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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XCF02SVOG20C: Platform Flash Configuration PROM for FPGA Applications

Product Details

The XCF02SVOG20C is a high-performance 2Mbit Platform Flash In-System Programmable (ISP) configuration PROM manufactured by AMD (formerly Xilinx). Designed specifically for Xilinx FPGA configuration storage, this non-volatile memory device provides reliable and reprogrammable bitstream storage for FPGA applications across industrial, automotive, and embedded systems.

Product Overview: XCF02SVOG20C Configuration Memory

The XCF02SVOG20C belongs to the Platform Flash XCFxxS series, offering 2 megabits of flash memory in a compact 20-pin TSSOP package. This configuration PROM enables FPGA designers to store and load configuration data efficiently, ensuring consistent device behavior across power cycles.

Key Product Specifications

Specification Value
Part Number XCF02SVOG20C
Manufacturer AMD (formerly Xilinx Inc.)
Memory Density 2 Mbit (256KB)
Package Type 20-TSSOP (Thin Shrink Small Outline Package)
Package Dimensions 0.173″ / 4.40mm Width
Mounting Type Surface Mount
RoHS Compliance Yes, Lead-Free

Electrical Characteristics

Parameter Specification
Supply Voltage (VCCINT) 3.3V (3.0V – 3.6V)
I/O Voltage (VCCO) Range 1.8V – 3.3V
Operating Temperature -40°C to +85°C (Industrial Grade)
Programming Voltage 3.3V (In-System via JTAG)
Data Retention 20 Years Minimum

Technical Features of XCF02SVOG20C

In-System Programmability

The XCF02SVOG20C supports JTAG-based in-system programming, allowing engineers to update FPGA configuration bitstreams without removing the device from the circuit board. This feature significantly reduces development time and enables field updates.

Configuration Modes Supported

Configuration Mode Support Status
Master Serial Mode ✓ Supported
Slave Serial Mode ✓ Supported
Parallel SelectMAP ✗ Not Supported (Available in XCFxxP series)

Memory Organization

  • Capacity: 2,097,152 bits (2Mb)
  • Organization: Optimized for serial configuration
  • Data Width: Serial output for FPGA configuration
  • Access Time: Fast serial read for rapid FPGA configuration

Applications and Use Cases

Industrial Automation Systems

The XCF02SVOG20C excels in industrial control applications where reliable FPGA configuration is critical. Its wide operating temperature range (-40°C to +85°C) ensures stable performance in harsh industrial environments.

Embedded Systems Design

Embedded system designers benefit from the compact 20-TSSOP package, which minimizes board space while providing sufficient memory for complex FPGA designs. The device is ideal for:

  • Embedded control systems
  • Data acquisition systems
  • Signal processing applications
  • Communication interfaces
  • Motor control systems

Automotive Electronics

With its industrial-grade temperature rating and robust design, the XCF02SVOG20C meets the demanding requirements of automotive applications including:

  • Engine control units (ECU)
  • Advanced driver assistance systems (ADAS)
  • Infotainment systems
  • Body control modules

Technical Advantages

Non-Volatile Storage

Unlike SRAM-based configuration storage, the XCF02SVOG20C provides true non-volatile flash memory, maintaining configuration data through power cycles without requiring external battery backup.

Low Power Consumption

The 3.3V operation voltage and efficient flash architecture minimize power consumption, making it suitable for battery-powered and energy-conscious applications.

High Reliability

  • Endurance: 10,000 program/erase cycles minimum
  • Data Retention: 20+ years at 85°C
  • ESD Protection: Industry-standard protection levels

Pin Configuration and Package Details

20-TSSOP Package Benefits

Feature Benefit
Compact Footprint Reduces PCB area requirements
Surface Mount Compatible with automated assembly
0.65mm Pitch Standard industry spacing
Low Profile Suitable for space-constrained designs

Key Pin Functions

  • JTAG Interface: TDI, TDO, TMS, TCK for programming
  • Serial Output: DOUT for FPGA configuration
  • Power Pins: VCC, GND for device operation
  • Control Signals: CE, OE for device control

Compatibility and Integration

Compatible Xilinx FPGA Families

The XCF02SVOG20C works seamlessly with various Xilinx FPGA families:

  • Spartan Series
  • Virtex Series
  • Artix Series
  • Kintex Series (with appropriate interface)

Programming Tools Required

  • Xilinx Platform Cable USB
  • Xilinx ISE Design Suite or Vivado Design Suite
  • JTAG programming interface
  • Compatible boundary-scan software

Design Considerations

PCB Layout Guidelines

When integrating the XCF02SVOG20C into your design:

  1. Decoupling Capacitors: Place 0.1µF ceramic capacitors close to VCC pins
  2. JTAG Signal Integrity: Keep JTAG traces short and matched length
  3. Configuration Signals: Route serial configuration lines with controlled impedance
  4. Thermal Management: Ensure adequate thermal vias for heat dissipation

Power Supply Design

  • Provide clean, stable 3.3V supply with <100mV ripple
  • Include bulk capacitors (10µF) for power supply stability
  • Consider dedicated voltage regulator for sensitive applications

Ordering Information and Availability

Part Number Breakdown

XCF02SVOG20C

  • XCF: Platform Flash family
  • 02S: 2Mbit, 3.3V version
  • VO: TSSOP package type
  • G: Green (RoHS compliant, lead-free)
  • 20: 20-pin package
  • C: Commercial temperature grade

Package Options

Part Number Package Temperature Grade
XCF02SVOG20C 20-TSSOP Commercial (-40°C to +85°C)
XCF02SVOG20I 20-TSSOP Industrial (-40°C to +85°C)

Comparison with Related Products

XCFxxS Series Comparison

Part Number Density Package Options Target Application
XCF01SVOG20C 1 Mbit 20-TSSOP Small FPGAs
XCF02SVOG20C 2 Mbit 20-TSSOP Medium FPGAs
XCF04SVOG20C 4 Mbit 20-TSSOP Large FPGAs

Alternative: XCFxxP Series

For applications requiring parallel configuration or higher densities (8Mb, 16Mb, 32Mb), consider the XCFxxP series with 1.8V operation and 48-pin packages.

Quality and Compliance

Certifications and Standards

  • RoHS Compliant: Lead-free, environmentally friendly
  • REACH Compliant: European chemical safety standards
  • MSL Rating: Moisture Sensitivity Level 3
  • ESD Rating: HBM Class 2 (>2kV)

Manufacturing Quality

AMD (Xilinx) maintains strict quality control with:

  • ISO 9001 certified manufacturing
  • Automotive-grade quality standards available
  • Comprehensive reliability testing
  • Full traceability and date code marking

Getting Started with XCF02SVOG20C

Design Resources

  1. Datasheet: Complete electrical specifications and timing diagrams
  2. Application Notes: FPGA configuration design guidelines
  3. Reference Designs: Example schematics and PCB layouts
  4. Software Tools: Xilinx ISE/Vivado programming utilities

Programming Workflow

  1. Generate FPGA bitstream file (.bit or .mcs)
  2. Connect JTAG programmer to target board
  3. Open Xilinx iMPACT or Vivado Hardware Manager
  4. Select XCF02SVOG20C device
  5. Load configuration file
  6. Program and verify device
  7. Test FPGA configuration

Frequently Asked Questions

What is the difference between XCF02S and XCF02P?

The XCF02S operates at 3.3V and supports serial configuration modes, while the XCF02P operates at 1.8V and adds support for parallel SelectMAP configuration with higher densities.

Can I reprogram the XCF02SVOG20C in-circuit?

Yes, the device supports JTAG-based in-system programming, allowing unlimited reprogramming cycles (minimum 10,000 program/erase cycles guaranteed).

What FPGAs are compatible with 2Mbit configuration PROMs?

The 2Mbit capacity supports FPGAs with bitstreams up to 2 million bits, typically covering small to medium-sized FPGAs in the Spartan and Artix families.

Is the XCF02SVOG20C suitable for automotive applications?

Yes, the industrial temperature grade (-40°C to +85°C) and robust design make it suitable for many automotive applications. Automotive-grade versions may be available for safety-critical systems.

Summary: Why Choose XCF02SVOG20C?

The XCF02SVOG20C Platform Flash Configuration PROM offers the ideal combination of:

  • ✓ Reliable 2Mbit non-volatile storage
  • ✓ Compact 20-TSSOP surface mount package
  • ✓ JTAG in-system programmability
  • ✓ Industrial temperature range (-40°C to +85°C)
  • ✓ Low power 3.3V operation
  • ✓ RoHS compliant, lead-free construction
  • ✓ High endurance and data retention
  • ✓ Seamless integration with Xilinx FPGAs

Whether you’re designing industrial control systems, embedded applications, or automotive electronics, the XCF02SVOG20C provides a proven, cost-effective solution for FPGA configuration storage.

Purchase and Support

For procurement inquiries, technical support, or design consultation regarding the XCF02SVOG20C, contact authorized distributors including Digi-Key, Mouser, and other leading electronics suppliers. Comprehensive technical documentation and design support are available through AMD’s official channels.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.