Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Versal AI Core & AI Edge: Hardware AI Acceleration Explained

The Versal AI Core and AI Edge series represent AMD’s most significant advancement in hardware AI acceleration. At the heart of these adaptive SoCs lies the AI Engine—a revolutionary vector processor array that delivers up to 133 INT8 TOPS on the flagship Xilinx VC1902 device. Unlike GPU-based solutions that struggle with memory bandwidth limitations, the AI Engine architecture provides near-zero dark silicon, achieving up to 90% of theoretical peak performance in real-world workloads.

Having deployed the Xilinx VCK5000 accelerator card in data center inference applications, I can confirm the performance claims hold up in production environments. The combination of ASIC-class compute efficiency with FPGA-like programmability creates a unique value proposition for AI workloads from edge to cloud.

Understanding the AI Engine Architecture

The AI Engine is not a traditional FPGA accelerator or a GPU compute unit—it’s a purpose-built array of VLIW SIMD vector processors designed specifically for machine learning inference and digital signal processing.

AI Engine Tile Components

Each AI Engine tile contains multiple processing elements working in concert:

ComponentFunctionSpecifications
Vector ProcessorSIMD computation512-bit datapath, up to 128 INT8 MACs/cycle
Scalar ProcessorControl logic32-bit RISC processor
Local MemoryData storage32 KB per tile (AIE) / 64 KB per tile (AIE-ML)
DMA EnginesData movementDedicated stream channels
InterconnectTile communicationAXI4-Stream switches

The Xilinx VC1902 device contains 400 AI Engine tiles arranged in a 50×8 array, providing massive parallel compute capacity. Each tile operates independently, enabling true distributed computing across the array.

AIE vs AIE-ML Architecture Comparison

AMD offers two AI Engine variants optimized for different workloads:

FeatureAIE (AI Core Series)AIE-ML (AI Edge Series)
Local Memory32 KB64 KB
INT8 MACs/Cycle128256
FP32 SupportYesNo
BFloat16 SupportNoYes
Memory TilesNoYes (512 KB each)
Cascade Bus Width384-bit512-bit
Primary TargetDSP + ML inferencePower-efficient ML

The AIE architecture in the Xilinx VC1902 excels at signal processing applications requiring floating-point precision, while AIE-ML is optimized for quantized neural network inference where INT8 precision is sufficient.

Xilinx VC1902: The Flagship AI Core Device

The Xilinx VC1902 represents the most capable device in the Versal AI Core series, combining 400 AI Engine tiles with substantial programmable logic and processing system resources.

Xilinx VC1902 Device Specifications

FeatureSpecification
AI Engine Tiles400 (50×8 array)
Peak INT8 Performance133 TOPS
Peak INT4 PerformanceUp to 405 TOPS
System Logic Cells1,968K
DSP58 Engines1,968
Block RAM34 Mb
UltraRAM130 Mb
On-Die Memory855 Mb total
Transistor Count37 billion
Process TechnologyTSMC 7nm FinFET

Xilinx VC1902 Performance Characteristics

The Xilinx VC1902 achieves exceptional compute efficiency through several architectural innovations:

Performance MetricValue
AI Engine to PL Bandwidth~1.0 TB/s aggregate
PL to AI Engine Bandwidth~1.3 TB/s aggregate
NoC Aggregate BandwidthMulti-terabit
AI Engine Clock SpeedUp to 1.25 GHz
Power Efficiency100× vs. server CPUs

The aggregate bandwidth between AI Engines and programmable logic enables data-intensive applications without the memory bandwidth bottlenecks that plague traditional accelerators.

Xilinx VC1902 Application Domains

The Xilinx VC1902 targets applications requiring both high AI compute and adaptable hardware:

ApplicationAI Engine RolePL Role
5G BeamformingFFT, filtering, matrix opsData formatting, control
Medical ImagingImage reconstruction, AISensor interfaces
Video AnalyticsObject detection, trackingVideo decode, preprocessing
Radar ProcessingSignal processing, CFARWaveform generation
Financial ServicesRisk modeling, NLPMarket data ingestion

Read more Xilinx FPGA Series:

Xilinx VCK5000 Development Card: Data Center AI Acceleration

The Xilinx VCK5000 brings the power of the Xilinx VC1902 to data center environments through a PCIe-based accelerator card format.

Xilinx VCK5000 Hardware Specifications

FeatureSpecification
DeviceXCVC1902 (400 AI Engines)
AI PerformanceUp to 145 INT8 TOPS
DSP Engines1,968
On-Card Memory16 GB DDR4
Host InterfacePCIe Gen4 x8
Power ConsumptionUp to 225W
Form FactorFull-height, half-length
CoolingActive (requires airflow)
Price~$2,745 USD

Xilinx VCK5000 Performance Benchmarks

The Xilinx VCK5000 has demonstrated impressive results in industry-standard benchmarks:

BenchmarkVCK5000 PerformanceNotes
ResNet50 (MLPerf)6,257 FPS offlineMLPerf Inference v1.0
ResNet50 (Server)5,921 FPSServer scenario
Compute Efficiency~90% of peak TOPSNear-zero dark silicon
vs. Nvidia T49% higher throughputSame benchmark conditions
Power Efficiency2× better TCO vs. GPUsAMD claims

Xilinx VCK5000 vs GPU Accelerators

AMD positions the Xilinx VCK5000 directly against GPU-based inference accelerators:

MetricXilinx VCK5000Nvidia T4Nvidia A10
Peak TOPS (INT8)145130250
Achieved TOPS %~90%~34-42%~34-42%
Effective TOPS~130~44-54~85-105
Power (TDP)75-225W70W150W
Form FactorFHHLLow-profileFull-height
Memory16 GB DDR416 GB GDDR624 GB GDDR6

The “dark silicon” advantage refers to the Xilinx VCK5000‘s ability to keep processing elements active rather than waiting for memory transfers—a fundamental efficiency advantage of the AI Engine architecture.

Xilinx VCK5000 Software Ecosystem

The Xilinx VCK5000 integrates with multiple software frameworks:

SoftwareFunction
Vitis AIModel compilation, quantization, optimization
Vitis Unified PlatformSystem development, kernel creation
XRT (Xilinx Runtime)Driver, APIs, device management
Mipsology ZebraDrop-in GPU replacement
Aupera VMSSVideo AI pipeline builder

Vitis AI enables data scientists to deploy TensorFlow, PyTorch, and Caffe models without FPGA expertise. The DPU (Deep Learning Processing Unit) IP handles neural network execution on the AI Engine array.

AI Edge Series: Power-Efficient Edge Inference

The Versal AI Edge series targets power-constrained edge applications requiring real-time AI inference with functional safety capabilities.

AI Edge Series Device Comparison

FeatureVE2002VE2302VE2602VE2802
AIE-ML Tiles83488152
Logic Cells117K329K593K899K
DSP Engines1926801,3121,968
BRAM5 Mb14 Mb27 Mb34 Mb
UltraRAM15 Mb44 Mb87 Mb130 Mb
GTYP Transceivers082032

AI Edge vs AI Core: Choosing the Right Series

CriterionAI Core SeriesAI Edge Series
Primary FocusMaximum performancePower efficiency
AI Engine TypeAIEAIE-ML
FP32 SupportYesNo
BFloat16 SupportNoYes
INT8 EfficiencyHighVery high
Video CodecNoYes (VDE)
Safety CertificationLimitedISO 26262, IEC 61508
Target MarketsCloud, 5G, data centerAutomotive, industrial, edge

VEK280 Evaluation Kit

The VEK280 enables development on the AI Edge series VE2802 device:

FeatureSpecification
DeviceXCVE2802
AIE-ML Tiles152
Memory12 GB LPDDR4 (192-bit)
PCIeGen4 x16
Video I/OHDMI 2.1 input/output
NetworkingSFP28, 40G Ethernet MAC
StorageMicroSD
Price~$6,995 USD

The AI Edge series delivers 4× AI performance per watt compared to leading GPUs, making it ideal for thermally-constrained deployments.

Deep Learning Processing Unit (DPU) Architecture

The DPU is AMD’s neural network accelerator IP that runs on the AI Engine array, providing a high-level abstraction for deploying trained models.

DPU Variants by Platform

DPU TypeTarget PlatformPrimary Compute
DPUCZDX8GZynq UltraScale+ MPSoCDSP slices in PL
DPUCVDX8HVersal AI Core (VCK5000)AI Engines
DPUCV2DX8GVersal AI Edge (VEK280)AIE-ML tiles

DPU Configuration Options

The DPU is highly configurable to balance performance and resource usage:

ParameterOptionsImpact
AI Engine Count64-400Throughput scaling
Batch Size1-16Latency vs throughput
PrecisionINT8, INT4Accuracy vs speed
Memory InterfaceDDR4, LPDDR4Bandwidth

Vitis AI Workflow

Deploying models on the DPU follows a straightforward flow:

StepToolOutput
1. TrainTensorFlow/PyTorchFP32 model
2. QuantizeVitis AI QuantizerINT8 model
3. CompileVitis AI CompilerXIR instructions
4. DeployVART (Vitis AI Runtime)Running inference

The quantization step typically reduces model size by 4× while maintaining accuracy within 1% of the original FP32 model.

Practical AI Engine Development

Programming Models

The AI Engine supports multiple development approaches:

ApproachLanguageTarget Developer
Vitis AI + DPUPython/C++Data scientists
AI Engine KernelsC/C++Algorithm engineers
Vitis Model ComposerMATLAB/SimulinkDSP engineers
RTL + HLSVerilog/VHDL/C++Hardware engineers

Performance Optimization Techniques

Achieving peak performance on the AI Engine requires careful optimization:

TechniqueBenefit
Data tilingMaximize local memory utilization
Ping-pong bufferingHide data transfer latency
Kernel vectorizationExploit SIMD parallelism
Graph optimizationMinimize inter-tile communication
Memory placementReduce bank conflicts

Research has shown that proper optimization can achieve 70-85% of theoretical peak throughput for common operations like GEMM and convolution.

Evaluation Platforms Comparison

Development Board Selection

If You Need…ChoosePrice
Maximum AI performanceVCK190 (VC1902)$13,195
Data center deploymentXilinx VCK5000$2,745
Edge AI evaluationVEK280 (VE2802)$6,995
Entry-level VersalVCK190 (with lower-tier device)Varies

Complete Platform Specifications

PlatformDeviceAI EnginesMemoryInterface
VCK190Xilinx VC1902400 AIEDDR4 SODIMM + ComponentFMC+, QSFP28
Xilinx VCK5000XCVC1902400 AIE16 GB DDR4PCIe Gen4 x8
VEK280VE2802152 AIE-ML12 GB LPDDR4FMC+, SFP28

Read more Xilinx Products:

Essential Resources

Official Documentation

ResourceURL
Versal AI Core Product Pagehttps://www.amd.com/en/products/adaptive-socs-and-fpgas/versal/ai-core-series.html
Versal AI Edge Product Pagehttps://www.amd.com/en/products/adaptive-socs-and-fpgas/versal/ai-edge-series.html
VCK5000 Product Pagehttps://www.xilinx.com/products/boards-and-kits/vck5000.html
AI Engine Architecture ManualAMD Document AM009
Vitis AI GitHubhttps://github.com/Xilinx/Vitis-AI
Vitis AI Documentationhttps://xilinx.github.io/Vitis-AI/

Technical References

ResourceContent
DS950Versal Architecture Overview
PG389DPUCVDX8G Product Guide
UG1076AI Engine Programming Guide
Hot Chips 31VC1902 Architecture Presentation

Frequently Asked Questions

What is the difference between Xilinx VC1902 and VCK5000?

The Xilinx VC1902 is the Versal AI Core device (the silicon chip), while the Xilinx VCK5000 is a complete PCIe accelerator card that contains the VC1902 device along with 16 GB DDR4 memory, power delivery, and PCIe Gen4 interface. The VCK190 evaluation kit also uses the Xilinx VC1902 but in a board format designed for development rather than data center deployment. For data center AI inference, choose the Xilinx VCK5000; for embedded development and prototyping, choose the VCK190.

How does the Xilinx VCK5000 compare to Nvidia GPUs for AI inference?

The Xilinx VCK5000 achieves approximately 90% utilization of its theoretical 145 INT8 TOPS, compared to 34-42% utilization typical of Nvidia GPUs in real AI workloads. This “near-zero dark silicon” advantage translates to 2× better total cost of ownership (TCO) according to AMD benchmarks. However, GPUs excel at training workloads and have a more mature software ecosystem. The Xilinx VCK5000 is optimized specifically for inference deployment.

Can I run my existing TensorFlow or PyTorch models on Versal?

Yes. Vitis AI provides a complete workflow for deploying models from TensorFlow, PyTorch, and Caffe frameworks. The process involves quantizing your FP32 model to INT8, compiling it for the DPU target, and deploying using Python or C++ APIs. Models from the Vitis AI Model Zoo (ResNet, YOLO, SSD, BERT, and many others) work out-of-the-box. Custom models may require layer compatibility verification—most standard CNN, RNN, and transformer operations are supported.

When should I choose AI Core vs AI Edge series?

Choose the AI Core series (with Xilinx VC1902 and Xilinx VCK5000) for maximum AI performance in cloud, data center, 5G infrastructure, and applications requiring floating-point precision in the AI Engine. Choose the AI Edge series for power-constrained edge deployments, automotive applications requiring ISO 26262 certification, or applications where BFloat16 precision and video decoder integration provide advantages. The AI Edge series delivers better performance per watt but lower absolute performance than AI Core.

What is the learning curve for AI Engine development?

For AI inference using pre-built DPU configurations, the learning curve is minimal—data scientists can deploy models using Python APIs within days. For custom AI Engine kernel development, expect 2-4 weeks to become productive with C/C++ kernel coding. For full system optimization including custom DPU configurations and PL integration, plan for 1-3 months. AMD provides extensive tutorials, documentation, and reference designs to accelerate learning at each level.

Conclusion: Choosing Your AI Acceleration Path

The Versal AI Core and AI Edge series provide fundamentally different AI acceleration approaches compared to GPU-based solutions. The AI Engine architecture in the Xilinx VC1902 eliminates the memory bandwidth bottlenecks that limit GPU efficiency, achieving near-theoretical performance in production workloads.

For data center deployment, the Xilinx VCK5000 offers a compelling alternative to GPU accelerators with proven 2× TCO advantages. For edge applications requiring power efficiency and functional safety, the AI Edge series with AIE-ML tiles delivers optimal performance per watt.

The key is matching your application requirements—performance, power, precision, safety, and deployment environment—to the appropriate Versal series and platform. Both AI Core and AI Edge series share common development tools, enabling skills and IP to transfer between platforms as your requirements evolve.

Next-Generation: Versal AI Edge Series Gen 2

AMD has announced the Versal AI Edge Series Gen 2, introducing significant architectural improvements over the first generation.

Gen 2 Key Improvements

FeatureGen 1Gen 2Improvement
Compute per Tile512 INT8 ops/clock1024 INT8 ops/clock
TOPS per WattBaselineUp to 3× higher
Processing SystemCortex-A72 + R5FCortex-A78AE + R5210× scalar compute
Memory SupportDDR4, LPDDR4DDR5, LPDDR5XHigher bandwidth
Data TypesINT8, INT4, BFloat16+ MX6, MX9Enhanced precision
Safety TargetASIL B/CASIL D / SIL 3Automotive-grade

The Gen 2 devices also include a hard image signal processor (ISP) and enhanced video codec unit (VCU) supporting HEVC and AVC 4K60 4:4:4 encoding—capabilities essential for vision AI applications.

Gen 2 Processing System

The enhanced processing system in Gen 2 devices provides substantial improvements:

ComponentGen 1Gen 2
Application Cores2× Cortex-A72Up to 8× Cortex-A78AE
Real-Time Cores2× Cortex-R5FUp to 10× Cortex-R52
Total DMIPs~20K~200K
Safety CertificationLimitedASIL D / SIL 3
GPUMali-400Mali-G78AE (4 cores)

Real-World Deployment Considerations

Power and Thermal Management

Deploying Versal devices in production requires careful attention to power and thermal design:

PlatformTypical PowerMaximum PowerThermal Solution
Xilinx VCK500075W225WActive cooling required
VCK19050-100W180WHeatsink + airflow
VEK28030-60W100WPassive possible

The AI Engine array can consume significant power under full load—monitor power consumption during development and budget appropriately for production deployments.

Memory Hierarchy Optimization

Effective AI Engine programming requires understanding the memory hierarchy:

Memory LevelSizeLatencyAccess Pattern
AI Engine Local32-64 KB1 cycleTile-local only
Shared Tile Memory128 KB addressable2-4 cyclesNeighbor tiles
Memory Tiles (AIE-ML)512 KB each5-10 cyclesArray-wide
PL BRAM/URAM34-130 Mb10-20 cyclesVia streaming
External DDR4-16 GB100+ cyclesVia NoC

Maximizing local memory utilization while minimizing external memory access is critical for achieving peak performance. Research has demonstrated 100% local memory utilization is achievable with careful buffer placement strategies.

Model Deployment Best Practices

ConsiderationRecommendation
Batch SizeStart with batch=1 for latency, increase for throughput
QuantizationUse PTQ first; fine-tune with QAT if accuracy drops >2%
Layer SupportVerify all layers compile before deployment
ProfilingUse Vitis Analyzer to identify bottlenecks
TestingValidate accuracy on representative dataset

Integration with Existing Infrastructure

The Xilinx VCK5000 integrates with standard data center infrastructure:

IntegrationSupport
Operating SystemUbuntu 18.04/20.04, CentOS 7/8
Container RuntimeDocker, Kubernetes
Cloud PlatformsAWS, Azure (via VMs)
ManagementXRT utilities, BEAM tool
MonitoringPower, temperature, utilization APIs

For production deployments, AMD provides XRT (Xilinx Runtime) which handles device management, memory allocation, and kernel execution through standard APIs.

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.