Engineered for precision. Built for the demands of modern electronics.
The PCBSync 8-Layer Rigid-Flex PCB with ENIG (Electroless Nickel Immersion Gold) Finish delivers an exceptional combination of mechanical flexibility and structural rigidity — purpose-built for applications where reliability cannot be compromised.
Why Choose the PCBSync 8-Layer Rigid-Flex?
Designed for aerospace, medical devices, wearable technology, and high-performance industrial electronics, this board seamlessly integrates rigid and flexible zones into a single, unified structure. Say goodbye to bulky connectors and unreliable solder joints — the PCBSync solution reduces overall assembly weight, minimizes interconnect failure points, and enables three-dimensional circuit routing that traditional PCBs simply cannot achieve.
Premium ENIG Surface Finish
The Electroless Nickel Immersion Gold (ENIG) finish provides a ultra-flat, oxidation-resistant surface ideal for fine-pitch SMD components and BGA packages. Exceptional solderability ensures consistent, clean joints across every production run, while the gold layer protects contact pads against corrosion for long-term performance in demanding environments.
Key Specifications
- Layer Count: 8 layers (rigid + flex zones)
- Surface Finish: ENIG (Electroless Nickel Immersion Gold)
- Dielectric Material: Polyimide flex + FR4 rigid
- Minimum Trace/Space: 3/3 mil
- Controlled Impedance: Available upon request
- Operating Temperature: -40°C to +130°C
- IPC Class: 2 standard / Class 3 available
Customization Available
Every PCBSync board is manufactured to your exact Gerber specifications. Custom stack-up configurations, blind/buried vias, and tight-tolerance impedance control are all supported. Our engineering team is available to review your design files before production begins.
Quality You Can Count On
All boards undergo 100% electrical testing, AOI inspection, and are manufactured in an ISO-certified facility to IPC-6013 standards.
Upload your design files today and get a quote within 24 hours.
