Unlock the next level of circuit board performance with the PCBSync 20-Layer Rigid-Flex PCB with ENIG Finish — a precision-engineered solution built for the most demanding electronic applications.
Superior 20-Layer Stack-Up for Complex Designs
With a robust 20-layer construction, this rigid-flex PCB supports high-density interconnects and complex routing requirements. Whether you’re designing compact wearables, military-grade hardware, or medical imaging systems, the advanced multilayer stack-up ensures reliable signal transmission with minimal electromagnetic interference (EMI).
ENIG Finish for Maximum Reliability
The Electroless Nickel Immersion Gold (ENIG) surface finish provides a flat, oxidation-resistant surface that enhances solderability and extends product lifespan. ENIG is the industry-preferred finish for fine-pitch components and BGA packages, reducing the risk of solder joint failure over time.
Rigid-Flex Technology for Design Freedom
Combining rigid and flexible substrates in a single board, PCBSync’s rigid-flex technology eliminates the need for connectors and cables, reducing assembly time, weight, and potential failure points. The result is a more compact, reliable, and cost-effective design.
Why Choose PCBSync?
- ✅ IPC Class 2 & Class 3 compliant manufacturing
- ✅ Tight impedance control (±10%)
- ✅ RoHS-compliant materials
- ✅ Fast turnaround with full traceability
- ✅ Custom layer configurations available
Order your PCBSync 20-Layer Rigid-Flex PCB with ENIG Finish today and experience the precision and reliability that engineers worldwide trust. Contact our team for custom specifications and bulk pricing.