Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.
The average smartphone contains over 400 passive components at a 25:1 ratio to ICs. Moving even a fraction of those resistors and capacitors inside the PCB substrate dramatically improves performance and density—but only if you understand the specification that governs this technology.IPC-6017 is that specification, and its 2021 revision expanded the scope to include embedded active components as well.
IPC-6017, the Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry, defines the requirements for resistors, capacitors, and now active devices fabricated within PCB substrates. Whether you’re designing IoT wearables, military radar systems, or high-speed computing platforms, understanding this specification is essential for leveraging embedded component technology effectively.
IPC-6017 is the IPC specification that establishes qualification and performance requirements specifically for embedded circuitry within printed boards. Unlike IPC-6012 or IPC-6013 which cover the overall board construction, IPC-6017 focuses exclusively on the embedded passive and active elements themselves.
IPC-6017 Standard Overview
Attribute
Details
Full title
Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
The specification is designed to work alongside other IPC-6010 series documents. You still use IPC-6012 for rigid board requirements, but IPC-6017 adds the specific criteria for embedded components within that board.
The electronics industry has moved beyond embedding only passive elements. Modern advanced packaging now embeds:
Component Type
Examples
Discrete actives
Transistors, diodes
Integrated circuits
Controllers, drivers
Sensors
Temperature, strain, pressure
MEMS devices
Accelerometers, microphones
Optical components
LEDs, photodetectors
IPC-6017A addresses all these by defining electrical, mechanical, and environmental requirements specific to embedded active circuitry.
Understanding Embedded Passive Technology
Before diving into IPC-6017 requirements, it’s important to understand what embedded passive technology actually involves and why it matters.
What Are Embedded Passives?
Embedded passives are resistive and capacitive elements fabricated directly within the PCB substrate layers, rather than mounted on the surface as discrete SMT components.
Characteristic
Surface Mount
Embedded
Location
Board surface
Internal layers
Form factor
Discrete packages
Patterned materials
Solder joints
Required
None
Replacement
Possible
Not possible
Parasitic effects
Higher
Lower
Routing area
Reduced
Preserved
Benefits of Embedded Components
Benefit
Improvement
Space savings
Frees surface area for active components
Signal integrity
Reduced parasitic inductance by 50%+
Power integrity
AC impedance reduced to 10 milliohms
EMI reduction
Less loop area, better shielding
Reliability
Fewer solder joints (failure points)
Thermal performance
3× better heat dissipation than traditional
High-frequency performance
Enables signals above 1 GHz
Trade-offs to Consider
Challenge
Consideration
Non-replaceable
Defective embedded components cannot be reworked
Design complexity
Requires specialized CAD tools and expertise
Tolerance control
Tighter process control required
Testing
Must test before final lamination
Limited values
Not all R/C values achievable
Supplier capability
Not all fabricators offer this technology
Embedded Resistor Types and Requirements
IPC-6017 addresses two primary methods for creating embedded resistors: formed (integral) and placed (discrete).
Formed Resistor Technologies
Formed resistors are created by patterning resistive materials laminated to copper foil.
IPC-6017 applies the standard three-class system defined in IPC-6011, with specific requirements for embedded components.
Class Definitions for Embedded Components
Class
Name
Embedded Component Applications
Class 1
General Electronic Products
Consumer embedded passives, cost-driven
Class 2
Dedicated Service Electronic Products
Industrial, automotive, communications
Class 3
High Reliability Electronic Products
Military, aerospace, medical, life-critical
Class Requirements Comparison
Requirement
Class 1
Class 2
Class 3
Resistance tolerance
±20%
±10%
±5% or tighter
Capacitance tolerance
±20%
±10%
±5% or tighter
Testing frequency
Sample
Lot sample
100% or per lot
Thermal cycling
Basic
Extended
Full qualification
Documentation
Minimal
Standard
Full traceability
Tolerance and Testing Requirements
One of the critical challenges with embedded components is achieving and verifying required tolerances.
Embedded Resistor Tolerance
Stage
Typical Tolerance
Notes
As-formed
±10-15%
Without trimming
After laser trim
±1%
Trimmed before lamination
After lamination
±1-2%
May shift slightly
After assembly
±1-2%
Thermal effects
Tolerance Improvement Methods
Method
Description
Achievable Tolerance
Laser trimming
Ablate resistor to adjust value
±1%
Process control
Tight material and etch control
±5%
Design margin
Use wider tolerance components
Design dependent
Active calibration
Digital correction in firmware
Application dependent
Testing Requirements
Test
Purpose
Method Reference
Resistance measurement
Verify value and tolerance
IPC-TM-650
Capacitance measurement
Verify value and tolerance
IPC-TM-650
Insulation resistance
Verify isolation
IPC-TM-650 2.6.3
Thermal stress
Reliability verification
IPC-TM-650
Microsection
Internal structure
IPC-TM-650 2.1.1
High-potential test
Dielectric integrity
Per specification
How IPC-6017 Works with Other IPC-6010 Specifications
Understanding the relationship between IPC-6017 and other specifications is essential for proper callout.
Specification Callout Example
A drawing might specify:
Element
Specification
Base board
IPC-6012 Class 2
Embedded resistors
IPC-6017A Class 2
Resistor material
IPC-4811, OhmegaPly 25 Ω/sq
Embedded capacitors
IPC-6017A Class 2
Capacitor material
IPC-4821, FaradFlex
Combined Requirements
Aspect
Primary Specification
Embedded Components
Overall board construction
IPC-6012/6013/6015/6018
N/A
Plated through holes
IPC-6012/6013/6015/6018
N/A
Conductor requirements
IPC-6012/6013/6015/6018
IPC-6017 for resistor elements
Embedded R/C/Active
N/A
IPC-6017
Embedded component materials
N/A
IPC-4811, IPC-4821
Design Considerations for Embedded Components
Successful embedded component implementation requires early design planning.
Design Flow Differences
Traditional Design
Embedded Component Design
Select parts from catalog
Design component values
Place on top/bottom layer
Assign to internal layers
Standard pad patterns
Custom geometry patterns
Auto-route connections
Manual routing to embedded elements
Silk screen designators
No external marking
Key Design Guidelines
Guideline
Recommendation
Layer assignment
Dedicate internal layers for embedded components
Resistor geometry
Length/width ratio determines value
Keep-out zones
No vias through embedded components
Test access
Provide probe points before lamination
Thermal relief
Manage heat from power resistors
Tolerance stacking
Account for cumulative variation
Frequently Asked Questions About IPC-6017
What is the difference between IPC-6017 and IPC-6012?
IPC-6012 is the base specification for rigid printed boards covering the overall board construction, plating, conductors, and general acceptance criteria. IPC-6017 is a supplemental specification that addresses only the embedded passive and active circuitry within the board. When you have a rigid board with embedded resistors or capacitors, you specify both: IPC-6012 for the board itself and IPC-6017 for the embedded components. IPC-6017 doesn’t replace IPC-6012—it adds specific requirements for embedded elements that IPC-6012 doesn’t cover.
Can embedded components be repaired if they fail?
No, embedded components cannot be repaired or replaced after the board is laminated. This is fundamentally different from surface-mount components that can be reworked. For this reason, IPC-6017 emphasizes testing embedded components before final lamination. Resistors are typically measured and laser-trimmed to value before the layers are stacked and pressed. If an embedded component is defective, the entire board must be scrapped. This non-reparability means embedded component technology requires tighter process control and quality assurance than traditional SMT assembly.
What tolerances are achievable for embedded resistors?
As-formed embedded resistors typically achieve ±10-15% tolerance due to material and processing variations. Using laser trimming before lamination, tolerances of ±1% are routinely achievable. After lamination and thermal processing, values may shift slightly, so ±1-2% is a practical specification for finished boards. For comparison, standard SMT chip resistors are available in ±0.1% tolerance, so embedded resistors are generally used for applications where ±1% is acceptable, or where circuit design can accommodate or digitally calibrate for wider tolerances.
What changed in IPC-6017A that designers should know about?
IPC-6017A (August 2021) dramatically expanded the specification scope from 10 pages to 28 pages, primarily by adding requirements for embedded active components. The original IPC-6017 covered only passive elements (resistors and capacitors). The A revision now addresses embedded integrated circuits, discrete semiconductors, sensors, MEMS devices, and optical components. If you’re designing boards with embedded ICs or sensors—increasingly common in IoT, medical, and automotive applications—IPC-6017A provides the qualification framework that didn’t previously exist.
What materials are commonly used for embedded resistors and capacitors?
For embedded resistors, the most common materials are OhmegaPly (thin-film nickel-phosphorus from Ohmega Technologies) and Ticer TCR (thin-film nickel-chrome-aluminum-silicon). These materials are laminated to copper foil and patterned using standard PCB processes. For embedded capacitors, FaradFlex (polymer composite from Oak-Mitsui) and 3M C-Ply (ceramic-filled polymer) are widely used. These high-dielectric-constant materials are placed between power and ground planes to create distributed decoupling capacitance. Material selection depends on required values, tolerances, and frequency performance.
IPC-6017 provides the essential framework for qualifying and specifying embedded passive and active circuitry within printed circuit boards. With the 2021 revision expanding scope to include active components, this specification has become increasingly relevant as the industry moves toward more integrated packaging solutions.
Key takeaways:
IPC-6017 supplements, doesn’t replace – Use alongside IPC-6012/6013/6015/6018
IPC-6017A added active components – Major 2021 expansion beyond just R/C
Embedded passives are mature – OhmegaPly, FaradFlex in production since 1970s
Tolerance requires trimming – Laser trim achieves ±1%, as-formed is ±10-15%
No rework possible – Test before lamination is critical
Material specs matter – Reference IPC-4811 (resistors) and IPC-4821 (capacitors)
Whether you’re designing compact IoT devices or high-reliability military systems, IPC-6017 ensures your embedded components meet the electrical, mechanical, and environmental requirements needed for reliable performance.
Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Notes: For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.
