Product Overview
The XC7Z007S-1CLG225I is a member of AMD Xilinx’s Zynq®-7000S family, representing the most cost-effective entry point into the scalable Zynq-7000 platform -2-11. This All Programmable SoC (AP SoC) integrates a single-core ARM® Cortex®-A9 processor with 28nm Artix®-7-based programmable logic in a compact 225-ball CSPBGA package measuring just 13mm x 13mm -1-3.
Designed for industrial IoT applications such as motor control, embedded vision, and industrial automation, the XC7Z007S-1CLG225I delivers exceptional performance-per-watt while offering the flexibility to implement custom logic in hardware alongside software programmability -2-5. Its extended industrial temperature range of -40°C to +100°C makes it ideal for demanding environments where reliability is critical -1-7.
The device’s small footprint and 54 user I/Os provide ample connectivity for space-constrained designs, making it particularly suited for portable and embedded systems where board real estate is at a premium -3-8.
Technical Specifications
Key Features and Benefits
High-Performance Processing System (PS)
The XC7Z007S-1CLG225I features a single-core ARM Cortex-A9 processor running at 667MHz -3. The processor delivers 2.5 DMIPS/MHz per CPU and includes a NEON™ media processing engine, vector floating-point unit, and supports both single and double-precision floating-point operations -2. The TrustZone® security technology and Thumb-2 instruction set enable secure, code-efficient operation.
Compact Form Factor
At just 13mm x 13mm, the CLG225 package is one of the smallest available for the Zynq-7000 family -8. This makes the XC7Z007S-1CLG225I ideal for space-constrained designs such as portable medical devices, compact industrial controllers, and embedded vision systems where board real estate is limited.
Flexible Programmable Logic (PL)
The Artix-7 FPGA fabric provides 23,000 logic cells, offering hardware programmability for implementing custom accelerators, interfaces, and co-processors -1. With over 3,000 interconnects between the PS and PL delivering up to 100Gb/s of bandwidth, this SoC enables levels of performance that multi-chip solutions cannot match -11.
Rich Connectivity and Peripherals
The device includes extensive I/O capabilities: 2x tri-mode Gigabit Ethernet, 2x USB 2.0 (OTG), 2x CAN 2.0B, 2x I²C, 2x SPI, 2x UART, 2x SD/SDIO controllers, and four 32-bit GPIO banks -2. The 54 user I/Os provide ample connectivity for external peripherals in compact designs -3.
Security and Reliability
Advanced security features include RSA-based authentication, AES-256 decryption, SHA-256 data authentication, and secure boot capabilities -2. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments -1.
Power Management
Separate power domains for the PS and PL enable intelligent power management, allowing users to power down the programmable logic when not required -2. This flexibility, combined with the 28nm HPL process, delivers industry-leading performance-per-watt.
Applications
Why Choose the XC7Z007S-1CLG225I?
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Cost-Optimized Entry Point: The single-core Zynq-7000S device offers the lowest-cost entry into the scalable Zynq platform -2-11
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Ultra-Compact Package: The 13mm x 13mm CLG225 package is ideal for space-constrained designs -8
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Single-Chip Integration: Eliminates the need for separate processor and FPGA, reducing BOM cost and board space
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Design Flexibility: Customize hardware in the PL and software in the PS to create differentiated products
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Proven Reliability: Industrial temperature range ensures reliable operation in harsh environments
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Industry-Standard Tools: Supported by the AMD Vivado™ Design Suite and extensive ARM ecosystem
Ordering Information
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