Product Overview
The XC7Z007S-1CLG225C is a member of AMD Xilinx’s Zynq®-7000S family, representing the lowest-cost entry point into the scalable Zynq-7000 platform -1-2. This All Programmable SoC (AP SoC) integrates a single-core ARM® Cortex®-A9 processor with 28nm Artix®-7-based programmable logic in a compact 225-ball CSPBGA package measuring just 13mm x 13mm -3-4.
Designed for commercial temperature applications (0°C to 85°C), the XC7Z007S-1CLG225C delivers exceptional performance-per-watt while offering the flexibility to implement custom logic in hardware alongside software programmability -1-2. The device’s small footprint and 54 user I/Os provide ample connectivity for space-constrained designs, making it particularly suited for cost-sensitive commercial embedded systems where board real estate is at a premium -3-4.
Please note: This product is Non-Cancellable and Non-Returnable (NCNR) -1-2.
Technical Specifications
Key Features and Benefits
High-Performance Processing System (PS)
The XC7Z007S-1CLG225C features a single-core ARM Cortex-A9 processor running at 667MHz -1-2. The processor delivers 2.5 DMIPS/MHz per CPU and includes a NEON™ media processing engine, vector floating-point unit, and supports both single and double-precision floating-point operations -1-2. The TrustZone® security technology and Thumb-2 instruction set enable secure, code-efficient operation -1-2.
Compact Form Factor for Commercial Designs
At just 13mm x 13mm, the CLG225 package is one of the smallest available for the Zynq-7000 family -3-4. This makes the XC7Z007S-1CLG225C ideal for space-constrained commercial designs such as portable consumer devices, compact industrial controllers, and embedded vision systems where board real estate is limited. The commercial temperature range (0°C to 85°C) is optimized for standard operating environments -3-4.
Flexible Programmable Logic (PL)
The Artix-7 FPGA fabric provides 23,000 logic cells, offering hardware programmability for implementing custom accelerators, interfaces, and co-processors -3-4. With over 3,000 interconnects between the PS and PL delivering up to 100Gb/s of bandwidth, this SoC enables levels of performance that multi-chip solutions cannot match.
Rich Connectivity and Peripherals
The device includes extensive I/O capabilities: 2x tri-mode Gigabit Ethernet, 2x USB 2.0 (OTG), 2x CAN 2.0B, 2x I²C, 2x SPI, 2x UART, 2x SD/SDIO controllers, and four 32-bit GPIO banks -1-2. The 54 user I/Os provide ample connectivity for external peripherals in compact designs -3-4.
Security and Reliability
Advanced security features include RSA-based authentication, AES-256 decryption, SHA-256 data authentication, and secure boot capabilities -1-2. The commercial temperature range (0°C to 85°C) ensures reliable operation in standard commercial environments -3-4.
Power Management
Separate power domains for the PS and PL enable intelligent power management, allowing users to power down the programmable logic when not required. This flexibility, combined with the 28nm HPL process, delivers industry-leading performance-per-watt.
Applications
Why Choose the XC7Z007S-1CLG225C?
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Cost-Optimized Entry Point: The single-core Zynq-7000S device offers the lowest-cost entry into the scalable Zynq platform -1-2
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Ultra-Compact Package: The 13mm x 13mm CLG225 package is ideal for space-constrained commercial designs -3-4
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Commercial Temperature Range: 0°C to 85°C optimized for standard commercial environments -3-4
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Single-Chip Integration: Eliminates the need for separate processor and FPGA, reducing BOM cost and board space
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Design Flexibility: Customize hardware in the PL and software in the PS to create differentiated products
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Industry-Standard Tools: Supported by the AMD Vivado™ Design Suite and extensive ARM ecosystem
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Proven Reliability: Commercial temperature range ensures reliable operation in standard environments
Ordering Information
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