Upgrade your electronics assembly with the PCBSync 10-Layer Rigid-Flex PCB — a high-performance printed circuit board solution combining the structural strength of rigid boards with the design flexibility of flex circuits. Built for engineers who demand precision and durability, this board is engineered to meet the most stringent industry standards.
Advanced 10-Layer Stackup for Complex Designs With a 10-layer rigid-flex construction, this PCB supports high-density interconnect (HDI) layouts, enabling compact routing for complex signal paths. Whether you’re designing for aerospace avionics, wearable medical devices, or industrial automation systems, the multilayer stackup ensures excellent signal integrity and EMI shielding across all layers.
Stiffener for Enhanced Mechanical Support The integrated FR4 or polyimide stiffener reinforces flex zones at connector and component areas, preventing mechanical fatigue and extending product lifespan. This makes it ideal for applications subject to repeated bending, vibration, or shock.
Immersion Gold (ENIG) Surface Finish The Electroless Nickel Immersion Gold (ENIG) surface finish provides outstanding solderability, flat pad geometry, and excellent corrosion resistance. ENIG is the preferred choice for fine-pitch SMD components, BGA packages, and gold wire bonding applications.
Key Specifications:
- Layers: 10 (Rigid-Flex)
- Surface Finish: Immersion Gold (ENIG)
- Stiffener Material: FR4 / Polyimide (customizable)
- Base Material: Polyimide flex + FR4 rigid
- Min. Line/Space: 3mil/3mil
- IPC Class II / Class III compliant
Why Choose PCBSync? PCBSync delivers fast lead times, strict quality control, and full DFM support — ensuring your rigid-flex PCB arrives ready for production. Custom stackups, impedance control, and UL-certified manufacturing are available on request.
Request a free quote today and let PCBSync power your next-generation device.
