When engineering dense, highly functional devices, routing space is at a premium. A custom Multilayer HDI PCB provides the required miniaturisation and signal performance for sophisticated electronics. Procurement managers and hardware developers rely on this HDI PCB architecture to integrate fine-pitch components, complex BGA packages, and demanding circuit designs into tight form factors without compromising electrical stability.
Key Features of our Multilayer HDI PCB
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Custom Build-Up Structures: Configurations including 1+N+1, 2+N+2, 3+N+3, and any-layer topologies.
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Advanced Microvia Technology: Blind, buried, and stacked microvias for optimal routing density and reduced layer counts.
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Material Selection: Options include standard FR4, High-Tg FR4, Rogers, and custom low-loss laminates to support high-frequency signals.
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Trace Width and Spacing: Precision etching capabilities down to 3 mil / 3 mil (0.075 mm).
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Compliance and Standards: Manufactured to strict IPC Class 2 or IPC Class 3 standards, fully RoHS compliant.
Applications
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Telecommunications: Networking infrastructure, switches, and high-speed routers.
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Medical Devices: Advanced diagnostics, monitoring tools, and portable imaging equipment.
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Automotive: ADAS sensors, LiDAR modules, and complex infotainment systems.
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Aerospace and Defence: Ruggedised avionics and communication modules.
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Consumer Electronics: Wearables, tablets, and IoT devices.
Why Choose PCBSYNC
PCBSYNC is a professional PCB fabrication, PCBA, and EMS manufacturer delivering precision-built electronics for aerospace, medical, automotive, industrial, and smart energy applications. We handle everything from rapid prototyping to mass production — including rigid, flexible, and rigid-flex PCBs, full turnkey assembly, component sourcing, AOI and X-ray inspection, and OEM/ODM support. Reliable boards. Consistent quality. From prototype to production — PCBSYNC.
Ready to advance your next hardware project? Request a comprehensive quote to begin discussing your layer-count and build-up requirements today.
