Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

<a href="https://pcbsync.com/flexible-pcb/">Flex PCB</a> Capabilities | Flexible & Rigid-Flex, 1–12 Layers, <a href="https://pcbsync.com/ipc-6013/">IPC-6013</a> — PCBSync
Capabilities  ›  Flex PCB
Capabilities · Flex & Rigid-Flex PCB

Flex PCB Capabilities,
built to bend and last.

Flexible and rigid-flex circuits from our 5,000㎡ Shenzhen factory — polyimide, multilayer, dynamic-bend and stiffened constructions, all built and inspected to IPC-6013 & IPC-2223.

IPC-6013IPC-2223UL · RoHS · 94V-0Rigid-flex to 32 layers
Flex circuit construction
Coverlay Copper conductor PI (polyimide) base
1–12
Flexible layers
2–32
Rigid-flex layers
4 mil
Min trace / space
8 mil
Min hole
0.05 mm
Min thickness
520×330
Max size (mm)
Process capability

Flex & rigid-flex specifications

The process window for our flexible and rigid-flex circuits. Pushing the limits on bend radius, layer count or fine features? Ask us — we build to spec.

Construction & materials

ParameterSpecification
Layers — flexible1–12 layers
Layers — rigid-flex2–32 layers
Base materialPI, PET, PEN, FR-4, DuPont (Kapton)
StiffenersFR4, aluminum, polyimide, stainless steel
Copper thickness1/3 oz – 2 oz

Dimensions & thickness

ParameterSpecification
Max / min board sizeMin 0.2″ × 0.3″  ·  Max 20.5″ × 13″ (≈ 520 × 330 mm)
Final thickness — flexible0.002″ – 0.1″  (0.05 – 2.5 mm)
Final thickness — rigid-flex0.0024″ – 0.16″  (0.06 – 4.0 mm)
Insulation thickness0.5 – 2 mil  (12.7 – 50 µm)

Lines, spacing & holes

ParameterSpecification
Min. trace width / space0.5 oz: 4/4 mil  ·  1 oz: 5/5 mil  ·  2 oz: 5/7 mil
Min. annular ring0.5 oz: 4 mil  ·  1 oz: 5 mil  ·  2 oz: 7 mil
Min. hole size8 mil
Hole tolerancePTH ±3 mil  ·  NPTH ±2 mil
Min. slot24 × 35 mil  (0.6 × 0.9 mm)

Coverlay, mask & legend

ParameterSpecification
Solder-mask / coverlay alignment tol.±3 mil
Silkscreen alignment tol.±6 mil
Silkscreen line width5 mil

Surface finishes (lead-free)

FinishSpecification
Immersion Nickel / Gold (ENIG)Nickel 100–200 µin  ·  Gold 1–5 µin
Gold plating (electrolytic)Nickel 100–200 µin  ·  Gold 1–4 µin
Immersion SilverSilver 6–12 µin
Immersion TinAvailable
OSPFilm 8–20 µin

Outline & test

ParameterSpecification
Profile tolerance (punch)Accurate mould ±2 mil  ·  Ordinary mould ±4 mil  ·  Knife mould ±8 mil  ·  Hand-cut ±15 mil
Test voltageTesting fixture: 50–300 V

Have a flex or rigid-flex board to build?

Send your Gerbers, stackup and bend requirements — our engineers confirm manufacturability against this spec and reply with a quote, usually within 24 hours, plus a free DFM review.

Beyond the basics

Advanced & high-end flex processes

From simple single-layer flex to complex rigid-flex assemblies that bend, shield and survive millions of cycles.

Rigid-flex integration

Rigid sections and flexible tails in one board — eliminating connectors, saving space and boosting reliability.

2–32 layers

Multilayer & HDI flex

Multilayer flex with laser microvias and fine lines for dense, high-pin-count flexible interconnects.

Microvia

Dynamic flexing

Bend-to-install or continuous-flex designs engineered with rolled-annealed copper and optimized bend radius.

Millions of cycles

EMI shielding film

Conductive shielding film over flex circuits for noise-sensitive and high-frequency applications.

Shielded flex

Stiffeners & ZIF contacts

Selective stiffeners and bevelled gold ZIF / contact fingers for connector insertion and component areas.

FR4 · PI · steel

Controlled impedance

Impedance-controlled flex and rigid-flex with stackup design support and TDR verification.

Microstrip / stripline

Materials & coverlay

A full flexible material set for standard to demanding builds:

Polyimide (PI / Kapton)PETPENAdhesiveless laminate PI coverlayFR-4 (rigid-flex)Stiffeners: FR4 / Al / PI / SUSEMI shielding film
Quality & compliance

Standards we build & test to

Every flexible and rigid-flex board is fabricated, inspected and documented to the relevant industry standards.

IPC-6013Flex & rigid-flex
IPC-2223Flex design spec
IPC-A-600Board acceptability
IPC-A-610Assembly Class 2/3
ISO 9001Quality management
ULListed · 94V-0
RoHS / REACHEU compliant
ISO 13485Medical-capable
IATF 16949Automotive-capable
AS9100Aerospace-capable
AOI Flying-probe / E-test Impedance (TDR) Bend / flex test X-ray Microsection
Send your inquiry

Get a flex PCB quote in 24 hours

Tell us about your flexible or rigid-flex board and our engineers reply with pricing, lead time and a free design-for-manufacturing review — no obligation, NDA on request.

  • Gerbers (RS-274X) + drill, stackup and layer count.
  • Flex or rigid-flex, quantity, base material, stiffener and finish.
  • Bend / flex requirement — static install or dynamic flexing, and bend radius.

Flex PCB inquiry

Reply within 24 hours · free DFM review
or
Upload Gerber files →
Submitting opens your email app with the details prefilled. Files are attached on the upload page.
Answers

Flex PCB capability — FAQ

Flexible circuits are built from 1 to 12 layers, and rigid-flex boards from 2 to 32 layers, including multilayer and HDI flex constructions.

Base films include polyimide (PI / DuPont Kapton), PET and PEN, plus FR-4 for rigid-flex transitions. Stiffeners are available in FR4, aluminum, polyimide and stainless steel, and we can add EMI shielding film.

Down to 4 mil line width and space on 0.5 oz copper (5/5 mil on 1 oz), a minimum hole of 8 mil, and copper weights from 1/3 oz to 2 oz.

Built and inspected to IPC-6013 and IPC-2223 (with IPC-A-600 and IPC-A-610) under an ISO 9001 system, and produced UL, RoHS and REACH compliant, with ISO 13485, IATF 16949 and AS9100 support.

Use the inquiry form above or upload your Gerbers on our contact page. We reply with a quote — usually within 24 hours — plus a free DFM review.

Let's build your flex circuit.

From a single-layer flex to a 32-layer rigid-flex assembly — send your files and get a quote with a free DFM review, usually within 24 hours.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.