Engineered for demanding applications where reliability, flexibility, and precision matter most, the PCBSync 4-Layer Rigid-Flex PCB combines the structural integrity of rigid circuitry with the dynamic versatility of flexible interconnects — all in a single, compact assembly.
Superior Construction Built on a proven 4-layer stackup, this rigid-flex PCB delivers exceptional signal integrity and routing density. The FR4 stiffener reinforces critical connector zones and component areas, preventing mechanical stress and ensuring long-term durability in high-vibration or bend-cycle environments. Whether deployed in aerospace, medical devices, wearables, or industrial electronics, the board holds its form where it needs to — and flexes where it should.
ENIG Surface Finish for Flawless Performance The Electroless Nickel Immersion Gold (ENIG) finish provides a flat, solderable surface ideal for fine-pitch SMD components and BGA packages. ENIG’s dual-layer protection guards against oxidation and corrosion, ensuring consistent solder joint quality across every assembly run. It’s the gold standard for high-reliability PCB manufacturing — and your builds deserve nothing less.
Key Specifications
- Layers: 4 (Rigid-Flex Construction)
- Surface Finish: ENIG (Electroless Nickel Immersion Gold)
- Stiffener Material: FR4
- Ideal For: Wearables, medical devices, aerospace, compact IoT hardware
- Flex Bend Cycles: Rated for dynamic and static flex applications
- Min. Trace/Space: 3/3 mil capability
Why PCBSync? Every board is manufactured under strict IPC Class 2/3 standards with full electrical testing and impedance control options. Our rigid-flex solutions cut cable harness complexity, reduce assembly time, and shrink your product footprint — giving your design a real competitive edge.
Custom stackups, controlled impedance, and volume pricing available. Contact us for a free engineering review.
