Product Overview
The XC7Z035-1FBG676I is a powerful mid-range member of AMD Xilinx’s Zynq®-7000 family, integrating a dual-core ARM® Cortex®-A9 MPCore™ processing system with a high-density Kintex™-7 FPGA fabric on a single chip -1-9. This All Programmable SoC (AP SoC) delivers exceptional processing power and hardware flexibility, making it ideal for complex applications in industrial automation, telecommunications, medical imaging, and aerospace -10.
With 275,000 logic cells and a 667MHz dual-core processor, the XC7Z035-1FBG676I provides the perfect balance of software programmability and hardware acceleration -1-2. Its extended industrial temperature range of -40°C to +100°C ensures reliable operation in harsh environments -2-9. The device’s 130 user I/Os and comprehensive connectivity options enable seamless integration into demanding embedded systems -1-3.
Technical Specifications
Key Features and Benefits
High-Performance Dual-Core Processing System (PS)
The XC7Z035-1FBG676I features a dual-core ARM Cortex-A9 MPCore processor running at 667MHz -1-2. Each core includes a NEON™ media processing engine and a vector floating-point unit, supporting both single and double-precision floating-point operations -11. The TrustZone® security technology and Thumb-2 instruction set enable secure, code-efficient operation.
Kintex-7 FPGA Fabric with Massive Logic Capacity
The Kintex-7 programmable logic provides 275,000 logic cells, delivering the highest logic density in the Zynq-7000 mid-range portfolio -11. With 900 DSP slices and 17.6Mb of Block RAM, this device excels at high-performance signal processing, hardware acceleration, and custom logic implementation -11. The PS-to-PL interconnect provides over 100Gb/s of bandwidth, enabling seamless data exchange between software and hardware -11.
Extensive Connectivity and Peripherals
The device includes comprehensive I/O capabilities: 2x tri-mode Gigabit Ethernet, 2x USB 2.0 (OTG), 2x CAN 2.0B, 2x I²C, 2x SPI, 2x UART, 2x SD/SDIO controllers, and four 32-bit GPIO banks -11. The 130 user I/Os provide ample connectivity for external peripherals and memory interfaces -1.
Advanced Security Features
RSA-based authentication, AES-256 decryption, SHA-256 data authentication, and secure boot capabilities ensure system integrity -11. Anti-tamper technology can “zeroize” the device if tampering is sensed, providing protection against unauthorized access.
Industrial-Grade Reliability
The -40°C to +100°C industrial temperature range makes the XC7Z035-1FBG676I suitable for demanding environments such as factory floors, outdoor telecommunications equipment, and aerospace systems -2-9.
Power Management
Separate power domains for the PS and PL enable intelligent power management, allowing users to power down the programmable logic when not required. This flexibility, combined with the 28nm HPL process, delivers industry-leading performance-per-watt.
Applications
Why Choose the XC7Z035-1FBG676I?
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Mid-Range Performance Leader: Combines a dual-core Cortex-A9 with 275K logic cells for unparalleled processing and hardware flexibility -11
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High Logic Density: Kintex-7 FPGA fabric provides 900 DSP slices and 17.6Mb RAM for intensive signal processing -11
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Single-Chip Integration: Replaces multiple discrete processors and FPGAs, reducing BOM cost and board space
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Design Flexibility: Hardware acceleration in PL and software programmability in PS enable truly differentiated products
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Proven Reliability: Industrial temperature range ensures operation in the most demanding environments -2
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Comprehensive Development Tools: Supported by AMD Vivado™ Design Suite, Vitis™ unified software platform, and extensive ARM ecosystem
Ordering Information
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