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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7Z035-1FBG676I: The High-Performance Dual-Core Zynq-7000 SoC for Demanding Mid-Range Applications

Product Details

Product Overview

The XC7Z035-1FBG676I is a powerful mid-range member of AMD Xilinx’s Zynq®-7000 family, integrating a dual-core ARM® Cortex®-A9 MPCore™ processing system with a high-density Kintex™-7 FPGA fabric on a single chip -1-9. This All Programmable SoC (AP SoC) delivers exceptional processing power and hardware flexibility, making it ideal for complex applications in industrial automation, telecommunications, medical imaging, and aerospace -10.

With 275,000 logic cells and a 667MHz dual-core processor, the XC7Z035-1FBG676I provides the perfect balance of software programmability and hardware acceleration -1-2. Its extended industrial temperature range of -40°C to +100°C ensures reliable operation in harsh environments -2-9. The device’s 130 user I/Os and comprehensive connectivity options enable seamless integration into demanding embedded systems -1-3.


Technical Specifications

Parameter Specification
Manufacturer AMD Xilinx
Part Number XC7Z035-1FBG676I
Product Family Zynq®-7000
Architecture MCU + FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ -1
CPU Speed 667MHz -2
FPGA Logic Cells 275,000 Logic Cells (Kintex™-7 based) -1-9
L1 Cache 2 x 32KB Instruction / 2 x 32KB Data -8
L2 Cache 512KB (shared) -11
On-Chip Memory (OCM) 256KB -1
DMA Channels 8-channel DMA controller -11
DSP Slices 900 DSP slices -11
Block RAM 17.6Mb total (500 x 36kb blocks) -11
Number of I/Os 130 I/O pins -1
Package Type 676-BBGA, FCBGA -1
Package Size 27mm x 27mm -1
Operating Temperature -40°C ~ 100°C (TJ) -2
Peripherals DMA -1
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG -1
RoHS Status ROHS3 Compliant -2
MSL Level MSL 3 (168 Hours) -2
ECCN 3A991D -2
Standard Package Tray -3

Key Features and Benefits

High-Performance Dual-Core Processing System (PS)

The XC7Z035-1FBG676I features a dual-core ARM Cortex-A9 MPCore processor running at 667MHz -1-2. Each core includes a NEON™ media processing engine and a vector floating-point unit, supporting both single and double-precision floating-point operations -11. The TrustZone® security technology and Thumb-2 instruction set enable secure, code-efficient operation.

Kintex-7 FPGA Fabric with Massive Logic Capacity

The Kintex-7 programmable logic provides 275,000 logic cells, delivering the highest logic density in the Zynq-7000 mid-range portfolio -11. With 900 DSP slices and 17.6Mb of Block RAM, this device excels at high-performance signal processing, hardware acceleration, and custom logic implementation -11. The PS-to-PL interconnect provides over 100Gb/s of bandwidth, enabling seamless data exchange between software and hardware -11.

Extensive Connectivity and Peripherals

The device includes comprehensive I/O capabilities: 2x tri-mode Gigabit Ethernet, 2x USB 2.0 (OTG), 2x CAN 2.0B, 2x I²C, 2x SPI, 2x UART, 2x SD/SDIO controllers, and four 32-bit GPIO banks -11. The 130 user I/Os provide ample connectivity for external peripherals and memory interfaces -1.

Advanced Security Features

RSA-based authentication, AES-256 decryption, SHA-256 data authentication, and secure boot capabilities ensure system integrity -11. Anti-tamper technology can “zeroize” the device if tampering is sensed, providing protection against unauthorized access.

Industrial-Grade Reliability

The -40°C to +100°C industrial temperature range makes the XC7Z035-1FBG676I suitable for demanding environments such as factory floors, outdoor telecommunications equipment, and aerospace systems -2-9.

Power Management

Separate power domains for the PS and PL enable intelligent power management, allowing users to power down the programmable logic when not required. This flexibility, combined with the 28nm HPL process, delivers industry-leading performance-per-watt.


Applications

Application Area Use Cases
Industrial Automation Motor control, industrial networking, machine vision, PLCs
Telecommunications Baseband processing, small cell base stations, network routers -10
Medical Ultrasound, MRI, diagnostic imaging, endoscopy -10
Aerospace & Defense Flight control systems, avionics, radar processing -10
Automotive Advanced driver assistance systems (ADAS), infotainment
Embedded Vision Smart cameras, video analytics, surveillance systems

Why Choose the XC7Z035-1FBG676I?

  • Mid-Range Performance Leader: Combines a dual-core Cortex-A9 with 275K logic cells for unparalleled processing and hardware flexibility -11

  • High Logic Density: Kintex-7 FPGA fabric provides 900 DSP slices and 17.6Mb RAM for intensive signal processing -11

  • Single-Chip Integration: Replaces multiple discrete processors and FPGAs, reducing BOM cost and board space

  • Design Flexibility: Hardware acceleration in PL and software programmability in PS enable truly differentiated products

  • Proven Reliability: Industrial temperature range ensures operation in the most demanding environments -2

  • Comprehensive Development Tools: Supported by AMD Vivado™ Design Suite, Vitis™ unified software platform, and extensive ARM ecosystem


Ordering Information

Parameter Details
Part Number XC7Z035-1FBG676I
Availability Active – In Production -1
Lead Time Please consult PCBSync for current lead times
Condition New Original Components
RoHS ROHS3 Compliant -2
Package Tray -3

Contact PCBSync for Pricing and Availability

For volume pricing, lead time, date code, and country of origin information, please contact our sales team. PCBSync is your trusted source for Xilinx FPGA and other programmable logic solutions.


PCBSync – formerly RayPCB – is now fully integrated to serve all your electronic component needs with the same dedication and quality you’ve come to expect.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.