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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7Z045-1FFG900I: The High-Performance Dual-Core Zynq-7000 SoC with Kintex-7 FPGA Fabric

Product Details

Product Overview

The XC7Z045-1FFG900I is a flagship member of AMD Xilinx’s Zynq®-7000 family, representing one of the most powerful All Programmable SoC (AP SoC) solutions available in the mid-range segment -10. This device integrates a dual-core ARM® Cortex®-A9 MPCore™ processing system with a high-density Kintex™-7 FPGA fabric on a single chip, delivering unprecedented levels of performance, flexibility, and system integration -1-2.

Designed for demanding applications such as telecommunications infrastructure, 5G technology, artificial intelligence, cloud computing, industrial control, and medical equipment, the XC7Z045-1FFG900I combines software programmability with hardware acceleration capabilities -2. Its industrial temperature range of -40°C to +100°C ensures reliable operation in the most challenging environments -1-3.

The device is housed in a 900-ball FCBGA package measuring 31mm x 31mm, providing extensive I/O connectivity and signal integrity for complex system designs -1-5. Whether you’re developing advanced driver assistance systems, high-speed networking equipment, or sophisticated industrial automation controllers, this SoC offers the processing power and hardware customization needed for truly differentiated products.


Technical Specifications

Parameter Specification
Manufacturer AMD Xilinx
Part Number XC7Z045-1FFG900I
Product Family Zynq®-7000
Architecture MCU + FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ -1
CPU Speed 667MHz -1-2
FPGA Equivalent Kintex™-7 -1-10
Logic Cells 350,000 -1-3
Look-Up Tables (LUTs) 218,600 -2-10
Flip-Flops 437,200 -2-10
Block RAM 19.2Mb (545 x 36Kb blocks) -2-10
DSP Slices 900 (18×25 MACCs) -2-10
Peak DSP Performance 1,334 GMACs (Symmetric FIR) -2
L1 Cache 32KB Instruction / 32KB Data per core -10
L2 Cache 512KB (shared) -10
On-Chip Memory (OCM) 256KB -1-5
Number of I/Os 130 -1-2
Package Type 900-BBGA, FCBGA -1
Package Size 31mm x 31mm -1-5
Ball Pitch 1.0mm -5
Operating Temperature -40°C ~ 100°C (TJ) -1-3
Peripherals DMA -1
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG -1-3
RoHS Status ROHS3 Compliant -1
MSL Level 4 (72 Hours) -1
ECCN 3A991D -1

Key Features and Benefits

High-Performance Dual-Core Processing System (PS)

The XC7Z045-1FFG900I features a dual-core ARM Cortex-A9 processor running at 667MHz -1-2. Each core delivers 2.5 DMIPS/MHz and includes NEON™ media processing engine, vector floating-point unit, and supports both single and double-precision floating-point operations -10. The TrustZone® security technology and Thumb-2 instruction set enable secure, code-efficient operation.

High-Capacity Kintex-7 Programmable Logic (PL)

The Kintex-7 FPGA fabric provides 350,000 logic cells, 218,600 LUTs, and 437,200 flip-flops, offering exceptional hardware programmability for implementing custom accelerators, high-speed interfaces, and co-processors -2-10. With 900 DSP slices, this SoC delivers massive parallel processing capability ideal for signal processing, machine learning, and video analytics workloads -2-10.

The 19.2Mb of block RAM provides ample on-chip storage for data buffering and caching -2-10.

Rich Connectivity and Peripherals

The device includes extensive I/O capabilities: 2x tri-mode Gigabit Ethernet, 2x USB 2.0 (OTG), 2x CAN 2.0B, 2x I²C, 2x SPI, 2x UART, 2x SD/SDIO controllers, and four 32-bit GPIO banks -10. The 130 user I/Os provide ample connectivity for external peripherals and system expansion -1.

Advanced Security Features

Security features include RSA-based authentication, AES-256 decryption, SHA-256 data authentication, and secure boot capabilities for both the processing system and programmable logic -10. Anti-tamper technology helps protect sensitive intellectual property and system integrity.

Industrial-Grade Reliability

With an operating temperature range of -40°C to +100°C, the XC7Z045-1FFG900I is qualified for industrial and harsh-environment applications -1-3. The device is available with extended temperature range support, making it suitable for automotive, aerospace, and defense applications.

Flexible Power Management

Separate power domains for the PS and PL enable intelligent power management, allowing users to power down the programmable logic when not required. The 28nm high-performance/low-power (HPL) process delivers industry-leading performance-per-watt.


Applications

Application Area Use Cases
Telecommunications 5G baseband processing, LTE radio, small cell base stations, networking equipment -2-3
Artificial Intelligence Machine learning inference, neural network acceleration, deep learning -2
Cloud Computing Data acceleration, server offload, storage controllers -2
Industrial Automation Robotics, motor control, industrial networking, machine vision -3
Automotive Advanced driver assistance (ADAS), driver information, infotainment -3
Medical Diagnostics, imaging, endoscopy, patient monitoring -2
Aerospace & Defense Radar processing, secure communications, avionics -3
Consumer Electronics Wireless technology, high-end consumer devices -2

Why Choose the XC7Z045-1FFG900I?

  • Highest Performance in Zynq-7000 Portfolio: The Kintex-7 FPGA fabric offers the best combination of performance, density, and cost -10

  • Dual-Core Processing Power: The dual-core ARM Cortex-A9 delivers exceptional software processing capability

  • Massive DSP Resources: 900 DSP slices provide industry-leading signal processing performance -2

  • Single-Chip Integration: Eliminates the need for separate processor, FPGA, and interface chips, reducing BOM cost and board space

  • Design Flexibility: Customize hardware in the PL and software in the PS to create truly differentiated products

  • Proven Reliability: Industrial temperature range and automotive-grade quality ensure reliable operation in harsh environments -3

  • Industry-Standard Tools: Supported by the AMD Vivado™ Design Suite, Vitis™ unified software platform, and extensive ARM ecosystem


Ordering Information

Parameter Details
Part Number XC7Z045-1FFG900I
Availability Active – In Production -1
Lead Time Please consult PCBSync for current lead times
Condition New Original Components
RoHS ROHS3 Compliant -1

Contact PCBSync for Pricing and Availability

For volume pricing, lead time, date code, and country of origin information for the XC7Z045-1FFG900I, please contact our sales team. PCBSync is your trusted source for Xilinx FPGA and other programmable logic solutions, offering competitive pricing and reliable supply for both prototyping and production volumes.


PCBSync – formerly RayPCB – is now fully integrated to serve all your electronic component needs with the same dedication and quality you’ve come to expect.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.