Engineered for the unforgiving demands of modern telecom infrastructure, the PCBSync Rogers RO3200 12-layer PCB delivers the dielectric stability, thermal endurance, and signal integrity required by 5G base stations, microwave backhaul systems, and high-frequency telecommunications equipment. Built on Rogers’ RO3200 series ceramic-filled PTFE laminate, this board pairs premium materials with precision fabrication to keep insertion loss low and performance consistent from sub-6 GHz through millimeter-wave bands.
Why the Rogers RO3200 Series Rogers RO3200 laminates are reinforced with woven fiberglass and filled with ceramic, giving designers a stable dielectric constant (Dk) and a low dissipation factor (Df) across wide temperature swings. Compared to standard FR-4, RO3200 offers significantly tighter Dk tolerance, superior mechanical strength for plated-through-hole reliability, and a coefficient of thermal expansion closely matched to copper—critical for 12-layer stack-ups exposed to repeated thermal cycling in outdoor radio units, antenna arrays, and MIMO modules.
Technical Specifications
- Material: Rogers RO3200 series high-frequency laminate
- Layer Count: 12 layers
- Board Thickness: 2.4 mm (±10%)
- Copper Weight: 2 oz on outer and inner layers (heavier copper available on request)
- Surface Finish: Hard Gold Plating, 50 microinches (50u”)
- Solder Mask: Green LPI (alternative colors available)
- Silkscreen: White, high-resolution
- Min. Trace/Space: down to 3/3 mil
- Min. Drill: 0.15 mm mechanical; laser microvias on request
- Impedance Control: ±5% (single-ended and differential)
- IPC-6012 Class 3 standard; RoHS, REACH, UL 94 V-0 compliant
Built for Signal Integrity The 2 oz copper on every layer supports high current-carrying capacity and improved thermal dissipation, while the 50 microinch hard gold plating ensures durable, low-resistance contact surfaces for edge connectors, gold fingers, and high-cycle test points. Controlled impedance routing, blind/buried via support, and back-drilled stubs are available to minimize reflections and crosstalk in dense, high-speed designs. The 12-layer construction gives engineers ample space for dedicated power, ground, RF, and digital control planes—maximizing isolation between sensitive RF chains and switching circuitry.
Designed for Telecom Applications This PCB is purpose-built for 5G massive MIMO antennas, remote radio units (RRU), small cells, microwave point-to-point links, satellite communications, and phased-array radar. It also performs reliably in test and measurement equipment, RF amplifiers, filters, couplers, and high-speed backplanes where loss tangent and dimensional stability dictate end-product performance.
Manufacturing Quality You Can Trust Every board is fabricated in IPC-certified facilities and undergoes 100% electrical testing (flying probe or fixture), AOI inspection, impedance verification, and microsection analysis on request. PCBSync supports rapid prototyping, low-volume builds, and full mass production—with complete traceability and DFM/DFA review included on every order.
Order With Confidence Upload your Gerber, ODB++, or IPC-2581 files for an instant quote. Our engineering team reviews every design for stack-up optimization, impedance targets, and Rogers-specific routing best practices before release to fabrication—ensuring your telecom hardware ships on spec and on schedule.
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