Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

XC6SLX16: Mid-Range Spartan-6 Specifications & Uses

The XC6SLX16 occupies a strategic position in the Spartan-6 family—offering significantly more resources than the entry-level XC6SLX9 while remaining more affordable than larger devices. For engineers designing embedded systems, industrial controls, or academic projects, this mid-range FPGA often represents the optimal balance between capability and cost. I’ve specified this device on multiple production designs where the XC6SLX9 ran out of headroom but the XC6SLX25 was overkill.

This guide covers the complete Xilinx Spartan 6 XC6SLX16 specifications, package options, performance characteristics, and practical applications to help you determine if this device fits your project requirements.

XC6SLX16 Overview and Positioning

The XC6SLX16 belongs to Xilinx’s Spartan-6 LX (logic-optimized) family, built on 45nm process technology. With 14,579 logic cells, it provides roughly 60% more logic capacity than the XC6SLX9 while consuming only marginally more power. This makes it particularly attractive for designs that need room to grow or require more complex signal processing.

Where XC6SLX16 Fits in the Spartan-6 Family

DeviceLogic CellsBlock RAMDSP SlicesPosition
XC6SLX43,840216 Kb8Entry-level
XC6SLX99,152576 Kb16Budget
XC6SLX1614,579576 Kb32Mid-range
XC6SLX2524,051936 Kb38Upper mid-range
XC6SLX4543,6612,088 Kb58High-density

The XC6SLX16 doubles the DSP slice count compared to the XC6SLX9 while maintaining the same block RAM capacity. This makes it well-suited for applications requiring more digital signal processing without necessarily needing additional memory.

XC6SLX16 Detailed Specifications

Core Logic Resources

ResourceQuantityNotes
Logic Cells14,579Equivalent logic gates
CLB Slices2,278Configurable Logic Blocks
Slice Registers18,224Flip-flops
Slice LUTs9,1126-input lookup tables
LUTs as Logic9,112Combinatorial functions
LUTs as Memory2,278Distributed RAM
Maximum Distributed RAM136 KbAcross all SLICEMs

Each CLB slice contains four 6-input LUTs and eight flip-flops. The Xilinx Spartan 6 XC6SLX16 includes three slice types: SLICEM (with distributed RAM capability), SLICEL (logic-only), and SLICEX (compact logic). Approximately 25% of slices are SLICEMs, enabling efficient distributed memory implementation.

Block RAM Resources

SpecificationValue
Block RAM Tiles32
Total Block RAM576 Kb
Maximum Data Width36 bits per port
RAM ConfigurationTrue dual-port
FIFO SupportYes, with built-in logic

The block RAM in the XC6SLX16 can be configured as:

ConfigurationDepth × Width
Single Port16K × 1, 8K × 2, 4K × 4, 2K × 9, 1K × 18, 512 × 36
Dual Port16K × 1, 8K × 2, 4K × 4, 2K × 9, 1K × 18, 512 × 36
CascadeMultiple blocks for deeper memories

DSP48A1 Slice Capabilities

The XC6SLX16 includes 32 DSP48A1 slices—double the count of the XC6SLX9. Each slice provides:

FeatureSpecification
Multiplier18 × 18 signed
Accumulator48-bit
Pre-adder18-bit (for symmetric filters)
Maximum Frequency250 MHz
Cascade CapabilityYes, for large filters/multipliers

The doubled DSP count makes the Xilinx Spartan 6 XC6SLX16 suitable for implementing:

  • Multiple FIR filter channels
  • Audio processing (multiple codecs)
  • Basic image processing algorithms
  • Digital down-converters
  • Servo control loops with complex calculations

Clock Management Resources

ResourceQuantityDescription
Clock Management Tiles2CMT blocks
DCMs per CMT2Digital Clock Managers
PLLs per CMT1Phase-Locked Loops
Total DCMs4Clock synthesis/conditioning
Total PLLs2High-frequency synthesis
Global Clock Networks16Low-skew distribution
Regional Clock Networks8Per-region clocking

The PLL frequency range spans 400 MHz to 1,080 MHz, enabling clock multiplication for high-speed internal logic. DCMs provide frequency synthesis, phase shifting, and clock conditioning for external interfaces.

I/O Resources and Capabilities

SpecificationCSG324FTG256CSG225CPG196
Maximum User I/O232186140106
I/O Banks4444
Differential Pairs92726347
Input-Only Pins6486

The XC6SLX16 supports over 40 I/O standards including:

CategoryStandards
Single-endedLVCMOS12/15/18/25/33, LVTTL
DifferentialLVDS, BLVDS, RSDS, TMDS, mini-LVDS
MemoryDDR/DDR2/DDR3, LPDDR, SSTL
LegacyPCI 33/66 MHz

Maximum I/O performance reaches 1,080 Mb/s for differential I/O—sufficient for video interfaces, high-speed data acquisition, and communication protocols.

Read more Xilinx FPGA Series:

XC6SLX16 Package Options

The XC6SLX16 is available in multiple packages to suit different board constraints:

PackagePinsBody SizeBall PitchMax I/ONotes
CSG32432415 × 15 mm0.8 mm232Maximum I/O, common choice
FTG25625617 × 17 mm1.0 mm186Easier assembly, good I/O
CSG22522513 × 13 mm0.8 mm140Compact footprint
CPG1961968 × 8 mm0.5 mm106Smallest package

All packages are BGA variants—there’s no TQFP option for the XC6SLX16, unlike the smaller XC6SLX9 which offers TQG144. This means production requires reflow soldering capability.

Package Selection Guidance

RequirementRecommended Package
Maximum I/OCSG324
Balanced I/O and sizeFTG256
Space-constrained designCPG196
Easier BGA assemblyFTG256 (1.0mm pitch)
Pin-compatible with XC6SLX25CSG324

The CSG324 package provides pin compatibility with larger Spartan-6 devices, enabling design migration without PCB changes.

Speed Grades and Operating Conditions

Available Speed Grades

Speed GradePerformancePower ModeTemperature Range
-3HighestStandardCommercial
-3NHighestStandardIndustrial
-2StandardStandardCommercial/Industrial
-1LLowestLow power (1.0V core)Commercial/Industrial

The XC6SLX16 in -3 speed grade achieves clock speeds exceeding 500 MHz for internal logic, though practical designs typically target 200–400 MHz depending on complexity.

Operating Temperature Ranges

GradeSuffixJunction Temperature
CommercialC0°C to +85°C
IndustrialI-40°C to +100°C

Power Supply Requirements

RailVoltageNotes
VCCINT1.2V (1.0V for -1L)Core logic
VCCAUX2.5V or 3.3VAuxiliary circuits
VCCO1.2V to 3.3VI/O bank voltage (per bank)

Static power consumption for the Xilinx Spartan 6 XC6SLX16 runs approximately 2.0 mA at VCCINT (quiescent), scaling with design complexity and clock frequency.

XC6SLX16 vs XC6SLX9 vs XC6SLX25

When selecting a Spartan-6 device, understanding the tradeoffs helps optimize cost and capability:

SpecificationXC6SLX9XC6SLX16XC6SLX25
Logic Cells9,15214,57924,051
CLB Slices1,4302,2783,758
Block RAM576 Kb576 Kb936 Kb
DSP Slices163238
CMTs222
Max User I/O200232266
TQFP AvailableYes (144-pin)NoNo
Relative Cost$$$$$$

When to Choose XC6SLX16

Select XC6SLX16 when:

  • XC6SLX9 is too small but XC6SLX25 is overkill
  • You need more DSP slices (32 vs 16)
  • Design requires 10,000–14,000 logic cells
  • Block RAM at 576 Kb is sufficient
  • Budget allows modest step up from XC6SLX9

Select XC6SLX9 instead when:

  • Design fits comfortably in 9,152 cells
  • TQFP package is required (hand soldering)
  • Absolute lowest cost is critical
  • 16 DSP slices are sufficient

Select XC6SLX25 instead when:

  • Design exceeds 14,000 logic cells
  • Additional block RAM (936 Kb) is needed
  • More than 232 I/O pins required
  • Future expansion headroom is important

Read more Xilinx Products:

Practical Applications for XC6SLX16

The XC6SLX16 finds use across diverse applications thanks to its balanced resource profile:

Industrial Control and Automation

ApplicationKey Resources Used
Motor drive controlDSP slices for PWM, LUTs for sequencing
PLC coprocessorBlock RAM for program storage, I/O for field signals
Sensor fusionDSP slices for filtering, LUTs for protocol handling
Industrial EthernetI/O for PHY interface, LUTs for protocol stack

The 32 DSP slices enable multi-axis servo control with real-time PID calculations running at high update rates.

Video and Display Processing

ApplicationResource Requirements
VGA controller~500 LUTs, timing generation
HDMI transmitterTMDS I/O, serialization logic
Video scalingDSP slices for interpolation
Frame bufferingExternal RAM + controller
OSD overlayBlock RAM for character data

The Xilinx Spartan 6 XC6SLX16 handles 720p video processing with appropriate external memory for frame buffers.

Communication Interfaces

InterfaceImplementation Notes
Gigabit Ethernet MAC~2,000 LUTs + external PHY
USB 2.0 device~3,000 LUTs + external PHY
SPI/I2C bridges~200–500 LUTs each
CAN controller~1,000 LUTs
Multi-channel UART~500 LUTs per channel

Educational and Development

The XC6SLX16 powers several popular development boards:

BoardFeaturesUse Case
Nexys 3 (Digilent)16MB Cellular RAM, Ethernet PHY, VGAAcademic training
QM_XC6SLX16_SDRAM256Mb SDRAM, expansion headersPrototyping
Various Chinese boardsSDRAM, SPI flash, peripheralsHobbyist/learning

The Nexys 3, featuring the XC6SLX16-CSG324C, became a standard academic platform for digital design courses, offering extensive I/O for experiments while providing enough logic for MicroBlaze soft processor implementations.

Memory Controller Block (MCB)

The XC6SLX16 includes two hard Memory Controller Blocks—a significant advantage for designs requiring external DRAM:

FeatureSpecification
Memory TypesDDR3, DDR2, DDR, LPDDR
Maximum Data Rate800 Mb/s (DDR3)
Interface Width4, 8, or 16 bits
Controller Count2 MCBs
ECC SupportOptional

The hard MCB dramatically simplifies DRAM interface design compared to soft controllers, reducing logic consumption and improving timing margins. Each MCB provides a multi-port interface with independent FIFO buffers.

Configuration and Programming

Configuration Modes

ModeDescriptionUse Case
Master SPIFPGA clocks external flashStandard boot-from-flash
Slave SPIExternal source clocks FPGAMicrocontroller-managed boot
Master BPIParallel flash (up to x16)Fast configuration
JTAGBoundary scan interfaceDevelopment, debugging
Slave SelectMAP8 or 16-bit parallelMulti-FPGA systems

Configuration File Sizes

FormatCompressedUncompressed
Bitstream (.bit)~1.4 MB~3.6 Mb
MCS/PROM fileVaries~3.6 Mb

Configuration time from SPI flash at 33 MHz CCLK takes approximately 100 ms—fast enough for most applications but consider BPI mode if faster startup is required.

Development Tools

The XC6SLX16 requires Xilinx ISE Design Suite (Vivado does not support Spartan-6):

ToolPurposeLicense
ISE Design Suite 14.7Synthesis, implementationWebPACK (free)
ISE Simulator (ISim)Behavioral/timing simulationIncluded
ChipScope ProOn-chip debuggingLicensed
PlanAheadFloorplanning, analysisIncluded
EDKMicroBlaze developmentLicensed

ISE 14.7 runs natively on Windows 7 or via virtual machine on Windows 10/11.

Useful Resources and Downloads

Official AMD/Xilinx Documentation

DocumentContent
DS160Spartan-6 Family Overview
DS162DC and AC Switching Characteristics
UG380Configuration User Guide
UG381SelectIO Resources
UG382Clocking Resources
UG383Block RAM Resources
UG384Configurable Logic Block
UG385Packaging and Pinouts
UG388Memory Controller User Guide
UG389DSP48A1 Slice User Guide

Software Downloads

  • ISE Design Suite 14.7 WebPACK — Free download from AMD/Xilinx
  • ISE Windows 10/11 Virtual Machine — Pre-configured Oracle VirtualBox image
  • Digilent Adept — Board programming software for Nexys 3 and similar

Development Board Resources

  • Digilent Nexys 3 — Reference manual, schematics, UCF files
  • QMTech XC6SLX16 — User manual, example projects
  • Generic Spartan-6 boards — GitHub repositories with pinouts and examples

Frequently Asked Questions

Is the XC6SLX16 still available for new designs?

Yes, the XC6SLX16 remains in production with AMD’s extended Spartan-6 lifecycle through at least 2030. However, lead times can be extended due to fab capacity constraints on the 45nm node. For new designs, evaluate whether Spartan-7 offers advantages for your specific requirements—though it lacks the hard memory controller present in Spartan-6.

What development board is best for learning with the XC6SLX16?

The Digilent Nexys 3 was the premier XC6SLX16 development platform for educational use. It’s now discontinued but available on the secondary market. Current alternatives include various Chinese-manufactured boards featuring the Xilinx Spartan 6 XC6SLX16 with SDRAM, VGA output, and expansion headers at budget-friendly prices.

Can I use Vivado with the XC6SLX16?

No, Vivado does not support Spartan-6 devices including the XC6SLX16. You must use ISE Design Suite 14.7, which is available for free as WebPACK edition. ISE can run on Windows 10/11 using AMD’s provided virtual machine image or with some installation workarounds on native installations.

How does XC6SLX16 power consumption compare to newer FPGAs?

The XC6SLX16 on 45nm technology consumes approximately 2× the power of equivalent Spartan-7 devices on 28nm. For battery-powered or thermally constrained applications, newer devices offer significant advantages. However, for line-powered industrial applications where the difference is negligible, the XC6SLX16 remains practical.

What’s the maximum logic utilization I should target?

For timing-critical designs, aim for 70–80% logic utilization on the XC6SLX16. Higher utilization makes place-and-route increasingly difficult, leading to timing failures or extended compile times. If your design consistently exceeds 80% utilization, consider stepping up to the XC6SLX25 for headroom.

Conclusion

The XC6SLX16 delivers a compelling mid-range option in the Spartan-6 lineup—14,579 logic cells, 32 DSP slices, and 576 Kb of block RAM provide substantial capability for industrial controls, video processing, communication interfaces, and educational applications. The hard memory controller blocks simplify DRAM integration, while the mature ISE toolchain offers reliable design flows despite its age.

For new designs, weigh the Xilinx Spartan 6 XC6SLX16 against Spartan-7 alternatives. The older device wins on cost for mature designs and applications requiring the hard MCB. Spartan-7 wins on power efficiency, tool support (Vivado), and long-term supply chain positioning.

Whether you’re maintaining existing products, developing cost-sensitive embedded systems, or learning FPGA development, the XC6SLX16 remains a capable and well-documented platform backed by extensive application knowledge accumulated over more than a decade of production use.

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.