XCVU9P: Virtex UltraScale+ Flagship FPGA Specifications

The XCVU9P has become the go-to device for engineers building high-performance systems that demand serious compute density and I/O bandwidth. As someone who has designed multiple PCBs around this device for networking and data center applications, I can confirm that the VU9P delivers on its promise of being a flagship FPGA. This guide covers everything you need to know about the Xilinx Virtex UltraScale+ VU9P—from core specifications to practical implementation considerations.

What is the XCVU9P?

The XCVU9P is the mid-range powerhouse in AMD/Xilinx’s Virtex UltraScale+ FPGA family, manufactured on TSMC’s 16nm FinFET+ process technology. This device sits at a sweet spot in the product line—large enough to handle demanding applications like 100G networking and AI inference, yet not so massive that it becomes unwieldy for production designs. The Xilinx UltraScale+ VU9P uses stacked silicon interconnect (SSI) technology, combining three super logic regions (SLRs) into a single package that operates as a unified device.

What makes the Xilinx Virtex UltraScale+ VU9P particularly attractive is the balance of resources. You get 2.5 million logic cells, 270 Mb of UltraRAM, up to 120 GTY transceivers capable of 32.75 Gb/s, and integrated PCIe Gen3 x16 hard blocks. This combination supports everything from 1+ Tb/s line cards to fully integrated radar systems.

XCVU9P Logic and Memory Specifications

Core Logic Resources

The VU9P provides substantial logic resources for complex designs:

The three-SLR architecture means you need to plan your floorplanning carefully. Inter-SLR crossings use registered routing resources that add latency, so performance-critical paths should stay within a single SLR when possible.

Memory Subsystem

The XCVU9P offers a tiered memory architecture that addresses different bandwidth and latency requirements:

UltraRAM blocks in the VU9P can cascade without consuming routing resources, making them ideal for deep packet buffers and video line stores. Each 288 Kb UltraRAM block provides 8× the capacity of traditional block RAM, significantly reducing the resource footprint for memory-intensive designs.

DSP Processing Capability

The DSP slices support single-cycle multiply-accumulate operations, making the XCVU9P highly effective for AI inference and signal processing workloads.

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XCVU9P High-Speed Transceiver Architecture

GTY Transceiver Specifications

The GTY transceivers in the VU9P are the real workhorses for high-speed serial connectivity:

The auto-adaptive equalization is particularly valuable—it eliminates the need for manual tuning during board bring-up, which saves significant development time on challenging backplane channels.

Transceiver Count by Package

The XCVU9P is available in multiple packages with varying I/O and transceiver counts:

For networking applications requiring maximum transceiver density, the FLGA2577 package with 120 GTY channels is the obvious choice. For designs needing more general-purpose I/O, the FLGA2104 provides 832 HP I/O pins.

XCVU9P Integrated Hard IP

PCIe Hard Blocks

The VU9P includes multiple integrated PCIe blocks that save logic resources and provide guaranteed timing:

Each PCIe hard block saves approximately 30K-50K logic cells compared to a soft implementation while providing superior performance and timing closure.

Ethernet and Interlaken

The integrated 100G Ethernet MAC with RS-FEC is particularly valuable for optical networking applications, consuming 90% less power than equivalent soft implementations.

VU9P Power Supply Requirements

Designing the power delivery network for the XCVU9P requires careful attention to multiple voltage rails:

Power consumption varies significantly based on design utilization and operating frequency. For a typical high-utilization design, expect VCCINT current draw in the 50-80A range, requiring careful PDN design with appropriate decoupling.

Power Sequencing

The recommended power-on sequence for reliable operation:

1. VCCINT → VCCBRAM → VCCAUX → VCCO (core supplies)
2. VCCINT → VCCINT_GT → VMGTAVCC → VMGTAVTT (transceiver supplies)

Failure to follow proper sequencing can result in excessive current draw on VMGTAVTT during power-up.

VCU118 Evaluation Kit for XCVU9P Development

The VCU118 is AMD’s official evaluation platform featuring the XCVU9P-L2FLGA2104E device:

The VCU118 kit includes a device-locked Vivado license, making it a complete development platform for XCVU9P-based designs. The PCIe Gen3 x16 interface is PCI-SIG certified, ensuring reliable operation across different host systems.

XCVU9P Speed Grades and Ordering

The VU9P is available in multiple speed grades for different performance and power requirements:

The part numbering follows the pattern: XCVU9P-[Speed][Package][Temperature]

For example: XCVU9P-2FLGB2104I indicates a -2 speed grade device in FLGB2104 package with industrial temperature range.

Target Applications for Xilinx Virtex UltraScale+ VU9P

High-Speed Networking

The VU9P excels in networking applications with its high transceiver count and integrated Ethernet MAC:

• 100G/400G line cards and switches
• Network function virtualization (NFV)
• Software-defined networking (SDN)
• Data center interconnect (DCI)

Data Center Acceleration

With substantial logic resources and PCIe Gen3 x16 connectivity:

• Database acceleration
• Compression/decompression engines
• Search and analytics acceleration
• AI/ML inference

Test and Measurement

The combination of high-speed transceivers and DSP resources supports:

• Protocol analyzers
• Signal generators
• High-speed data acquisition
• Wired communication testers

Aerospace and Defense

For demanding environments requiring high reliability:

• Radar signal processing
• Electronic warfare systems
• Satellite communications
• Avionics

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Essential Documentation and Download Resources

Technical Documents

Download Links

Frequently Asked Questions

What is the difference between XCVU9P and VU9P?

XCVU9P and VU9P refer to the same device. XCVU9P is the full part number prefix (the “XC” designates a commercial-grade Xilinx component), while VU9P is the shortened device name commonly used in documentation and casual reference. The complete part number includes speed grade, package, and temperature grade—for example, XCVU9P-2FLGB2104I.

How many logic cells does the XCVU9P have?

The XCVU9P contains 2,586,150 system logic cells, which translates to 1,182,240 CLB LUTs and 2,364,480 flip-flops. This places it in the middle of the Virtex UltraScale+ lineup—larger than the VU7P (1.7M cells) but smaller than the VU13P (3.8M cells). The three-SLR architecture distributes these resources across the die.

What is the typical power consumption of the XCVU9P?

Power consumption depends heavily on design utilization, operating frequency, and I/O activity. For a moderately utilized design (50-60% LUT usage, 50 active transceivers at 25 Gb/s), expect 40-60W total. High-utilization designs with extensive DSP usage can exceed 80W. Always use the Xilinx Power Estimator (XPE) with your specific design parameters for accurate estimates. The VCU118 evaluation board includes power monitoring via PMBus.

Can the XCVU9P support PCIe Gen4?

The XCVU9P supports PCIe Gen4 x8 in compatibility mode through its integrated PCIe blocks. Full Gen4 x16 requires the newer Versal or select 58G-enabled Virtex UltraScale+ devices. For most data center applications, PCIe Gen3 x16 (which the VU9P fully supports) provides 128 Gb/s of bandwidth—sufficient for many acceleration workloads.

What development board should I use for XCVU9P evaluation?

The VCU118 Evaluation Kit is AMD’s official platform for XCVU9P development. It includes the XCVU9P-L2FLGA2104E device, dual DDR4 memory interfaces, PCIe Gen3 x16, dual QSFP28 cages, FMC and FMC+ expansion, and a device-locked Vivado license. The kit typically costs around $8,000-9,000 from authorized distributors. Third-party boards from Aldec, HiTech Global, and others offer alternative form factors for specific applications.

PCB Design Considerations for XCVU9P

Thermal Management

The XCVU9P can dissipate significant power under high utilization, requiring careful thermal design. For the FLGA2104 and FLGB2104 packages (47.5mm body), plan for thermal solutions capable of handling 60-100W depending on your design profile. Active cooling with heatsinks rated for these power levels is typical for production systems.

Decoupling Strategy

For a device like the XCVU9P, the PCB decoupling network requires multiple capacitor values strategically placed to cover the frequency spectrum from DC to several hundred MHz. Place 0402 capacitors directly under the FPGA on the bottom layer, with larger bulk capacitors distributed around the perimeter.

Conclusion

The XCVU9P represents a compelling balance of resources, performance, and cost within the Virtex UltraScale+ family. With 2.5 million logic cells, 270 Mb of UltraRAM, up to 120 GTY transceivers, and integrated PCIe Gen3 x16, it addresses the needs of demanding applications from 100G networking to AI inference and radar processing.

For PCB engineers, the VU9P presents familiar challenges in power delivery and signal integrity, but the comprehensive documentation and proven VCU118 reference design significantly reduce development risk. Whether you’re building data center accelerators, networking equipment, or test instrumentation, the Xilinx Virtex UltraScale+ VU9P provides the foundation for high-performance FPGA designs that can scale to production volumes.

The continued AMD support for UltraScale+ devices through 2045 ensures long product lifecycles, making the XCVU9P a sound choice for applications requiring extended availability and support.