Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

SMT Equipment | High-End <a href="https://pcbsync.com/pcb-assembly/">PCB Assembly</a> Line — PCBSync
Capabilities  ›  SMT Equipment
Capabilities · SMT Equipment

The line behind
high-end SMT assembly.

A complete, in-house SMT line — solder-paste printing, 3D SPI, high-speed placement, nitrogen reflow, AOI, X-ray, ICT and selective soldering — running up to 4 million placements a day for the most demanding assemblies.

Get an assembly quote See the line
4M placements / day01005 · 0.2 mm BGASPI · AOI · X-ray · ICTIPC-A-610 Class 3
PCBSync high-speed SMT pick-and-place assembly line in Shenzhen
PCBSync SMT Assembly Line — Shenzhen
4M
Placements / day
01005
Smallest chip
0.2 mm
Min BGA / IC pitch
PoP ×3F
Package-on-package
SPI·AOI·X-ray
100% inspection
Class 3
IPC-A-610 · J-STD-001
Why equipment matters

Fine-pitch assembly is only as good as the line

01005 chips, 0.2 mm BGAs and package-on-package stacks leave no margin for drift. PCBSync runs a high-end SMT line — precision printing, closed-loop placement, profiled nitrogen reflow and full in-line inspection — so complex, high-reliability assemblies are built right the first time, from prototype to volume.

Placement precision

High-speed and multi-function placement with closed-loop vision handles 01005, fine-pitch QFN, CSP, flip-chip and PoP with tight accuracy.

Controlled reflow

Multi-zone nitrogen reflow with profiled heating gives consistent, void-minimized joints for lead-free and mixed processes.

Inspected in-line

3D SPI, AOI and X-ray are built into the flow, with ICT and functional test — every assembly is measured, not just made.

Inside the factory

Our SMT assembly equipment

A look at the machines on our SMT line — from paste printing and placement to reflow, soldering, inspection and rework.

Solder paste stencil printer
Solder Paste Printer (Stencil)
3D solder paste inspection
3D Solder Paste Inspection (SPI)
High-speed pick and place machine
High-Speed Pick-and-Place
Multi-function placement machine
Multi-Function Placement
Reflow soldering oven
Reflow Soldering Oven
3D automated optical inspection
3D Automated Optical Inspection
X-ray inspection for BGA
X-Ray Inspection (BGA)
Wave soldering machine
Wave Soldering Machine
Selective soldering machine
Selective Soldering
In-circuit test system
In-Circuit Test (ICT)
Conformal coating machine
Conformal Coating
BGA rework station
BGA Rework Station

Photographs of equipment in the PCBSync factory. Configurations may vary by line and over time.

The full line

Every stage, in-house

A complete assembly line under one roof means tighter control, faster turns and fewer hand-offs — from solder paste to a tested, finished assembly.

Printing & placement

Laying paste and placing parts — where yield is won.

Solder Paste Printer

Automatic stencil printing with closed-loop alignment for repeatable paste deposits down to 0.2 mm pitch.

PCB stencil

3D Solder Paste Inspection

Measures paste volume, height and offset after printing — stopping most defects before placement.

3D SPI

Pick-and-Place

High-speed and multi-function placement for 01005, fine-pitch QFN, CSP, flip-chip and PoP, single or double-sided.

PCB assembly

Reflow & soldering

Forming the joints — SMT, through-hole and everything mixed.

Reflow Oven (Nitrogen)

Multi-zone, nitrogen-capable reflow with profiled heating for consistent lead-free joints.

Assembly process

X-Ray Inspection (AXI)

Non-destructive imaging of hidden joints under BGA and QFN packages, revealing voids and bridging.

X-ray inspection

Wave & Selective Soldering

Wave and precision selective soldering for through-hole and mixed-technology assemblies.

Selective soldering

Inspection, test & finishing

Proving the board works — then protecting it.

AOI & X-Ray

3D AOI verifies presence, polarity and solder fillets; X-ray covers hidden BGA joints.

AOI inspection

ICT & Functional Test

Bed-of-nails ICT, flying probe and custom functional test verify every assembly to specification.

In-circuit testing

Conformal Coating & Rework

Conformal and nano coating for environmental protection, plus BGA / SMT / through-hole rework stations.

Conformal coating
Built for high-end SMT

This line assembles the boards others turn away.

Advanced equipment translates directly into advanced capability. Here's what our SMT line lets you specify — each backed by a dedicated service page.

01005

Smallest chip

Closed-loop fine placement.

PCB assembly
0.2 mm

Min BGA pitch

µBGA > 1000 balls.

BGA assembly
PoP ×3F

Package-on-package

Stacked-package assembly.

BGA / PoP
Flip-chip

Advanced packages

QFN · CSP · LGA · flip-chip.

Advanced packages
SMT + THT

Mixed assembly

Wave & selective solder.

Through-hole
Coating

Conformal + nano

Harsh-environment protection.

Conformal coating
Flex

Flex & rigid-flex PCBA

Assembly on flexible boards.

Flex assembly
Turnkey

Full sourcing

BOM, box-build & test.

Turnkey assembly

Have a complex assembly to build?

Send your BOM, Gerbers and pick-and-place file — our engineers review manufacturability and reply with a quote, usually within 24 hours, plus a free DFM / DFA review.

Get an assembly quote Assembly quote
Quality & compliance

A line built to recognized standards

Advanced equipment is matched by a documented quality system, so every assembly is built and verified to the standards your program requires.

IPC-A-610Class 2 & 3
J-STD-001Soldering
ISO 9001:2015Quality management
ANSI/ESD S20.20ESD control
IPC-7711/7721Rework & repair
IATF 16949 automotive-capable ISO 13485 medical-capable 100% SPI · AOI · X-ray Full traceability
Get a quote

Assembly quote in 24 hours

Tell us about your assembly and our engineers reply with pricing, lead time and a free design-for-assembly review — no obligation, NDA on request.

  • BOM + Gerbers and pick-and-place (CPL) file.
  • Quantity & service — turnkey, consigned or partial.
  • Test level — AOI/X-ray, ICT, functional — and any class requirement.

SMT assembly quote request

Reply within 24 hours · free DFA review
or
Upload BOM & Gerbers →
Submitting opens your email app with the details prefilled. Files are attached on the upload page.
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Related assembly & quality pages

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Answers

SMT equipment — FAQ

Our SMT line covers automatic solder-paste printing, 3D solder-paste inspection (SPI), high-speed and multi-function pick-and-place, multi-zone nitrogen reflow, 3D AOI, X-ray (AXI), wave and selective soldering, in-circuit and functional test, conformal coating and BGA rework — a complete in-house assembly line.

Up to 4 million placements per day, single and double-sided SMT and PTH, components down to 01005, BGA and micro-BGA pitch to 0.2 mm with over 1000 balls, package-on-package (PoP x3F) and fine-pitch QFN, CSP and flip-chip.

Yes. We run mixed SMT and through-hole assembly with wave and selective soldering, plus conformal and nano coating, IC programming, box-build and full turnkey sourcing.

Every assembly is verified with 3D SPI, AOI, X-ray for hidden joints, in-circuit test (ICT), flying probe and functional test, to IPC-A-610 Class 2 and 3 and J-STD-001 under an ISO 9001:2015 system. See our electronic laboratory.

Send your BOM, Gerbers and pick-and-place file through the inquiry form above or upload them on our contact page. We reply with a quote, usually within 24 hours.

Complex assemblies, built right.

Partner with an EMS whose SMT line is built for the hardest boards — 01005, fine-pitch BGA, PoP, mixed-technology and beyond. Send your files for a quote with a free DFA review, usually within 24 hours.

Get an assembly quote All capabilities

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.