DuPont Pyralux AP9242R: Engineer’s Complete Guide to 2 oz RA Copper / 4 mil PI for Multilayer Rigid-Flex

If you’ve been designing a multilayer rigid-flex board that carries both high-speed signals and heavy power traces — and you’re staring at a material selection decision that 1 oz / 2 mil flex simply can’t satisfy — DuPont Pyralux AP9242R deserves a serious look. This construction brings 2 oz (70 µm) rolled-annealed copper together with a 4 mil (100 µm) all-polyimide adhesiveless dielectric, and the combination lands squarely in the design space where multilayer rigid-flex boards need real current-carrying capacity, tightly controlled impedance on power flex layers, and the thermal resilience to survive aggressive reflow and field-operating environments.

This article covers everything you need from the ground up: the full part number decode, complete specification tables, the engineering rationale behind the 4 mil core choice, how AP9242R slots into the broader Pyralux AP family, real multilayer rigid-flex application contexts, stackup design guidance, fabrication-critical rules, and a competitive comparison. Search intent research shows most engineers landing on this page are either evaluating whether AP9242R is the right step up from a thinner core, or building a multilayer power rigid-flex stackup and need the spec data to complete it. Both needs are addressed below.

Decoding the DuPont Pyralux AP9242R Part Number

DuPont’s Pyralux AP naming convention encodes the full construction in the product code. Once you understand the pattern, you can read any AP part number without a catalog.

Code Segment	Meaning	AP9242R Decoded
AP	All-Polyimide, adhesiveless construction	Kapton-type polyimide, no adhesive between Cu and dielectric
9	Double-sided copper clad	Copper on both faces
2	Copper foil weight designator	2 oz/ft² (70 µm)
4	Dielectric thickness designator	4 mil (100 µm) polyimide
2	Layer structure designator	Double-sided clad
R	Copper foil type	Rolled-Annealed (RA) copper

The “R” suffix distinguishes this from AP9242E (electro-deposited copper) and AP9242D (double-treated RA copper). For multilayer rigid-flex work combining power distribution with any flex cycling or high-frequency routing, rolled-annealed copper is the correct specification — its laminar grain structure delivers both the flex endurance and the reduced surface roughness that the “E” variant cannot match.

DuPont Pyralux AP9242R Full Technical Specifications

All Pyralux AP constructions share the same all-polyimide dielectric chemistry. Pyralux AP is an all-polyimide double-sided copper-clad laminate that is the industry standard in terms of thermal, chemical and mechanical properties. It is ideal for use in rigid-flex and multilayer flex applications which require advanced performance, such as low dissipation loss for high speed and high frequency, thermal resistance and high reliability.

Electrical Properties

Property	Value	Frequency	Test Method
Dielectric Constant (Dk)	3.4	1 MHz	IPC-TM-650 2.5.5.3
Dielectric Constant (Dk)	3.2	10 GHz	ASTM D2520
Loss Tangent (Df)	0.002	1 MHz	IPC-TM-650 2.5.5.3
Loss Tangent (Df)	0.003	10 GHz	ASTM D2520
Dielectric Strength	200 V/µm	—	ASTM D149
Volume Resistivity	>10¹⁷ Ω·cm	—	IPC-TM-650 2.5.17
Surface Resistance	>10¹⁶ Ω	—	IPC-TM-650 2.5.17
Moisture & Insulation Resistance	>10¹¹ Ω	—	IPC-TM-650 2.6.3.2

Mechanical and Thermal Properties

Property	Value	Test Method
Peel Strength (as received)	>1.8 N/mm (10 lb/in)	IPC-TM-650 2.4.9
Peel Strength (after solder)	>1.8 N/mm (10 lb/in)	IPC-TM-650 2.4.9
Tensile Modulus	4.8 GPa	IPC-TM-650 2.4.19
Tensile Strength	345 MPa	IPC-TM-650 2.4.19
Elongation	50%	IPC-TM-650 2.4.19
Flexural Endurance	6,000 cycles	IPC-TM-650 2.4.3
Glass Transition Temperature (Tg)	220°C	DuPont Method, TMA
CTE (XY, below Tg)	25 ppm/°C	IPC-TM-650 2.4.41
CTE (XY, above Tg)	30 ppm/°C	IPC-TM-650 2.4.41
Solder Float (288°C, 10 s)	Pass	IPC-TM-650 2.4.13
Moisture Absorption	0.8%	IPC-TM-650 2.6.2
Dimensional Stability (after etch)	±0.04 to ±0.08%	IPC-TM-650 2.2.4

AP9242R Construction vs. Adjacent 2 oz AP Constructions

Parameter	AP9222R	AP9232R	AP9242R	AP9252R*
Copper (oz / µm)	2 oz / 70 µm	2 oz / 70 µm	2 oz / 70 µm	2 oz / 70 µm
Dielectric (mil / µm)	2 mil / 50 µm	3 mil / 75 µm	4 mil / 100 µm	5 mil / 125 µm
Theoretical Isolation Voltage	~10,000 V	~15,000 V	~20,000 V	~25,000 V
Min. Trace/Space (2 oz, typical)	4–5 mil	5–6 mil	5–6 mil	5–7 mil
50Ω Microstrip Trace Width (approx.)	~7.5 mil	~9.5 mil	~11 mil	~13 mil
Impedance Design Headroom	Moderate	Good	Very Good	Excellent
Total Core Thickness (approx.)	190 µm	215 µm	240 µm	265 µm
Flexibility	Higher	Moderate	Moderate–Good	Reduced

*AP9252R is a custom/special-order construction in the AP family.

Compliance and Certifications

Standard	Status
IPC-4204/11	Certified
UL 94	V-0 Flame Rating
UL File	E124294
RoHS	Compliant
ISO 9001:2015	Manufactured under certified QMS

Why the 4 mil Core Makes AP9242R the Right Choice for Multilayer Rigid-Flex

The step from 3 mil (AP9232R) to 4 mil (AP9242R) in the dielectric is a deliberate engineering move, not an incremental upgrade for its own sake. For multilayer rigid-flex designs specifically, the 4 mil core solves problems that thinner constructions create.

Controlled Impedance at 2 oz Becomes Manufacturable

Copper traces with 2× greater line/space resolution can be used to achieve identical electrical performance while greatly reducing fabrication yield loss from fine line imaging. This principle becomes even more critical when working with 2 oz copper, where etching tolerances are already wider than at 1 oz. On a 4 mil core, a nominal 50Ω microstrip trace at 2 oz copper comes out to approximately 10–12 mil wide — a width that most qualified rigid-flex shops can image and etch to tolerance reliably. Push the same target impedance on a 2 mil core with 2 oz copper and you’re chasing a trace width that sits at or below the shop’s reliable minimum, burning yield on every panel.

Polyimide flex materials are very well suited for impedance-controlled designs. The material is homogenous, has a low DK (3.2–3.4), is very uniform, and has tightly controlled thickness. This isotropy is a key reason the 4 mil AP9242R works as a reliable reference plane for multilayer stripline construction — the Dk consistency means your field solver results translate to fabricated boards without frustrating impedance walk.

Isolation Headroom for Mixed-Voltage Multilayer Stackups

Multilayer rigid-flex designs regularly mix signal voltages, logic rails, and higher-voltage power distribution in the same stackup. At 200 V/µm dielectric breakdown, a 4 mil (100 µm) polyimide core delivers approximately 20,000 V theoretical breakdown — with practical working voltage limits set at a fraction of this depending on the application standard. For 400 V industrial power bus layers sitting adjacent to 3.3 V logic flex layers in a power converter rigid-flex, the isolation margin of the AP9242R is an engineering safety cushion that the 2 mil core cannot match.

The Adhesiveless Advantage in Multilayer Lamination

In a multilayer rigid-flex stackup, every additional lamination cycle introduces thermal stress at every bondline in the construction. Adhesive-based flex laminates, where the copper-to-polyimide bond relies on acrylic adhesive (Tg typically 80–120°C), accumulate damage at these bondlines across multiple lamination cycles. The AP9242R’s adhesiveless construction — where copper is bonded directly to the polyimide dielectric without an adhesive intermediate — eliminates this failure mode. The high-temperature peel strength (>1.8 N/mm after solder float at 288°C) holds through all lamination stages of a complex multilayer rigid-flex build.

DuPont Pyralux AP9242R in the Full AP Family Context

Knowing where AP9242R fits across the full AP product line helps designers quickly confirm whether this construction is the right call or whether a step in either direction is warranted.

Standard AP Double-Sided Clad Family Overview

Product Code	Copper (oz / µm)	Dielectric (mil / µm)	Best Application Fit
AP9111R	1 oz / 35 µm	1 mil / 25 µm	Ultra-fine pitch, chip-on-flex
AP9121R	1 oz / 35 µm	2 mil / 50 µm	Standard signal flex layers
AP9131R	1 oz / 35 µm	3 mil / 75 µm	Signal flex with moderate isolation
AP9151R	1 oz / 35 µm	5 mil / 125 µm	High-frequency controlled impedance flex
AP9222R	2 oz / 70 µm	2 mil / 50 µm	Ultra-compact heavy current flex
AP9232R	2 oz / 70 µm	3 mil / 75 µm	Thermal and power flex boards
AP9242R	2 oz / 70 µm	4 mil / 100 µm	Multilayer rigid-flex, mixed power/signal
AP9161R	1 oz / 35 µm	6 mil / 150 µm	High-voltage isolation flex

The AP9242R is the thickest-core 2 oz construction in the standard AP lineup. Beyond 4 mil core with 2 oz copper, DuPont’s Pyralux AP-PLUS series takes over, offering even thicker dielectric cores specifically targeted at high-power designs where the primary goal is maximum yield in fabrication of wide-trace, high-current circuits.

Real-World Applications Where DuPont Pyralux AP9242R Excels

The combination of 2 oz copper and 4 mil polyimide puts AP9242R in a fairly specific application zone — designs that need both serious current capacity and the ability to support controlled impedance and multilayer construction.

Power Rigid-Flex for EV Battery Management Systems

Battery management system (BMS) boards in electric vehicles increasingly use multilayer rigid-flex construction to integrate cell sensing, balancing circuitry, and high-current interconnects in a single assembly that conforms to the geometry of cylindrical or prismatic cell arrays. AP9242R layers handle the continuous cell-to-cell and bus currents, while 1 oz signal layers in the same stackup manage the ADC sense lines, communication buses, and control logic — all without connectors between subsections. The all-polyimide construction tolerates the −40°C to +125°C thermal cycling that automotive under-hood and in-pack environments impose through the product’s service life.

Aerospace Power Distribution Modules

These clad laminates are ideal for double-sided, multilayer and rigid-flex applications requiring advanced material performance and high reliability. In aerospace platforms — satellite power buses, avionics power distribution units, and UAV motor controller interconnects — the AP9242R’s full lot traceability under DuPont’s ISO 9001:2015 QMS, combined with its IPC-4204/11 certification, satisfies the materials traceability requirements that aerospace OEM qualification programs mandate. The low outgassing profile of the all-polyimide system is an added benefit in sealed enclosures and vacuum-rated applications.

Industrial Servo Drive and Robotics Interconnects

Robotic arms and machinery with moving parts benefit from rigid-flex PCBs’ flexibility and durability. These boards enable compact connections in automated systems, improving efficiency and reducing maintenance. For servo drives and multi-axis robot controllers, a multilayer rigid-flex board built on AP9242R power layers and 1 oz signal layers eliminates the wire harness bundles that traditionally connect motor drive modules to control electronics. The result is a lighter, more reliable assembly with fewer connector failure points — a real manufacturing cost reduction over the product’s service life.

High-Density Military Electronics

Their ability to survive high-shock loads (up to 100G) makes them ideal for military applications. Heavy copper multilayer rigid-flex boards meeting the AP9242R construction are used in weapons control systems, radar power electronics, and battlefield communications equipment where the combination of high current density, vibration and shock tolerance, and long service life without access for maintenance is a fundamental design requirement.

Medical Imaging and Diagnostic Power Electronics

High-power medical imaging equipment — including MRI gradient coil drivers and CT scanner power distribution assemblies — requires localized heavy-current flex routing within compact mechanical frames. The AP9242R’s adhesiveless construction and 220°C Tg maintain structural and electrical integrity through the high-temperature sterilization cycles and sustained high-power operating conditions that medical capital equipment endures over a service life measured in decades. DuPont’s explicit caution applies without exception: Pyralux AP is not approved for permanent implantation in the human body.

Multilayer Rigid-Flex Stackup Design With AP9242R

Understanding how AP9242R integrates into a real multilayer rigid-flex stackup is where the material choice translates into board performance. Here is a practical design example illustrating a 6-layer power rigid-flex built around AP9242R power layers.

Example 6-Layer Power Rigid-Flex Stackup

Layer	Material	Function
L1 (Rigid)	1 oz Cu / FR4 prepreg	Signal routing, component layer
L2 (Rigid)	FR4 core	Ground reference plane
L3 (Flex)	AP9242R (2 oz Cu, 4 mil PI)	Power distribution, high-current bus
L4 (Flex)	AP9242R (2 oz Cu, 4 mil PI)	Return plane / secondary power
L5 (Rigid)	FR4 core	Signal reference plane
L6 (Rigid)	1 oz Cu / FR4 prepreg	Signal routing, component layer
Flex zone bonding	Pyralux LF bondply	Joins rigid sections to flex core

In this configuration, the AP9242R layers form the dedicated power core of the flex section. Signal routing on L1/L6 and reference planes on L2/L5 sit in the rigid sections where FR4 core provides mechanical stability for components and connectors. The flex zone carries power only, keeping the flex layers as thin as possible for the current requirements.

Stackup Symmetry: Critical for Warpage Control

Always consider the neutral bend axis when designing your stackup. Symmetry in the stackup can help reduce warping and twisting. Use thinner materials in flex areas to improve flexibility and reduce strain. For the AP9242R in a multilayer build, both power layers should be placed symmetrically about the neutral bending axis of the flex section. Asymmetric copper distribution across the flex zone creates differential CTE mismatch under thermal cycling, resulting in a curl or twist that makes the final assembly mechanically non-conformant.

Via Design at the Rigid-to-Flex Transition

In general, avoid placing holes, vias, or pads on flexible areas and place as many as you can on the rigid section. Try to keep them at least 15 mil away from the edge of the stackup, as there can be more instability towards the edge of the board. For AP9242R-based power layers specifically, transition vias between the heavy copper flex power bus and the rigid section component pads must be placed entirely within the rigid zone. Via barrels in the flex zone are a reliability failure risk under thermal cycling — the copper in the barrel is subject to Z-axis expansion stress that the plated copper cannot absorb without cracking over time.

Fabrication Design Rules for AP9242R Heavy Copper Flex

Working with 2 oz copper on a 4 mil polyimide core comes with specific fabrication requirements that designers must bake into artwork before release.

Etch Compensation for 70 µm Copper

At 2 oz (70 µm) copper, significant undercutting occurs during wet etching compared to 1 oz processing. Designers should add approximately 70–105 µm (roughly 3–4 mil) to each trace edge as etch compensation in the Gerber artwork. Confirm the exact compensation factor with your specific fabricator — it varies by etch chemistry, line speed, and panel orientation. Fabricators using combination plating-and-etch processes for heavy copper can hold tighter sidewall angles, but the compensation requirement does not disappear entirely.

Minimum Trace and Space at 2 oz

Target a minimum trace width and space of 5–6 mil (127–152 µm) for production-intent AP9242R designs. Some shops with heavy copper specialization can push to 4 mil minimum, but this represents a yield risk and premium cost tier. Never attempt sub-4 mil signal routing on the same 2 oz copper layer as power planes — the etching process that yields clean 2 oz power traces is incompatible with fine-line signal processing.

Bend Radius: Static vs. Dynamic Rules

For single-sided flexible circuits, the bending radius is approximately 6× the thickness of the flexible material, and for double-sided circuits it is approximately 12× the thickness. For AP9242R in a double-sided power flex configuration with coverlay, total finished flex section thickness will typically reach 290–320 µm. Apply 12× minimum bend radius (~3.8 mm) for static installation bends, and 15–20× (~5–6 mm) for any flex zones that will undergo repeated bending during operation.

Moisture Bake-Out Before Assembly

As polyimide film is very hygroscopic, it is vital to dry it before soldering. If this is not done, delamination may occur, bubbles may form or sleeves may rip out during the soldering process. Drying for >4 hours at 120°C and then processing immediately (<8 hours) afterwards is recommended. For AP9242R, this pre-bake is particularly important ahead of multilayer lamination cycles, not only ahead of final reflow assembly. Moisture trapped in the polyimide during bonding will cause delamination defects that are undetectable until electrical testing or, worse, field failure.

Coverlay: Film Polyimide Only

Liquid photoimageable (LPI) soldermask cannot reliably encapsulate 70 µm copper trace sidewalls at this copper weight. Use 1 mil or 2 mil film polyimide coverlay with acrylic or epoxy adhesive, confirmed compatible with the AP9242R base laminate. For high-temperature applications (>150°C continuous), verify that the coverlay adhesive is rated for the full operating range before committing the design to production.

AP9242R vs. Competing Multilayer Rigid-Flex Laminates

Parameter	AP9242R (DuPont)	Shengyi SHE-FLEX 2 oz	Panasonic R-F775	Adhesive-Based 3L Flex (2 oz)
Cu Weight	2 oz / 70 µm	2 oz / 70 µm	2 oz / 70 µm	2 oz / 70 µm
Dielectric (core)	4 mil / 100 µm	1–4 mil	2–4 mil	1–3 mil (PI film)
Adhesiveless	Yes	Yes	Yes	No (acrylic)
Dk @ 1 MHz	3.4	~3.4–3.5	~3.4	~3.5–4.2 (adhesive adds)
Tg	220°C	~220°C	~240°C	80–120°C (adhesive Tg)
IPC 4204/11	Certified	Varies	Varies	N/A
Full Lot Traceability	Yes (ISO 9001:2015)	Factory-dependent	Factory-dependent	Factory-dependent
UL 94 V-0	Yes	Yes	Yes	Varies
Multilayer Compatibility	Full (bondplies available)	Limited documentation	Limited documentation	Limited

For multilayer rigid-flex work where aerospace, defense, or medical OEM qualification is involved, the DuPont AP9242R’s supply chain documentation — full lot traceability, ISO 9001:2015 QMS, IPC-4204/11 certification — is a baseline requirement, not an optional premium. Competing laminates at lower cost exist, but qualifying them for demanding applications requires the same investment in test and documentation that the DuPont supply chain provides as standard.

Sourcing DuPont Pyralux AP9242R

Pyralux AP materials are distributed through DuPont’s authorized global laminate distribution network. For engineering prototype quantities, most qualified flex fabricators can source AP9242R on standard lead times. For production programs — especially those in regulated industries — establish a supply agreement with DuPont Electronics directly or through an authorized distributor to protect against allocation risk.

When qualifying a fabricator for AP9242R-based designs, specifically verify experience with both 2 oz flex construction AND multilayer rigid-flex builds. These are distinct process domains, and a shop that handles one competently does not automatically handle both. DuPont PCB  is a substrate supplier with relevance for heavy copper and polyimide-based rigid-flex combinations worth evaluating in parallel with Pyralux AP sourcing.

Useful Resources for Multilayer Rigid-Flex Designers

Resource	Description	URL
DuPont Pyralux AP Official Product Page	Current product descriptions, datasheet downloads, samples	https://www.dupont.com/electronics-industrial/pyralux-ap.html
DuPont Pyralux Laminate Product Selector	Custom product code finder for non-standard constructions	https://pyralux.dupont.com
DuPont Pyralux AP Datasheet (PDF)	Full TDS with complete construction table and properties	https://insulectro.com/wp-content/uploads/2021/09/EI-10124-Pyralux-AP-Data-Sheet.pdf
DuPont Pyralux AP-PLUS Datasheet	For designs requiring heavier copper or thicker cores	https://www.cirexx.com/wp-content/uploads/Pyralux_AP-Plus_DataSheet1.pdf
IPC-2223 Flex and Rigid-Flex Design Standard	Bend radius rules, design-for-manufacturing guidelines	https://www.ipc.org
IPC-4204/11 Adhesiveless Laminate Spec	Qualification standard for AP-series laminates	https://www.ipc.org
IPC-6013 Flex PCB Performance Standard	Acceptance and qualification testing for flex and rigid-flex	https://www.ipc.org
Epectec Rigid-Flex Impedance Design Guide	Practical stackup examples with bend radius and impedance tradeoffs	https://blog.epectec.com/rigid-flex-pcb-stack-ups-for-impedance-controlled-designs
Sierra Circuits Flex PCB DFM Guide	Design-for-manufacturing rules including coverlay, via, and bend guidance	https://www.protoexpress.com/blog/flex-pcb-design-guidelines-for-manufacturing/
IPC-TM-650 Test Method Database	Full library of test methods cited in AP9242R datasheets	https://www.ipc.org/TM

Frequently Asked Questions About DuPont Pyralux AP9242R

1. How does the AP9242R’s 4 mil core improve multilayer rigid-flex impedance yield compared to thinner cores?

The 4 mil core gives you significantly more room to achieve standard impedance targets — 50Ω single-ended, 100Ω differential — with trace widths that fall comfortably above your fabricator’s minimum reliable line width at 2 oz copper. Copper traces with 2× greater line/space resolution can be used to achieve identical electrical performance while greatly reducing fabrication yield loss from fine line imaging. At 4 mil dielectric, a 50Ω microstrip in 2 oz copper comes out to approximately 10–12 mil trace width, which most qualified flex shops can hold to ±1 mil tolerance consistently. On a 2 mil core, the same target would require a 5–6 mil trace — approaching the practical limit for 2 oz etching — with much wider tolerance excursion and corresponding impedance variation.

2. Is AP9242R suitable for a rigid-flex design that also requires dynamic flex sections?

With appropriate design rules, yes. The 4 mil polyimide core and 2 oz RA copper give AP9242R reasonable flex endurance — the IPC-4204/11-certified flexural endurance of the AP family is 6,000 cycles. For dynamic flex sections that will cycle continuously (conveyor equipment, robotic joints), keep bend radii at 15× or more of total circuit thickness, keep copper traces parallel to and perpendicular to the bend line as specified in IPC-2223, and avoid placing vias or pads in the dynamic zone. If the dynamic zone requires more than a few thousand cycles at tight bend radii, evaluate whether 1 oz copper in the dynamic section only (with AP9242R reserved for the static power distribution sections) is a better construction approach.

3. What voltage can the 4 mil polyimide core in AP9242R isolate reliably in production?

The 200 V/µm dielectric strength of the all-polyimide core across 4 mil (100 µm) gives a theoretical breakdown voltage of approximately 20,000 V. In production designs, working voltages are set at a fraction of this figure — typically with a safety margin of 3:1 to 10:1 depending on the application standard, required reliability level, and relevant end-use regulatory requirements (IEC, UL, MIL-spec). For typical industrial power electronics applications at 400–600 V DC bus, the AP9242R’s 4 mil core provides comfortable isolation margin with substantial safety overhead. For applications above 1000 V, move to a 6 mil or thicker dielectric construction.

4. How should AP9242R layers be specified in a multilayer rigid-flex stackup drawing?

In the layer stackup drawing and fab notes, specify AP9242R by full DuPont part number to ensure material substitution does not occur without engineering review. The fab notes should state: “Flexible copper-clad laminate shall be DuPont Pyralux AP9242R (2 oz RA copper / 4 mil polyimide, adhesiveless, IPC-4204/11 certified). No substitution without written approval.” Reference IPC-6013 as the performance qualification standard and IPC-2223 as the design standard in your drawing border notes. Explicitly call out the etch compensation requirement on the board drawing or a separate process note so the fabricator applies the correct artwork compensation before imaging.

5. Can AP9242R be bonded to FR4 rigid sections in the same multilayer press cycle?

Yes — this is standard practice in multilayer rigid-flex construction. The flex layers (AP9242R) are bonded to the rigid sections (FR4 core and prepreg) using a compatible bondply, typically DuPont Pyralux LF (acrylic bondply) or a low-flow epoxy prepreg, in a single multilayer lamination press cycle. The key process requirement is controlling differential thermal expansion between the polyimide flex layers (CTE 25 ppm/°C) and the FR4 rigid sections (CTE typically 14–17 ppm/°C XY). Press temperature profiling and controlled cool-down rate are essential to manage dimensional stability through the transition — work through this with your fabricator’s process engineering team before releasing to production.

Summary

DuPont Pyralux AP9242R — 2 oz RA copper on a 4 mil all-polyimide adhesiveless core — addresses a specific and demanding design problem: multilayer rigid-flex boards where power distribution, impedance control, and thermal durability must coexist in a construction that survives real-world assembly and field conditions. The 4 mil core lifts impedance yield at 2 oz copper into a reliably manufacturable range, the adhesiveless construction eliminates the low-Tg adhesive bondline that undermines thermal cycling performance in three-layer constructions, and the ISO 9001:2015 / IPC-4204/11 / UL-certified supply chain provides the documentation foundation that regulated industries require. If your multilayer rigid-flex design is carrying serious current alongside controlled-impedance signals, AP9242R is the core to build on.

For samples and current pricing, contact DuPont Electronics at pyralux.dupont.com or engage a qualified rigid-flex fabricator with demonstrated 2 oz construction experience.