Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

SMT Assembly Capabilities | 01005 to BGA, 4M Points/Day, <a href="https://pcbsync.com/ipc-class-2-vs-class-3/">IPC Class 3</a> — PCBSync
Capabilities  ›  SMT Assembly
Capabilities · SMT & PCB Assembly

SMT Assembly Capabilities,
01005 to BGA, at 4M points a day.

High-density surface-mount assembly from our 5,000㎡ Shenzhen factory — fine-pitch placement, large-format boards, advanced packages, coating and full in-line test, built to IPC-A-610 Class 2 & 3.

Send an inquiry View full spec
IPC-A-610 Class 3J-STD-001ISO 9001:2015Turnkey & consigned
SMT placement & packages
BGA QFP 01005 Place ±0.025 mm
4M
Placements / day
01005
Min component
0.2 mm
Min BGA / IC pitch
±0.025
Placement (mm)
24×24
Max board (in)
Class 3
IPC-A-610
Overview

From a single prototype to high-volume SMT

Our surface-mount lines combine fine-pitch precision with serious throughput — placing everything from 01005 chips to 1000+ ball BGAs, on boards up to 24″ × 24″, at up to 4 million placements per day. Single- or double-sided, turnkey or consigned, with full inspection, test and coating in-house.

Process capability

SMT assembly specifications

Placement, board-handling, soldering and test capability across our SMT and mixed-technology lines. Need something at the edge of these ranges? Ask us.

Placement & components

ParameterCapability
Single & double-sided SMT / PTHYes — large parts & BGAs on both sides
Smallest component01005 (0201 standard)
Min. BGA / micro-BGA pitch0.2 mm (0.008″), ball count > 1000
Min. IC / leaded-part pitch0.2 mm (0.008″)
Placement accuracy±0.025 mm
Max. part size by machine2.2″ × 2.2″ × 0.6″
Advanced packagesBGA, micro-BGA, CSP, QFN, LGA, flip-chip, POP (up to 3 tiers)
Odd-form & connectorsLED, R/C networks, electrolytics, pots, sockets, SM connectors

Board handling

ParameterCapability
Min. / max. board size0.5″ × 0.5″  →  24″ × 24″ (large-format)
Board thickness0.010″ – 0.250″  (0.25 – 6.35 mm)
Layer countSingle-sided to 40+ layers
Board shape / panelizationAny shape · tab-routed, breakaway tabs, V-scored, routed + V-score
Material compatibilityFR-4 / high-Tg, polyimide & flex, metal core (Al / Cu), Rogers, rigid-flex
PCB finishes acceptedHASL / SMOBC, ENIG, ENEPIG, Imm. silver / tin, electrolytic & electroless gold, OSP
FiducialsPreferred but not required

Soldering & processes

ProcessCapability
Reflow solderingMulti-zone · nitrogen reflow for sensitive assemblies
Solder-paste printingDown to 0.2 mm · 100% SPI (solder-paste inspection)
Through-hole solderingWave, selective, hand soldering · press-fit
Mixed technologySMT + through-hole on the same board
Solder & fluxLead-free (RoHS / REACH) · no-clean & water-soluble
Value-addUnderfill, BST, fine-pitch wire bonding
ReworkBGA removal & replacement, SMT IR rework, through-hole rework

Inspection & test

MethodCapability
SPIReal-time solder-paste inspection
AOI100% automated optical inspection
X-rayBGA, QFN & hidden-joint verification
In-circuit test (ICT)Comprehensive electrical testing
Functional test (FCT)Custom fixtures & procedures
Flying probe & boundary scanPrototypes, low-volume & complex digital
Process controlMicroscope to 20×, first-article, SPC

Have boards to assemble?

Send your Gerbers and BOM — our engineers run a free design-for-assembly & BOM review and reply with a quote, usually within 24 hours. Turnkey, consigned or partial.

Send your inquiry Get an assembly quote
Beyond the basics

Advanced & high-end SMT processes

The fine-pitch, large-format and protection processes for the most demanding, high-reliability assemblies.

High-end packages

Fine-pitch BGA, micro-BGA (1000+ balls), CSP, QFN, LGA, flip-chip and POP up to 3 tiers — placed at ±0.025 mm.

0.2 mm pitch · POP×3F

Large-format SMT

Boards up to 24″ × 24″ for backplanes, LED light bars, power and industrial assemblies — with double-sided placement.

Up to 24″ × 24″

Conformal & nano coating

Acrylic, silicone, urethane and parylene conformal coating, plus ultra-thin nano coating for moisture and corrosion protection.

+ Nano coating

Underfill & potting

BGA underfill for shock and thermal-cycling reliability, plus potting and encapsulation for harsh-environment and IP protection.

Reliability

ICT & functional test

In-circuit test, functional test with custom fixtures, flying-probe and boundary scan — verified before every shipment.

ICT · FCT

Box build & integration

Cable & wire-harness assembly, chassis integration, final product assembly and full system test & validation.

Turnkey system

Coating & protection

Acrylic Silicone Urethane Parylene Nano coating Potting & encapsulation
Volume & sourcing

Prototype to high volume — your way

Prototype: 1–2524–48 h quick-turn
Low: 25–500Fast batch runs
Medium: 500–10kOptimized process
High: 10k+Up to 4M points/day
TurnkeyFull parts procurement
Consigned / partialNPI & DFM support
Quality & compliance

Standards we assemble & test to

IPC-A-610Class 2 & 3
J-STD-001Soldering
ISO 9001:2015Quality management
ANSI/ESD S20.20ESD control
IPC-A-600Board acceptability
ULRecognized assembly
RoHS / REACHLead-free
IATF 16949Automotive-capable
ISO 13485Medical-capable
TraceabilityCounterfeit prevention
SPI AOI 100% X-ray ICT Functional test Flying probe Boundary scan
Send your inquiry

Get an SMT assembly quote in 24 hours

Tell us about your assembly and our engineers reply with pricing, lead time and a free design-for-assembly & BOM review — no obligation, NDA on request.

  • BOM (with MPNs), Gerbers and pick-and-place / centroid file.
  • Quantity and service model — turnkey, consigned or partial.
  • Any test or coating needs — ICT/FCT, conformal or nano coating.

SMT assembly inquiry

Reply within 24 hours · free DFA & BOM review
or
Upload BOM & Gerber files →
Submitting opens your email app with the details prefilled. Files are attached on the upload page.
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Related pages

PCB AssemblyFull assembly service Turnkey AssemblyBoard + parts + build Assembly QuotePCBA quote in 24h Assembly CostWhat drives the price All CapabilitiesFull factory spec Rigid PCB CapabilitiesBare-board spec
Answers

SMT assembly capability — FAQ

Components down to 01005, with minimum IC / leaded-part pitch of 0.2 mm and BGA / micro-BGA pitch of 0.2 mm (ball counts over 1000), at ±0.025 mm placement accuracy. We also build POP up to 3 tiers, plus CSP, QFN, LGA and flip-chip.

Boards from 0.5″ × 0.5″ up to 24″ × 24″, thickness 0.010″–0.250″ and up to 40+ layers, with double-sided assembly and BGAs on both sides. Large-format SMT suits backplanes, LED bars and industrial boards.

Our SMT lines run up to 4 million placements per day, supporting prototype quick-turn (24–48 h) through high-volume production, with turnkey, consigned or partial sourcing.

Yes — conformal coating (acrylic, silicone, urethane, parylene) and nano coating, potting, underfill, ICT, functional test, flying-probe, boundary scan, BGA rework and full box-build / system integration.

IPC-A-610 Class 2 and 3 and J-STD-001 soldering, under an ISO 9001:2015 system with ESD control per ANSI/ESD S20.20, RoHS and REACH compliant, with SPI, AOI and X-ray inspection. Submit files via the inquiry form or our contact page.

Let's assemble your boards.

From a 24-hour prototype to high-volume production with coating and test — send your BOM and Gerbers for a quote with a free DFA review, usually within 24 hours.

Send your inquiry PCB assembly service

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.