The 12-Layer Via-in-Pad HDI PCB provides advanced routing capabilities for complex, densely populated electronic assemblies. Engineered for hardware developers and electronics engineers, this HDI PCB utilises via-in-pad plated over (VIPPO) technology to accommodate fine-pitch Ball Grid Arrays (BGAs) and micro-components. By moving vias directly into the surface lands, designers can significantly reduce parasitic inductance, improve thermal dissipation, and minimise the overall board footprint without compromising structural stability or signal integrity.

• Layer Count: 12-layer stackup for complex signal routing, isolating noise, and providing dedicated power/ground planes.

• Interconnect Technology: High Density Interconnect (HDI) structure utilising laser-drilled microvias, blind vias, and buried vias.

• Via-in-Pad Design: Epoxy-filled and copper-plated flat vias to ensure reliable, void-free BGA soldering.

• Material Specification: High-Tg FR4 or advanced laminates (e.g., Rogers, Megtron) to support high-speed digital signal transmission.

• Surface Finish: Electroless Nickel Immersion Gold (ENIG) standard, yielding extremely flat, oxidisation-resistant solder pads.

• Impedance Control: Precision routing tolerances engineered to maintain strict signal integrity across all internal and external layers.

This BGA-ready multilayer board is explicitly suited for demanding environments where spatial constraints and electrical performance are critical parameters:

• Telecommunications and 5G networking base stations

• Advanced medical imaging and diagnostic instrumentation

• Aerospace and defence avionics modules

• High-performance computing (HPC) and data centre servers

• Complex industrial control and automation systems

Ensure your next high-density electronics project meets exact specifications. Request a quote today to discuss your manufacturing requirements directly with our engineering team.