XC7A200T: Largest Artix-7 FPGA Specifications & Applications

Introduction to the XC7A200T FPGA

When you need serious FPGA horsepower without stepping up to Kintex-7 pricing, the XC7A200T is where you look. As the flagship device in AMD’s (formerly Xilinx) Artix-7 family, this chip packs over 215,000 logic cells into a cost-optimized package that’s become a favorite for video processing, telecommunications, and industrial applications.

I’ve worked with the Artix-7 XC7A200T on several production boards over the years, and what consistently impresses me is how AMD managed to deliver this much logic density while keeping power consumption reasonable. Built on a 28nm high-performance low-power (HPL) process, the XC7A200T consumes roughly 50% less power than equivalent capacity devices from the previous 45nm generation. That matters when you’re trying to keep your thermal budget under control.

The XC7A200T isn’t just a larger version of the XC7A100T—it’s architecturally optimized for high-throughput applications. With 740 DSP slices, over 13 Mb of block RAM, and up to 16 GTP transceivers depending on package, this device handles compute-intensive workloads that would choke smaller FPGAs. Whether you’re building a video encoder, a software-defined radio, or a high-speed data acquisition system, the XC7A200T provides the resources to get it done.

XC7A200T Core Specifications

Let’s examine the complete resource breakdown for the XC7A200T. These numbers represent the maximum available in the Artix-7 family:

Parameter	XC7A200T Value
Logic Cells	215,360
Slices	33,650
6-Input LUTs	134,600
CLB Flip-Flops	269,200
Block RAM (36Kb blocks)	365 (13,140 Kb total)
Distributed RAM	2,888 Kb
DSP48E1 Slices	740
Clock Management Tiles (CMTs)	10 (each with 1 PLL + 1 MMCM)
GTP Transceivers	4-16 (package dependent)
Maximum Transceiver Speed	6.6 Gb/s
Process Technology	28nm HPL
XADC (Analog-to-Digital)	Dual 12-bit 1 MSPS ADC
PCIe Support	Gen2 x4
Maximum User I/O	500 (FFG1156 package)
I/O Banks	10
Core Voltage (VCCINT)	1.0V nominal

Comparison: XC7A200T vs Other Artix-7 Devices

To put the XC7A200T’s capabilities in perspective, here’s how it stacks up against other popular Artix-7 devices:

Resource	XC7A75T	XC7A100T	XC7A200T	Increase (100T→200T)
Logic Cells	75,520	101,440	215,360	2.1×
Slices	11,800	15,850	33,650	2.1×
Block RAM (Kb)	3,780	4,860	13,140	2.7×
DSP Slices	180	240	740	3.1×
Max User I/O	300	300	500	1.7×
GTP Transceivers	8	8	16	2.0×

The jump from XC7A100T to XC7A200T is substantial. You’re getting more than double the logic, nearly triple the DSP slices, and 2.7 times the block RAM. For designs that outgrow the XC7A100T, the XC7A200T often provides enough headroom to avoid jumping to the more expensive Kintex-7 family.

DSP Processing Capabilities

The 740 DSP48E1 slices in the Artix-7 XC7A200T deserve special attention. Each slice contains a 25×18 signed multiplier, a 48-bit accumulator, and a pre-adder for efficient filter implementations. At the -3 speed grade, these slices can operate at up to 628 MHz, delivering impressive throughput:

Speed Grade	Max Frequency	DSP Performance
-1	464 MHz	~686 GMAC/s
-2	550 MHz	~814 GMAC/s
-3	628 MHz	~929 GMAC/s

This DSP capability makes the XC7A200T particularly well-suited for signal processing applications like FIR/IIR filters, FFT implementations, video scaling algorithms, and baseband processing in software-defined radios.

Understanding Artix-7 XC7A200T Part Numbers

Decoding AMD part numbers is essential for specifying the correct device. Here’s how to interpret a typical XC7A200T part number:

Example: XC7A200T-2FBG676I

Segment	Value	Meaning
Family	XC7A	Xilinx 7-series Artix
Density	200T	~200K logic cells (largest Artix-7)
Speed Grade	-2	Performance level (1=standard, 2=high, 3=highest)
Package	FBG676	Flip-chip BGA, 676 balls
Temperature	I	Industrial (-40°C to +100°C)

Speed Grade Selection for XC7A200T

Choosing the right speed grade affects both performance and cost:

-1 Speed Grade: Entry-level performance suitable for designs under 464 MHz. Best choice when timing isn’t critical or when you’re optimizing for lowest unit cost in high-volume production.

-2 Speed Grade: The mainstream choice for most production designs. Supports internal clocks up to 550 MHz and provides a good balance between performance and cost. This is what you’ll find on most development boards.

-3 Speed Grade: Maximum performance at premium pricing. Required only when your design has critical timing paths that won’t meet requirements at -2 speeds. The additional 78 MHz headroom (628 MHz vs 550 MHz) can make the difference in demanding applications.

Temperature Grade Options

Grade	Suffix	Junction Temperature	Typical Applications
Commercial	C	0°C to +85°C	Consumer electronics, lab equipment
Industrial	I	-40°C to +100°C	Factory automation, outdoor systems
Defense	Q	-40°C to +125°C	Military, ruggedized equipment

For most industrial and professional applications, the I (Industrial) grade is the standard choice, offering the widest operating range while remaining cost-effective.

XC7A200T Package Options and Pin Compatibility

The XC7A200T is available in four BGA packages, each optimized for different design requirements:

Package	Size (mm)	Ball Pitch	User I/Os	GTP Transceivers	I/O Banks
SBG484	19 × 19	0.8mm	285	4	6
FBG484	23 × 23	1.0mm	285	4	6
FBG676	27 × 27	1.0mm	400	8	8
FFG1156	35 × 35	1.0mm	500	16	10

Package Selection Guidelines

SBG484 Package (19×19mm, 0.8mm pitch): The smallest XC7A200T option. The fine 0.8mm ball pitch requires HDI PCB technology with microvias for full signal breakout. Choose this when board space is severely constrained, but be prepared for higher PCB fabrication costs. The Nexys Video development board uses this package.

FBG484 Package (23×23mm, 1.0mm pitch): Same ball count as SBG484 but with friendlier 1.0mm pitch that works with standard 6-layer PCB stackups. This is often the sweet spot for production designs—you get the same I/O count in a package that’s easier to route. The “FB” designation indicates flip-chip construction with better thermal and electrical characteristics.

FBG676 Package (27×27mm, 1.0mm pitch): Mid-range option with 400 user I/Os and 8 GTP transceivers. Choose this when you need wide parallel buses (like dual DDR3 channels) or multiple high-speed serial links. An 8-layer PCB is typically sufficient for clean routing.

FFG1156 Package (35×35mm, 1.0mm pitch): Maximum I/O density with 500 user pins and all 16 GTP transceivers. This package is for designs requiring the most connectivity—multiple PCIe links, wide memory interfaces, and numerous external peripherals. Plan for a 10+ layer board and careful power integrity analysis.

Footprint Compatibility Notes

Unlike smaller Artix-7 devices where FGG and FBG packages share footprints with other family members, the XC7A200T’s packages are largely unique to this device. The SBG484 package is footprint compatible with the XQ7A200T (defense-grade variant), but there’s no migration path to smaller Artix-7 devices within the same footprint.

If you anticipate potentially needing to scale down to XC7A100T or XC7A75T, you’ll need to design for their package pinouts from the start. This is one trade-off of choosing the largest device in the family.

Read more Xilinx FPGA Series:

Power Supply Design for the Artix-7 XC7A200T

Power supply design becomes more critical as FPGA density increases. The XC7A200T has specific requirements that differ from smaller family members.

Supply Voltage Requirements

Rail	Voltage	Tolerance	Purpose
VCCINT	1.0V	±5%	Core logic, routing fabric
VCCBRAM	1.0V	±5%	Block RAM arrays
VCCAUX	1.8V	±5%	Auxiliary circuits, JTAG, PLLs
VCCO	1.2V to 3.3V	±5%	I/O banks (HR banks: 1.2V-3.3V)
VMGTAVCC	1.0V	±3%	GTP transceiver analog circuits
VMGTAVTT	1.2V	±3%	GTP TX/RX termination
VCCADC	1.8V	±5%	XADC analog supply

Quiescent Current Requirements

The XC7A200T draws more quiescent current than smaller devices due to its larger die size:

Supply	XC7A200T Quiescent Current
ICCINTQ	340 mA
ICCAUXQ	50 mA
ICCOQ	40 mA per bank
ICCBRAMQ	80 mA

Compare this to the XC7A100T’s 170 mA ICCINTQ—the XC7A200T requires twice the quiescent core current. Plan your power supply accordingly, especially for battery-powered applications.

Power Sequencing

AMD specifies the following power-on sequence for minimum current draw and proper initialization:

1. VCCINT (can ramp simultaneously with VCCBRAM)
2. VCCBRAM
3. VCCAUX
4. VCCO (all banks)
5. VMGTAVCC and VMGTAVTT (for GTP transceivers)

Timing constraints:

• Ramp time: 0.2ms to 50ms from GND to 90% of target voltage
• VCCO minus VCCAUX must not exceed 2.625V for more than 500ms
• VMGTAVCC should not lag VCCINT by more than a few milliseconds

For the XC7A200T, I typically recommend a sequenced power solution using a dedicated PMIC or sequencer IC rather than relying on RC delays between regulators. The tighter timing requirements and higher currents make proper sequencing more critical than with smaller devices.

PCB Layout Guidelines for XC7A200T Designs

Routing a 200K+ logic cell FPGA successfully requires attention to signal integrity and power distribution. Here are practical guidelines based on production experience with the XC7A200T.

Layer Stack Recommendations

Package	Minimum Layers	Recommended Layers	Notes
SBG484	6	8	HDI required for 0.8mm pitch
FBG484	6	6-8	Standard multilayer sufficient
FBG676	8	8-10	Multiple power planes needed
FFG1156	10	12+	Complex power distribution required

A typical 8-layer stack for XC7A200T in FBG676 package:

• Layer 1: Top signal (high-speed, controlled impedance)
• Layer 2: Ground plane
• Layer 3: Signal/power
• Layer 4: Ground plane
• Layer 5: VCCINT power plane
• Layer 6: Signal
• Layer 7: Ground plane
• Layer 8: Bottom signal

Decoupling Capacitor Strategy

The XC7A200T requires more decoupling capacitance than smaller devices. AMD’s UG483 provides detailed guidance, but here’s a practical summary:

Bulk capacitors (within 1 inch of FPGA):

• 4× 47µF low-ESR ceramic or tantalum for VCCINT
• 2× 47µF for VCCAUX
• 2× 47µF for each VCCO bank

Mid-frequency decoupling (within 0.5 inch):

• 12-14× 4.7µF X5R ceramic for VCCINT
• 3× 4.7µF for VCCAUX
• 1× 4.7µF per VCCO bank

High-frequency decoupling (within 3mm of power pins):

• 12-14× 0.1µF for VCCINT
• 5× 0.1µF for VCCAUX
• 3-5× 0.1µF per VCCO bank
• Additional 0.01µF capacitors for GTP supplies

Placement priorities:

1. Place 0.1µF and 0.01µF capacitors as close to power pins as physically possible
2. Use multiple vias per capacitor pad to reduce inductance
3. Distribute capacitors evenly around the device perimeter
4. Don’t cluster all capacitors on one side

Read more Xilinx Products:

High-Speed Memory Interface Layout

The XC7A200T supports DDR3/DDR3L interfaces up to 1,066 Mb/s (with external VREF) across multiple banks. For reliable operation:

• Keep total trace length under 4 inches from FPGA to DRAM
• Match DQ/DQS traces within 10ps per byte group
• Match address/control traces within 25ps across all bits
• Maintain 50Ω single-ended impedance
• Use 100Ω differential impedance for DQS pairs
• Route address/control in fly-by topology for multi-chip configurations

GTP Transceiver Layout Considerations

With up to 16 GTP transceivers available, proper high-speed serial layout is essential:

• Route TX/RX differential pairs as 100Ω impedance
• Keep pair length under 10 inches when possible
• Minimize via transitions (zero or one per pair is ideal)
• Use AC coupling capacitors (100nF typical) near the FPGA
• Place reference clock source close to MGTREFCLK pins
• Isolate GTP power planes from noisy digital supplies
• Provide adequate ground stitching around transceiver routing

Development Boards Featuring the XC7A200T

Digilent Nexys Video

The premier development board for the Artix-7 XC7A200T is the Digilent Nexys Video, specifically designed for audio/video processing applications.

Key specifications:

• FPGA: XC7A200T-1SBG484C
• Memory: 512 MB DDR3 (16-bit bus)
• Video: Mini DisplayPort output, 3× HDMI ports (2 sink, 1 source)
• Audio: 24-bit Analog Devices audio codec
• Storage: 32 MB Quad-SPI flash, microSD slot
• Connectivity: Gigabit Ethernet, USB-UART, USB-HID host
• Expansion: FMC LPC connector, 4× Pmod ports
• User I/O: 8 switches, 8 LEDs, 5 buttons, 128×32 OLED display

Price: Approximately $480-500 (academic pricing available)

The Nexys Video is purpose-built for video processing development. Its combination of HDMI I/O, DisplayPort output, and the XC7A200T’s substantial block RAM (13+ Mb) makes it ideal for frame buffering, video encoding/decoding, and real-time image processing projects.

ALINX AC7A200 System-on-Module

For production-oriented development, ALINX offers the AC7A200 SoM featuring the XC7A200T:

• FPGA: XC7A200T-2FBG484I
• Memory: 1 GB DDR3 (32-bit bus)
• Flash: 16 MB Quad-SPI
• Transceivers: 4× GTP at 6.6 Gb/s
• Form factor: 60×60mm module with board-to-board connectors
• Temperature: Industrial grade (-40°C to +85°C)

This SoM approach lets you focus on your carrier board design while leveraging a proven FPGA module with DDR3 and configuration already validated.

Typical Applications for the XC7A200T

The XC7A200T’s combination of high logic density, substantial DSP resources, and abundant block RAM makes it suitable for demanding applications.

Video and Image Processing

This is where the Artix-7 XC7A200T truly excels. The 13+ Mb of block RAM can buffer multiple 1080p frames, while 740 DSP slices handle real-time filtering, scaling, and color processing:

• 4K video frame grabbers and capture cards
• Real-time video encoding (H.264/H.265 assist)
• Machine vision cameras with on-board preprocessing
• Medical imaging systems (ultrasound, endoscopy)
• Multi-channel video switchers and compositors
• Image enhancement and noise reduction pipelines

Telecommunications and Networking

The available GTP transceivers enable high-speed serial protocols:

• Software-defined radio (SDR) baseband processing
• 5G small cell base station implementations
• CPRI/OBSAI fronthaul interfaces
• Digital predistortion (DPD) and crest factor reduction (CFR)
• Protocol conversion bridges
• Packet processing and deep packet inspection

Industrial Automation and Control

High I/O count and deterministic timing support industrial applications:

• Multi-axis motion control systems
• High-channel-count data acquisition
• Industrial Ethernet gateways (EtherCAT, PROFINET, Ethernet/IP)
• PLC and DCS controller implementations
• Power electronics control (inverters, motor drives)

Test and Measurement

The XC7A200T provides the processing power for sophisticated instrumentation:

• High-speed digitizers and oscilloscope front-ends
• Arbitrary waveform generators
• Protocol analyzers (PCIe, USB, SATA)
• Automated test equipment (ATE)
• RF signal analysis and generation

Aerospace and Defense

With proper screening (Q or M grade), the XC7A200T serves ruggedized applications:

• Radar signal processing
• Electronic warfare systems
• Satellite communication modems
• Avionics displays and processing
• Unmanned vehicle control systems

Development Tools and Software Ecosystem

The XC7A200T is fully supported by AMD’s Vivado Design Suite, including the free WebPACK edition. This is a significant advantage—full development capability without licensing costs.

Vivado WebPACK Support

Feature	WebPACK (Free)	Design Edition	System Edition
Synthesis & Implementation	✓	✓	✓
Integrated Logic Analyzer (ILA)	✓	✓	✓
IP Integrator (Block Design)	✓	✓	✓
Memory Interface Generator (MIG)	✓	✓	✓
Partial Reconfiguration	—	✓	✓
High-Level Synthesis (HLS)	—	—	✓

Key IP Cores for XC7A200T

AMD provides validated IP cores that accelerate development:

• MIG (Memory Interface Generator): DDR3/DDR3L controllers with calibration
• PCIe IP: Gen2 x4 endpoint and root complex
• Gigabit Ethernet MAC: 10/100/1000 Mbps with GMII/RGMII
• AXI Interconnect: Standard bus infrastructure for SoC designs
• Video Processing: Scaler, deinterlacer, color space converter
• MicroBlaze: 32-bit soft processor for embedded applications

MicroBlaze Soft Processor

The XC7A200T’s logic resources easily accommodate MicroBlaze embedded processors. A typical configuration uses 2,000-4,000 LUTs depending on features enabled. With 215K logic cells available, you can implement multiple MicroBlaze cores alongside substantial custom logic—useful for complex SoC designs that need both hardware acceleration and software flexibility.

Useful Resources and Documentation

Essential AMD/Xilinx Documentation

Document	Number	Description
7 Series Overview	DS180	Device comparison, architecture summary
Artix-7 Data Sheet	DS181	DC/AC specifications, timing parameters
Configuration User Guide	UG470	Bitstream loading, boot modes, encryption
SelectIO User Guide	UG471	I/O standards, LVDS, termination
Clocking Resources	UG472	PLLs, MMCMs, clock distribution
Memory Resources	UG473	Block RAM, distributed RAM, FIFOs
Packaging and Pinout	UG475	Package drawings, pinout tables
GTP Transceivers	UG482	High-speed serial configuration
PCB Design Guide	UG483	Layout guidelines, decoupling

Download Links

Vivado Design Suite: https://www.xilinx.com/support/download.html

Package Pinout Files: https://www.amd.com/en/products/adaptive-socs-and-fpgas/fpga/artix-7.html#tabs-21bab15aab-item-11b84e6cab-tab

Xilinx Power Estimator (XPE): https://www.xilinx.com/power

7 Series Documentation Portal: https://docs.amd.com/r/en-US/ug474-7series-clb

Nexys Video Reference: https://digilent.com/reference/programmable-logic/nexys-video/start

Community and Support

AMD Support Forums: https://adaptivesupport.amd.com

Digilent Forums (for Nexys Video): https://forum.digilent.com

FPGA Reddit Community: https://reddit.com/r/FPGA

Frequently Asked Questions (FAQs)

What makes the XC7A200T different from the XC7A100T?

The XC7A200T offers significantly more resources: 2.1× the logic cells (215K vs 101K), 3.1× the DSP slices (740 vs 240), 2.7× the block RAM (13.1 Mb vs 4.9 Mb), and double the maximum GTP transceivers (16 vs 8). However, the XC7A200T uses different package pinouts and requires more power, so it’s not a drop-in upgrade. If your design fits in the XC7A100T, it’s usually more cost-effective to stay there. The XC7A200T is for designs that genuinely need the additional resources.

Can the XC7A200T handle 4K video processing?

Yes, the XC7A200T is well-suited for 4K video applications. The 13+ Mb of block RAM can buffer approximately two full 1080p frames or significant portions of a 4K frame for processing pipelines. The 740 DSP slices handle computationally intensive tasks like scaling, color correction, and filtering at 4K resolutions. For 4K60 applications, you’ll need to carefully architect your datapath and may require external frame buffers via DDR3, but the FPGA has the processing horsepower for real-time 4K work.

What PCIe configurations does the XC7A200T support?

The Artix-7 XC7A200T supports PCI Express Gen2 with up to x4 lane configurations using the integrated PCIe hard block. This provides approximately 2 GB/s of bidirectional bandwidth. The hard block handles link training, LTSSM state machine, and physical layer functions, while you implement the transaction layer logic in fabric. Both endpoint and root complex modes are supported. PCIe Gen3 is possible using soft IP, but this consumes significant logic resources and is less common with Artix-7.

Is the XC7A200T suitable for production designs, or is it mainly for prototyping?

The XC7A200T is absolutely suitable for production. Many commercial products ship with this device, including video processing equipment, telecommunications infrastructure, industrial controllers, and test instruments. The key considerations are cost (it’s more expensive than smaller Artix-7 devices) and power consumption (plan for 3-6W typical in active designs). For volume production, verify your supply chain—the XC7A200T has been subject to allocation constraints at times, so establish relationships with authorized distributors early.

How does the XC7A200T compare to Kintex-7 devices?

The XC7A200T bridges the gap between cost-optimized Artix-7 and performance-optimized Kintex-7. The smallest Kintex-7 (XC7K70T) has fewer logic cells but faster transceivers (GTX at 10.3+ Gb/s vs GTP at 6.6 Gb/s) and higher-performance I/O banks. If your design requires transceiver speeds above 6.6 Gb/s or needs HP (high-performance) I/O banks for source-synchronous interfaces above 1.2 Gb/s, Kintex-7 is the better choice. For cost-sensitive applications with moderate I/O speeds, the XC7A200T delivers more logic per dollar than entry-level Kintex-7 devices.

Conclusion

The XC7A200T stands as the most capable member of the Artix-7 family, offering a compelling combination of logic density, DSP horsepower, and connectivity options. With 215K logic cells, 740 DSP slices, 13+ Mb of block RAM, and up to 16 high-speed transceivers, it addresses applications that smaller Artix-7 devices simply cannot handle.

For engineers working on video processing, telecommunications, or high-channel-count industrial systems, the Artix-7 XC7A200T provides a cost-effective path to high-performance designs without stepping up to Kintex-7 pricing. The free Vivado WebPACK support, mature IP ecosystem, and proven silicon make it a low-risk choice for both prototyping and production.

Key recommendations for XC7A200T designs:

• Select the FBG676 package for most applications—it balances I/O count and routing complexity
• Use -2 speed grade unless timing analysis proves insufficient
• Plan for 6-10W power budget in high-utilization designs
• Budget adequate PCB layers (8 minimum for FBG676, 10+ for FFG1156)
• Leverage the Nexys Video board for early prototyping before committing to custom hardware

When your design demands serious FPGA resources at a reasonable price point, the XC7A200T delivers. It’s the workhorse of the Artix-7 family for good reason.

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