XC7Z020 Pinout, Specifications & Package Options Explained

If you’ve ever stared at a 484-ball BGA footprint wondering which pins go where, you’re not alone. The XC7Z020 from AMD/Xilinx is one of the most popular members of the Zynq-7000 SoC family, but understanding its pinout, package options, and specifications can feel overwhelming when you’re staring down a fresh PCB layout. I’ve worked with this device across multiple production designs, and I want to share what actually matters when you’re laying out a board with the Xilinx Zynq 7020.

This guide breaks down the XC7Z020 pinout structure, explains the differences between package options like the XC7Z020CLG484 and CLG400, and gives you practical information you can use immediately in your designs.

XC7Z020 Device Overview and Core Specifications

The XC7Z020 sits in the sweet spot of the Zynq XC7Z020 family—enough resources for serious embedded work without the cost of larger devices. It combines a dual-core ARM Cortex-A9 Processing System (PS) with Artix-7 class Programmable Logic (PL) on a single 28nm die.

Key Specifications of the Xilinx Zynq 7020

What makes the Zynq XC7Z020 particularly useful is that the Processing System boots independently of the Programmable Logic. This means your ARM code starts executing immediately while the FPGA fabric can be configured later—a significant advantage for fast boot applications.

Understanding XC7Z020 Package Options

The XC7Z020 is available in two primary package configurations, and your choice here directly impacts how many I/O pins you have access to and your PCB routing complexity.

XC7Z020 CLG400 Package Details

The CLG400 is a 400-ball wire-bond chip-scale BGA with 0.8mm pitch. This package measures 17mm x 17mm and is the smaller of the two options for the XC7Z020.

In the CLG400 package, HR I/O bank 33 is not bonded out, and bank 13 is only partially bonded. This is an important consideration if you’re planning to migrate from the CLG484.

XC7Z020CLG484 Package Specifications

The XC7Z020CLG484 is the larger 484-ball package, also using 0.8mm pitch but measuring 19mm x 19mm. This is the package used on popular development boards like the ZC702.

The XC7Z020 CLG484 bonds out all HR I/O banks completely, giving you access to the full 200 user I/O pins. If your design needs maximum I/O count, this is your package.

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XC7Z020 Pinout Structure and I/O Banks

Understanding the pinout organization is critical for efficient PCB layout. The Zynq XC7Z020 divides its pins into Processing System (PS) and Programmable Logic (PL) domains.

Processing System Pin Categories

The PS side of the XC7Z020 includes several dedicated pin groups:

The MIO pins are highly flexible—you can map various peripherals to different MIO locations through software configuration. However, certain peripherals have restrictions on which MIO pins they can use, so always check UG585 before finalizing your pinout.

Programmable Logic I/O Banks

The PL fabric organizes I/O into High Range (HR) banks. The XC7Z020 contains HR banks only (no High Performance HP banks), which support voltage levels from 1.2V to 3.3V.

Each I/O bank requires its own VCCO supply, which must match the voltage standard of the connected interfaces. This is a common source of design errors—forgetting to power an I/O bank or using the wrong voltage will give you non-functional I/O.

Clock-Capable Pins

The XC7Z020 includes specialized clock input pins that deserve attention:

When not used for clocking, these pins function as regular user I/O. However, if you need clean, low-jitter clocking for high-speed interfaces, route your critical clocks to MRCC or SRCC pins.

XC7Z020 Power Supply Requirements

Getting the power right is non-negotiable. The Zynq XC7Z020 requires multiple voltage rails with specific sequencing requirements.

Required Voltage Rails

AMD recommends connecting VCCINT and VCCBRAM to the same supply. Similarly, VCCPINT can often share with VCCINT if the supply has adequate current capacity.

Power Sequencing Requirements

The XC7Z020 enforces a specific power-on sequence:

1. VCCINT, VCCPINT, VCCBRAM must ramp first (or simultaneously)
2. VCCAUX, VCCPAUX, VCCPLL must ramp second
3. VCCO banks can ramp after core supplies are stable

Many designers use dedicated PMICs like the NXP PF0100 or similar to handle sequencing automatically. This eliminates manual sequencing logic and reduces design risk.

Speed Grades and Part Numbering Explained

The XC7Z020 part number encodes critical information about speed, temperature range, and package. Understanding this helps you select the right variant.

XC7Z020 Part Number Structure

Using XC7Z020-2CLG484I as an example:

Available Speed Grades

Temperature Grade Options

For production designs, always verify the specific temperature range and speed grade combination is available—not all combinations are manufactured.

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Practical PCB Design Considerations for XC7Z020

BGA Routing Strategy

The 0.8mm pitch on both CLG400 and CLG484 packages requires careful attention to routing:

Dog-bone via patterns work well for escaping the BGA, but plan your layer stack carefully. I typically use layers 1-2 for signals, 3 for power, 4 for ground, 5 for power, and 6 for signals on a 6-layer board.

DDR3 Layout Requirements

The PS DDR interface is often the most challenging part of the layout:

Use the Xilinx Memory Interface Generator (MIG) in Vivado to validate your pinout before committing to layout. This catches DQ/DQS byte lane violations early.

Essential Resources and Documentation Downloads

Here are the key documents you’ll need for XC7Z020 design work:

Official Download Links:

• Pinout files: AMD Zynq-7000 Package Files
• All documentation: AMD Documentation Portal
• Power Estimator: XPE Download

Symbol and Footprint Resources:

• SnapEDA and Ultra Librarian offer free XC7Z020-CLG484 symbols and footprints
• Samtec offers connector footprints for FMC interfaces
• AMD provides official Allegro/OrCAD libraries

Frequently Asked Questions About XC7Z020

What is the difference between XC7Z020CLG400 and XC7Z020CLG484?

The primary differences are physical size and I/O count. The CLG400 is 17x17mm with 100 PL user I/O, while the XC7Z020 CLG484 is 19x19mm with 200 PL user I/O. Both use 0.8mm ball pitch. Choose CLG484 when you need maximum I/O or plan to use all available HR banks. Choose CLG400 for smaller board footprint and cost-sensitive designs.

Can I migrate a design from XC7Z020-CLG400 to XC7Z020-CLG484?

Not directly—the packages are not pin-compatible. However, if your design uses only pins available in CLG400, the Vivado constraint files can be updated for the new package. You’ll need a board respin, but the HDL and software remain compatible.

What power supplies does the XC7Z020 require?

The XC7Z020 needs seven primary supply rails: 1.0V for PS and PL core logic, 1.8V for auxiliary circuits and PLLs, variable VCCO for I/O banks (1.2V-3.3V), and DDR supplies (typically 1.35V or 1.5V). AMD recommends specific sequencing with core supplies ramping before I/O supplies.

How do I select the correct speed grade for my application?

Speed grade affects maximum clock frequencies and timing margins. The -1 grade (667MHz ARM) handles most embedded applications. Choose -2 (766MHz) for moderate performance needs, and -3 (866MHz) only when you need maximum processing power and can accept higher cost. Always verify timing closure in Vivado before committing to a slower speed grade.

Where can I download XC7Z020 pinout files?

AMD provides official pinout files in CSV and text formats at their package pinout files page. These files include all pin names, functions, bank assignments, and I/O standards. Vivado also provides interactive pinout tools that export to your preferred format.

Final Recommendations for XC7Z020 Designs

After working through multiple XC7Z020 designs, here are my key takeaways:

Start your design with the XC7Z020CLG484 if you have any uncertainty about I/O requirements. The extra pins provide flexibility during bring-up and don’t significantly increase routing complexity given the identical 0.8mm pitch.

Use the Xilinx Power Estimator (XPE) early in your design process. The power system is the foundation of a reliable Zynq design, and XPE helps you size supplies correctly before schematic capture.

Pay attention to I/O bank voltage planning. Each bank needs consistent VCCO, and mixing voltage standards within a bank causes headaches. Plan your interface assignments carefully based on voltage requirements.

Finally, keep the reference designs handy. The ZC702 evaluation board schematics are publicly available and demonstrate a production-quality XC7Z020 implementation. When in doubt, see how AMD did it.

The Xilinx Zynq 7020 remains one of the most capable mid-range SoC FPGAs available, and understanding its pinout and package options is the first step toward a successful design.

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