Zynq UltraScale+ Part Number Guide: ZU2 to ZU19 Decoded

After specifying dozens of Zynq UltraScale+ devices across various projects, I’ve learned that AMD’s part numbering system packs significant information into seemingly cryptic strings. Understanding part numbers like XCZU3EG, XCZU7EV, and XCZU9EG saves considerable time during device selection and prevents costly specification mistakes.

This comprehensive guide decodes the entire Zynq UltraScale+ MPSoC naming convention, from the smallest ZU3EG to the largest ZU9EG and beyond. Whether you’re selecting devices for a new design or trying to understand migration options, this reference provides the clarity needed for confident decision-making.

Understanding the Zynq UltraScale+ Part Number Structure

Every Zynq UltraScale+ part number follows a consistent format that encodes device family, size, variant, speed grade, package, and temperature rating. Once you understand this structure, reading any part number becomes straightforward.

Complete Part Number Format

A full Zynq UltraScale+ part number like XCZU9EG-2FFVB1156I breaks down as follows:

Understanding each segment enables rapid identification of device capabilities without constantly referencing datasheets.

Device Variants: CG, EG, and EV Explained

The two-letter suffix after the device number represents the most significant differentiator between Zynq UltraScale+ devices. Each variant targets specific application requirements.

XCZU3EG and EG Variant Devices

The XCZU3EG and other EG (Enhanced Graphics) devices represent the most popular variant for general-purpose embedded computing. EG devices feature:

• Quad-core ARM Cortex-A53 at up to 1.5 GHz
• Dual-core ARM Cortex-R5F at up to 600 MHz
• ARM Mali-400 MP2 GPU for graphics acceleration
• Full programmable logic resources

The ZU3EG specifically offers 154K logic cells, 360 DSP slices, and 7.6 Mb of block RAM—making it ideal for mid-range embedded vision and industrial control applications. Popular development boards like the Ultra96-V2 and UltraZed feature the XCZU3EG for its balance of capability and cost.

XCZU7EV and EV Variant Devices

The XCZU7EV and other EV (Enhanced Video) devices add hardware video codec capabilities to the EG feature set:

• H.264/H.265 encode and decode
• Simultaneous 4K60 encode + decode
• Up to 8 streams of 1080p video
• Same quad-core A53 and GPU as EG devices

The ZU7EV provides 504K logic cells, 1,728 DSP slices, and substantial memory resources for demanding video processing applications. Medical endoscopy, broadcast equipment, and surveillance systems frequently specify the XCZU7EV for its integrated codec capabilities.

CG Variant Devices for Cost-Sensitive Applications

CG (Cost-optimized Graphics) devices reduce processing capability for applications that don’t require maximum performance:

• Dual-core ARM Cortex-A53 at up to 1.3 GHz (not quad-core)
• Dual-core ARM Cortex-R5F at up to 533 MHz
• No GPU (Mali-400 not included)
• Lower clock frequencies reduce power consumption

CG devices target motor control, industrial automation, and applications where real-time processing matters more than raw compute performance.

Device Variant Comparison Table

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Complete Device Size Reference

The number following “ZU” indicates relative device capacity. Larger numbers generally mean more logic cells, DSP slices, and memory resources.

XCZU3EG, XCZU7EV, and XCZU9EG Specifications

These three devices represent the most commonly specified parts in the family:

The ZU3EG suits applications requiring modest logic resources without high-speed transceivers. The ZU7EV adds substantial compute capacity plus video codec. The ZU9EG maximizes logic density for demanding networking and compute acceleration workloads.

Complete EG Device Family Specifications

EV Device Family Specifications

Speed Grades and Temperature Ratings

Speed grade and temperature rating significantly impact both performance and cost. Understanding these designations prevents over-specification while ensuring designs meet environmental requirements.

Speed Grade Options

The -2 speed grade represents the most common specification, offering good performance without the premium pricing of -3 devices. For power-sensitive applications, -1L and -2L grades operate at reduced VCCINT voltage (0.72V vs 0.85V) for lower dynamic and static power.

Temperature Grade Designations

Industrial (-I) grade represents the standard choice for embedded systems requiring reliable operation across environmental extremes. Extended (-E) grade offers cost savings for controlled-environment applications.

Package Options and Footprint Compatibility

Zynq UltraScale+ devices come in multiple package sizes, with footprint compatibility enabling device migration without PCB redesign.

Package Naming Convention

The package designation (e.g., FFVB1156) encodes:

Footprint Compatibility for Device Migration

Packages sharing the same footprint identifier (the letter before the ball count) are footprint compatible:

This footprint compatibility enables designs to scale up or down within the same PCB layout—a significant advantage for platform development.

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Special Device Prefixes

Beyond the standard XC prefix, AMD offers specialized variants for demanding applications:

Automotive XA Devices

XA-prefix devices (XAZU3EG, XAZU7EV, etc.) meet automotive qualification requirements:

• AEC-Q100 qualified
• ISO 26262 ASIL-C certified
• Extended temperature operation
• Functional safety documentation

Defense-Grade XQ Devices

XQ-prefix devices (XQZU3EG, XQZU9EG, etc.) meet military specifications:

• MIL-STD-883 testing
• Extended temperature range (-55°C to +125°C)
• Radiation-tolerant options available
• Controlled baseline documentation

Essential Resources for Part Selection

These resources support detailed device selection and design implementation.

Official AMD Documentation

Download Resources

Frequently Asked Questions

What is the difference between XCZU3EG and XCZU9EG?

The XCZU3EG provides 154K logic cells, 360 DSP slices, and no transceivers, while the XCZU9EG offers 600K logic cells, 2,520 DSP slices, and 24 GTH transceivers. Both are EG variants with quad-core Cortex-A53, Mali-400 GPU, and dual Cortex-R5F. The ZU9EG targets high-performance networking and compute acceleration requiring substantial logic density, while the ZU3EG suits cost-sensitive embedded vision and control applications.

Why would I choose XCZU7EV over XCZU7EG?

The XCZU7EV includes an integrated H.264/H.265 video codec unit (VCU) capable of simultaneous 4K60 encode and decode. This hardware codec dramatically reduces power consumption and logic utilization compared to implementing video compression in programmable logic. If your application processes video streams, the ZU7EV eliminates the need for external codec ICs while providing consistent, predictable video performance.

Can I migrate from ZU3EG to ZU9EG without changing my PCB?

Potentially yes, if both devices share a compatible footprint. Check the footprint identifier (letter before ball count) in your package designation. For example, devices in B900 packages share the same footprint and can be migrated. However, you must verify that your PCB provides adequate power supply capacity and thermal management for the larger device, and that pin assignments remain compatible for your specific package combination.

What does the -2L speed grade mean?

The -2L designation indicates a device optimized for low-power operation at reduced core voltage (0.72V instead of 0.85V). At nominal voltage, -2L devices match -2 speed grade timing. At low voltage, performance decreases but power consumption drops significantly—beneficial for battery-powered or thermally constrained applications. The -2LE suffix adds extended temperature operation (0°C to +110°C) for demanding industrial environments.

Which Zynq UltraScale+ device is most commonly used?

The XCZU3EG represents one of the most popular devices due to its balance of capability and cost. It provides sufficient resources for many embedded vision and industrial applications while fitting in smaller, lower-cost packages. For video applications, the XCZU7EV dominates due to its integrated codec. High-performance computing and networking applications typically specify XCZU9EG or larger devices for maximum logic density.

Development Boards by Device

Understanding which development boards use which devices helps evaluate options during the prototyping phase.

Popular XCZU3EG Development Boards

The XCZU3EG appears on many accessible development platforms:

These boards provide cost-effective entry points for ZU3EG development, typically ranging from $199 to $499.

XCZU7EV and Video-Focused Platforms

The XCZU7EV powers evaluation platforms targeting video applications:

The ZCU104 specifically targets ZU7EV video codec evaluation at approximately $1,555.

High-Performance XCZU9EG Platforms

For XCZU9EG and larger device evaluation:

These platforms provide access to the full ZU9EG capability including all 24 GTH transceivers.

Common Part Number Mistakes to Avoid

Experience has taught me several part number pitfalls that catch engineers during device selection:

Confusing EG and EV suffixes: The XCZU7EG and XCZU7EV share identical logic resources but the EV includes the video codec. Specifying EG when you need video encoding requires expensive respins.

Overlooking transceiver requirements: Smaller devices like the XCZU3EG lack PL transceivers entirely. If your design requires high-speed serial beyond PS-GTR (USB 3.0, DisplayPort, SATA, PCIe), you’ll need ZU4 or larger.

Misunderstanding speed grade impact: The -3 speed grade adds significant cost (often 50%+ premium) over -1. Most designs work fine with -2 speed grade, reserving -3 for timing-critical paths that can’t close otherwise.

Ignoring package I/O limitations: A larger device in a smaller package may not expose all resources. Verify that your chosen package provides sufficient PL I/O for your design requirements.

Assuming all device/package combinations exist: AMD doesn’t manufacture every possible combination. Always verify availability before committing to a specific part number in your design.

Selecting the Right Device

Choosing the optimal Zynq UltraScale+ device requires matching application requirements to device capabilities:

Start with variant selection:

• Need video encode/decode? → EV devices (ZU7EV, ZU5EV, ZU4EV)
• Need GPU for graphics? → EG devices (XCZU3EG, XCZU9EG)
• Cost-sensitive, no GPU needed? → CG devices

Size the programmable logic:

• Count LUTs, DSP slices, and memory from your design estimates
• Add 20-30% margin for design growth
• Consider transceivers if high-speed serial is required

Select speed and temperature:

• Industrial (-I) for most embedded applications
• Extended (-E) for controlled environments
• Consider -2L for power-sensitive designs

Verify package availability:

• Confirm desired device/package combination exists
• Check footprint compatibility for potential migration
• Verify package availability at target volumes

The part numbering system, once understood, provides rapid insight into device capabilities without constant datasheet reference. Whether you’re specifying an XCZU3EG for embedded vision or an XCZU9EG for network acceleration, the naming convention tells you exactly what you’re getting.