When routing complexity and miniaturisation demand uncompromising performance, our High Layer-Count HDI PCB delivers precise electrical characteristics. Designed for hardware engineers and product developers tackling extreme density challenges, this 64-layer microvia board supports advanced component packages, fine-pitch BGAs, and critical signal integrity requirements.
-
Layer Count: Up to 64 layers for complex netlists and controlled impedance.
-
Via Technology: Advanced microvias, blind/buried vias, and via-in-pad structures for maximised board real estate.
-
Base Materials: High-Tg FR4, Rogers, Megtron, and polyimide options ensuring strict thermal stability.
-
Surface Finish: ENIG, ENEPIG, Immersion Silver, or Immersion Tin to suit specific assembly profiles.
-
Tolerance: Tight registration and impedance control (±5% to ±10%).
-
Standards Compliance: Manufactured to IPC-6012 Class 3 specifications for mission-critical reliability.
-
High-Performance Computing (HPC): Supercomputers, data centre servers, and AI hardware accelerators.
-
Telecommunications: 5G infrastructure, core routers, and optical networking equipment.
-
Aerospace & Defence: Radar systems, avionics flight controls, and guidance instrumentation.
-
Advanced Medical Devices: High-resolution imaging equipment and diagnostic hardware.
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
Submit your Gerber files and project specifications today to request a comprehensive quote for your next fabrication build.