Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

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Sales@PCBsync.com

Prototype Assembly

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

- Maria Rodriguez CTO

Electronic Manufacturing

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

- Ben Carter Operations Director

Buried Via Core HDI PCB – High Routing Density Build-Up

Product Details

The Buried Via Core HDI PCB provides the essential architecture for next-generation electronic devices that demand extreme component density and processing power. By utilising buried vias within the internal core layers, this high routing density build-up frees up critical surface space, allows for finer line traces, and significantly reduces parasitic capacitance. It is the definitive choice for product developers engineering compact, multi-layered devices that cannot compromise on electrical performance or structural reliability.

Key Features of Buried Via Core HDI PCB Technology

Advanced Build-Up Structure: Utilises sequential lamination with buried and blind microvias to maximise routing layers within a reduced thickness.
High-Density Interconnects: Supports fine pitch components down to 0.4 mm BGA spacing with trace widths and spacing down to 3 mils (0.075 mm).
Premium Base Materials: Available in high-Tg FR-4, halogen-free materials, and low-loss high-frequency laminates (e.g., Rogers, Panasonic Megtron) for superior thermal stability.
Surface Finish Options: ENIG, ENEPIG, and OSP finishes ensure excellent solderability and coplanarity for fine-pitch surface mount technology (SMT).
Strict Quality Standards: Manufactured in compliance with IPC-A-600 Class 2 and Class 3 standards to ensure performance in demanding environments.

Applications

Telecommunications: High-speed routers, switches, and 5G wireless infrastructure modules.
Consumer Electronics: Premium smartphones, wearable technology, and ultra-thin computing devices.
Medical Devices: Compact diagnostic equipment, handheld imaging systems, and patient monitoring implants.
Aerospace & Automotive: Advanced driver-assistance systems (ADAS), engine control units (ECUs), and avionics telemetry boards.

Why Choose PCBSYNC

PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.

Accelerate Your Project Development

Streamline your high-density hardware design with our advanced manufacturing capabilities. Bring your layout challenges to our engineering team to review your stack-up configurations and design files. Contact PCBSYNC to request a comprehensive technical quote today.