implementation of complex arithmetic functions, making this device ideal for AI inference, video transcoding, and signal processing applications.
XCVU37P-3FSVH2892E Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCVU37P-3FSVH2892E |
| Family |
Virtex UltraScale+ HBM |
| Process Technology |
16nm FinFET |
| System Logic Cells |
~2,851,800 |
| CLB Flip-Flops |
2,607,360 |
| Look-Up Tables (LUTs) |
~1,303,680 (6-input) |
| DSP Slices |
3,096 |
| Total On-Chip RAM |
70.9 Mb |
| HBM Capacity |
8 GB |
| HBM Bandwidth |
Up to 460 GB/s |
| User I/O |
624 |
| Speed Grade |
-3 (Highest Performance) |
| Package |
2892-Pin FCBGA |
XCVU37P-3FSVH2892E Memory Resources
| Memory Type |
Capacity |
| Block RAM (36Kb each) |
2,016 blocks |
| UltraRAM (288Kb each) |
960 blocks |
| Total Block RAM |
70.9 Mb |
| Integrated HBM |
8 GB |
| HBM Memory Bandwidth |
460 GB/s |
High-Speed Connectivity and Transceiver Specifications
| Interface |
Specification |
| GTY Transceivers |
64 |
| Transceiver Speed |
Up to 32.75 Gbps |
| PCIe Support |
Gen3 x16 / Gen4 x8 |
| 100G Ethernet MAC |
Integrated |
| Interlaken |
150G Support |
| CCIX |
Cache Coherent Interconnect Support |
Electrical and Environmental Specifications
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.825V ~ 0.876V |
| Operating Temperature |
0°C to 100°C (Junction) |
| Mounting Type |
Surface Mount |
| Package Type |
Flip Chip Ball Grid Array (FCBGA) |
| Ball Count |
2892 |
| Ball Pitch |
1.0 mm |
| RoHS Status |
RoHS3 Compliant |
| Lead-Free |
Yes |
| Moisture Sensitivity Level |
MSL 3 (168 Hours) |
Target Applications for XCVU37P-3FSVH2892E
Data Center Acceleration
The XCVU37P-3FSVH2892E excels in data center environments where massive memory bandwidth and processing power are essential. The integrated HBM eliminates bottlenecks associated with external memory, enabling higher throughput for database acceleration, search applications, and data warehousing operations.
Artificial Intelligence and Machine Learning
With its exceptional memory bandwidth and DSP resources, this FPGA provides an ideal platform for AI inference workloads. The device can store and access entire machine learning models without external memory access, significantly improving inference performance while reducing power consumption.
High-Performance Computing (HPC)
The combination of massive logic capacity, high-speed transceivers, and integrated HBM makes the XCVU37P-3FSVH2892E suitable for scientific computing, financial modeling, and other computationally intensive applications.
Network and Security Appliances
The FPGA’s high-speed connectivity options and processing capabilities enable implementation of next-generation firewalls, network analyzers, and high-throughput packet processing systems.
Video Processing and Transcoding
With support for high-bandwidth data movement and extensive DSP resources, this device handles demanding video processing workloads including real-time transcoding and image processing applications.
Development Tools and Software Support
The XCVU37P-3FSVH2892E is fully supported by AMD’s Vivado Design Suite, providing comprehensive development tools for synthesis, implementation, and debugging. The VCU128 evaluation board offers a complete hardware platform for prototyping and development.
Why Choose the XCVU37P-3FSVH2892E?
The -3 speed grade designation indicates this is the highest-performance variant in the XCVU37P family, offering maximum clock frequencies and fastest timing specifications. This makes it the optimal choice for applications requiring peak performance without compromise.
The integration of HBM directly within the package using advanced stacked silicon interconnect (SSI) technology provides significant advantages over traditional discrete memory solutions, including reduced PCB complexity, lower power consumption, and dramatically improved memory bandwidth.
Ordering Information
| Part Number |
Description |
| XCVU37P-3FSVH2892E |
Virtex UltraScale+ HBM FPGA, Speed Grade -3, 2892-Pin FCBGA, Extended Temperature |
| XCVU37P-2FSVH2892E |
Virtex UltraScale+ HBM FPGA, Speed Grade -2, 2892-Pin FCBGA |
| XCVU37P-1FSVH2892E |
Virtex UltraScale+ HBM FPGA, Speed Grade -1, 2892-Pin FCBGA |
The XCVU37P-3FSVH2892E represents AMD’s commitment to delivering the most advanced programmable logic solutions for the most demanding applications. With its unparalleled combination of processing power, memory bandwidth, and connectivity options, this FPGA enables engineers to create next-generation systems that push the boundaries of what’s possible in data center, AI, and high-performance computing applications.
