Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Laboratory | PCBA, ICT, X-Ray & RF Testing — PCBSync
Capabilities  ›  Electronic Laboratory
Capabilities · Electronic Laboratory

Every assembly tested,
before it ever ships.

A fully equipped electronic laboratory since 2017 — AOI, SPI, X-ray, ICT and functional test for every PCBA, plus a dedicated RF / microwave lab and material characterization for high-frequency designs.

Since 2017AOI · SPI · X-ray · ICT · FCTRF / microwave labIPC-A-610 Class 3
PCBSync Electronic Laboratory for PCBA testing
PCBSync Electronic Laboratory — PCBA testing since 2017
Since 2017
Dedicated PCBA lab
100%
Assemblies tested
AOI · SPI · X-ray
In-line inspection
ICT · FCT
Electrical & functional
RF / µwave
Specialist lab
Class 3
IPC-A-610 · J-STD-001
Why it matters

The supplier that proves the board works

A populated board hides its failures — a void under a BGA, a cold joint, a marginal RF trace. Our electronic laboratory exists to find them here, on the bench, with measured data behind every shipment. For medical, automotive, aerospace and RF programs, that verification is the whole point of choosing the right partner.

See what's hidden

SPI, 3D AOI and X-ray catch paste, placement and hidden-joint defects under BGAs and QFNs before they ever become field failures.

Proven electrically

ICT, flying probe and functional test confirm every board works to specification — not just that it looks right.

RF, not just digital

A dedicated RF / microwave bench verifies S-parameters and characterizes laminate Dk/Df — capability most assembly houses simply don't have.

Inside the lab

Our Electronic Laboratory

A look at the PCBA testing and inspection equipment our engineers use on every assembly project.

Photographs of equipment in the PCBSync Electronic Laboratory. Configurations may vary by line and over time.

PCBA inspection & test

Common electronic testing — covered end to end

From solder paste to finished assembly, each method targets a different defect. Explore the detail pages to see how we run them.

3D Solder Paste Inspection

Measures paste volume, height and offset after printing — catching most defects before a single part is placed.

3D SPI

Automated Optical Inspection

High-resolution 3D AOI verifies presence, polarity, alignment and solder fillets with micrometer precision.

AOI inspection

X-Ray Inspection

Non-destructive imaging of hidden joints under BGA and QFN packages, revealing voids and internal defects.

X-ray inspection

In-Circuit Test (ICT)

Bed-of-nails fixtures measure component values and catch assembly errors against specified tolerances.

In-circuit testing

Flying Probe Test

Fixtureless electrical test for prototypes and low volume — fast verification without building a fixture.

Flying probe

Functional Test (FCT)

Custom fixtures simulate the final operating environment, confirming the assembly performs to specification.

Functional testing

Environmental & Vibration

Temperature cycling, humidity and vibration chambers stress assemblies to expose weaknesses before the field.

Vibration testing

Cleanliness & Solderability

Ionic-contamination and solderability testing ensure residues won't cause corrosion or leakage over the product's life.

Ionic cleanliness

Failure Analysis

Cross-section, thermal imaging and microscopy isolate root cause when a defect needs to be understood, not just found.

First-article & FA
Specialist capability · RF & microwave

Most suppliers stop at the PCB. We test the RF, too.

High-frequency boards live or die on signal loss and material consistency. Our RF / microwave lab verifies real electrical performance and characterizes the laminate itself — so a Rogers or Taconic design behaves on the bench exactly as it did in simulation.

RF & microwave instrument test

Real high-frequency performance, measured

Vector Network Analysis

S-parameters (S11 / S21), insertion loss and return loss across the GHz range to confirm real high-frequency behaviour.

S-parameters · GHz

Spectrum & signal analysis

Spectrum analyzer and signal sources for harmonics, spurious emissions and signal-quality verification.

Spectrum · harmonics

Controlled impedance / TDR

Time-domain reflectometry verifies trace impedance against the target — ±5% on controlled-impedance builds.

Impedance control

Antenna & VSWR

Return loss, VSWR and matching verification for antenna and RF front-end boards.

Antenna PCB

EMC / EMI pre-compliance

Pre-compliance screening for radiated and conducted emissions to de-risk designs before formal certification.

Pre-compliance

RF power & insertion loss

RF power measurement and per-inch insertion-loss checks on microstrip and stripline structures.

High-frequency PCB

RF material characterization

We characterize the laminate itself — the variable that makes or breaks a high-frequency design — and build on the industry's leading RF materials.

Dk / Df (Dielectric)

Dielectric constant (Dk / εr) and loss tangent (Df / tanδ) measured per IPC-TM-650 resonator methods.

Dk · loss tangent

Tg / Td / CTE

Glass transition, decomposition and z-axis expansion by TMA, DSC and TGA — plus T260 / T288 delamination.

TMA · DSC · TGA

Thermal & reliability

Thermal conductivity, moisture absorption, peel strength and CAF resistance on high-frequency laminates.

Thermal · CAF

RF materials we test & build

Need your assembly — or RF design — verified?

Send your BOM, Gerbers and test or RF requirements — our lab engineers propose a test plan and reply with a quote, usually within 24 hours. NDA on request.

Standards & rigor

Tested to documented standards

Testing only builds trust when it's consistent and traceable. Our protocols follow recognized standards, with calibrated equipment and data-driven control.

IPC-A-610Class 2 & 3
J-STD-001Soldering
ISO 9001:2015Quality management
ANSI/ESD S20.20ESD control
IPC-TM-650Test methods
Calibration & GR&R SPC & data retention First-article inspection Anti-static, climate-controlled lab
Request testing

Get a test plan & quote in 24 hours

Tell us what you need verified — PCBA test, environmental, RF or material characterization — and our lab engineers reply with a plan, pricing and lead time. NDA on request.

  • BOM + Gerbers (and CPL) for assembly & test.
  • Tests required — AOI/X-ray, ICT/FCT, environmental, RF S-parameters, Dk/Df…
  • Standard / class — IPC-A-610 Class 2 or 3, and any customer spec.

Electronic lab / testing inquiry

Reply within 24 hours · NDA on request
or
Upload files on our contact page →
Submitting opens your email app with the details prefilled. Files are attached on the upload page.
Answers

Electronic Laboratory — FAQ

Every PCBA is verified in-house with 3D solder-paste inspection (SPI), automated optical inspection (AOI), X-ray, in-circuit test (ICT), functional test (FCT), flying probe and boundary scan, plus environmental, reliability and failure-analysis testing — all to IPC-A-610 and J-STD-001.

Yes. Our RF / microwave lab covers vector network analysis (S-parameters, insertion and return loss), controlled-impedance / TDR, antenna VSWR and EMC / EMI pre-compliance, plus RF material characterization including dielectric constant (Dk) and loss tangent (Df), Tg / Td / CTE and delamination resistance.

We work with Rogers, Taconic, Isola, Arlon, Nelco, Megtron and PTFE / Teflon and ceramic-filled laminates, and characterize their Dk / Df and thermal behaviour to keep high-frequency designs on spec.

Inspection and acceptance follow IPC-A-610 Class 2 and 3 and J-STD-001, under an ISO 9001:2015 system with ESD control per ANSI/ESD S20.20. Material and electrical tests reference IPC-TM-650 methods, with calibrated equipment (GR&R) and statistical process control (SPC).

Yes. We open the laboratory to customer R&D, verifying designs and running functional, environmental and reliability assessment so issues are found before deployment. Send your files via the inquiry form or our contact page for a test plan and quote, usually within 24 hours.

The supplier you've been looking for.

One partner that builds, assembles and proves your board — digital and RF alike — with a fully equipped laboratory behind every shipment. Send your files for a test plan and quote, usually within 24 hours.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.