IPC-6017 Complete Guide: PCB Embedded Passive & Active Circuitry Requirements

The average smartphone contains over 400 passive components at a 25:1 ratio to ICs. Moving even a fraction of those resistors and capacitors inside the PCB substrate dramatically improves performance and density—but only if you understand the specification that governs this technology. IPC-6017 is that specification, and its 2021 revision expanded the scope to include embedded active components as well.

IPC-6017, the Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry, defines the requirements for resistors, capacitors, and now active devices fabricated within PCB substrates. Whether you’re designing IoT wearables, military radar systems, or high-speed computing platforms, understanding this specification is essential for leveraging embedded component technology effectively.

What Is IPC-6017?

IPC-6017 is the IPC specification that establishes qualification and performance requirements specifically for embedded circuitry within printed boards. Unlike IPC-6012 or IPC-6013 which cover the overall board construction, IPC-6017 focuses exclusively on the embedded passive and active elements themselves.

IPC-6017 Standard Overview

Attribute	Details
Full title	Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
Original release	IPC-6017 (March 2009)
Current revision	IPC-6017A (August 2021)
Original pages	10 pages (passives only)
Current pages	28 pages (passives + actives)
Relationship	Supplements IPC-6012, IPC-6013, IPC-6015, IPC-6018
Design guidance	IPC-7092

The specification is designed to work alongside other IPC-6010 series documents. You still use IPC-6012 for rigid board requirements, but IPC-6017 adds the specific criteria for embedded components within that board.

Where IPC-6017 Fits in the IPC-6010 Family

Specification	Primary Coverage	Embedded Components
IPC-6011	Generic requirements	References IPC-6017
IPC-6012	Rigid boards	May contain per IPC-6017
IPC-6013	Flex/rigid-flex	May contain per IPC-6017
IPC-6015	MCM-L substrates	May contain per IPC-6017
IPC-6017	Embedded circuitry	Primary specification
IPC-6018	Microwave boards	May contain per IPC-6017

IPC-6017A: What Changed in the 2021 Revision

The 2021 revision represented a major expansion of scope, nearly tripling the document size and adding entirely new technology coverage.

Key Differences: IPC-6017 vs IPC-6017A

Aspect	IPC-6017 (2009)	IPC-6017A (2021)
Scope	Passive devices only	Passive AND active devices
Page count	10 pages	28 pages
Resistors	Covered	Covered (expanded)
Capacitors	Covered	Covered (expanded)
Active components	Not covered	Fully covered
Embedded ICs	Not addressed	Requirements defined
Sensors	Not addressed	Requirements defined
Material references	IPC-4811, IPC-4821	Updated references

Why Active Components Were Added

The electronics industry has moved beyond embedding only passive elements. Modern advanced packaging now embeds:

Component Type	Examples
Discrete actives	Transistors, diodes
Integrated circuits	Controllers, drivers
Sensors	Temperature, strain, pressure
MEMS devices	Accelerometers, microphones
Optical components	LEDs, photodetectors

IPC-6017A addresses all these by defining electrical, mechanical, and environmental requirements specific to embedded active circuitry.

Understanding Embedded Passive Technology

Before diving into IPC-6017 requirements, it’s important to understand what embedded passive technology actually involves and why it matters.

What Are Embedded Passives?

Embedded passives are resistive and capacitive elements fabricated directly within the PCB substrate layers, rather than mounted on the surface as discrete SMT components.

Characteristic	Surface Mount	Embedded
Location	Board surface	Internal layers
Form factor	Discrete packages	Patterned materials
Solder joints	Required	None
Replacement	Possible	Not possible
Parasitic effects	Higher	Lower
Routing area	Reduced	Preserved

Benefits of Embedded Components

Benefit	Improvement
Space savings	Frees surface area for active components
Signal integrity	Reduced parasitic inductance by 50%+
Power integrity	AC impedance reduced to 10 milliohms
EMI reduction	Less loop area, better shielding
Reliability	Fewer solder joints (failure points)
Thermal performance	3× better heat dissipation than traditional
High-frequency performance	Enables signals above 1 GHz

Trade-offs to Consider

Challenge	Consideration
Non-replaceable	Defective embedded components cannot be reworked
Design complexity	Requires specialized CAD tools and expertise
Tolerance control	Tighter process control required
Testing	Must test before final lamination
Limited values	Not all R/C values achievable
Supplier capability	Not all fabricators offer this technology

Embedded Resistor Types and Requirements

IPC-6017 addresses two primary methods for creating embedded resistors: formed (integral) and placed (discrete).

Formed Resistor Technologies

Formed resistors are created by patterning resistive materials laminated to copper foil.

Technology	Material	Sheet Resistivity	Tolerance
Thin-film NiCr	Nickel-chromium alloy	25-250 Ω/square	±1% (laser trimmed)
Thin-film NiCrAlSi	Nickel-chrome-aluminum-silicon	25-250 Ω/square	±1% (laser trimmed)
Polymer thick-film (PTF)	Carbon-filled polymer	1 Ω to 1 MΩ/square	±5-10%
Ceramic thick-film (CTF)	Ceramic-metal composite	10 Ω to 10 kΩ/square	±5%

Commercial Resistor Materials

Product	Manufacturer	Type	Description
OhmegaPly	Ohmega Technologies	Thin-film	NiP on copper foil, most widely used
Ticer TCR	Ticer Technologies	Thin-film	NiCrAlSi on copper
Polymer thick-film	Various	Thick-film	Screen-printed carbon polymer

Resistor Design Considerations

Parameter	Typical Range	Notes
Resistance range	10 Ω to 100 kΩ	Practical limits
Power rating	1/8 W to 1/4 W	Limited by size and thermal
TCR	50-150 ppm/°C	Material dependent
Tolerance (as-formed)	±5-10%	Before trimming
Tolerance (trimmed)	±1%	Laser trimming required
Minimum size	0.25 mm × 0.25 mm	Process dependent

Embedded Capacitor Types and Requirements

IPC-6017 covers both distributed (planar) capacitors and discrete embedded capacitors.

Planar Capacitor Technology

Planar capacitors use thin, high-dielectric-constant materials between power and ground planes to create distributed capacitance.

Material Type	Dielectric Constant	Capacitance Density
Standard FR-4	4.2-4.5	~0.1 pF/mm²
High-K epoxy composite	15-25	1-3 pF/mm²
Ceramic-filled polymer	20-40	3-10 pF/mm²
Barium titanate composite	10-30	2-8 pF/mm²

Commercial Capacitor Materials

Product	Manufacturer	Type	Dielectric Constant
FaradFlex	Oak-Mitsui	Polymer composite	12-38
3M C-Ply	3M	Ceramic-filled	16-21
EmCap	Sanmina	Polymer composite	Variable
BC2000/BC3000	Zycon	Buried capacitance	10-12

Discrete Embedded Capacitors

Discrete embedded capacitors are thin MLCCs or thin-film capacitors placed within the PCB stackup during lamination.

Parameter	Typical Range
Capacitance range	100 pF to 10 µF
Voltage rating	6.3V to 50V
Body thickness	0.15-0.3 mm
Outline	0201 (0.6×0.3 mm) to 0805
Tolerance	±10% to ±20%

Embedded Active Components (New in IPC-6017A)

The 2021 revision added comprehensive requirements for embedding active semiconductor devices within PCB substrates.

Types of Embedded Active Components

Component Type	Examples	Embedding Method
Discrete semiconductors	Diodes, transistors, MOSFETs	Cavity or lamination
Integrated circuits	Controllers, drivers, ASICs	Cavity or lamination
Sensors	Temperature, strain, pressure	Lamination
MEMS	Accelerometers, microphones	Cavity placement
Optical devices	LEDs, photodiodes	Cavity or through-hole

Active Component Embedding Methods

Method	Description	Advantages
Cavity embedding	Component placed in routed cavity	Access to both sides possible
Face-down embedding	Die face toward substrate	Short interconnects
Face-up embedding	Die face away from substrate	Wire bond access
Coreless embedding	Built around component	Thinnest profile

IPC-6017A Active Component Requirements

Requirement Area	Coverage
Electrical connections	Via, redistribution layer, wire bond
Thermal management	Heat dissipation, thermal vias
Mechanical stress	CTE mismatch, warpage control
Environmental protection	Moisture, contamination
Testing access	Built-in test provisions

Material Specifications for Embedded Components

IPC-6017 references specific material specifications for resistor and capacitor materials.

Related Material Standards

Specification	Coverage
IPC-4811	Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
IPC-4821	Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
IPC-4101	Specification for Base Materials (laminate compatibility)
IPC-4562	Metal Foil for Printed Board Applications

IPC-4811 Resistor Material Requirements

Property	Requirement
Sheet resistivity	As specified (Ω/square)
Resistivity tolerance	Supplier specified
TCR	Specified range (ppm/°C)
Stability	After thermal cycling
Adhesion	To copper and laminate
Process compatibility	Survive PCB processing

IPC-4821 Capacitor Material Requirements

Property	Requirement
Dielectric constant	As specified
Dk tolerance	Supplier specified
Dissipation factor	Maximum value
Breakdown voltage	Minimum V/mil
Insulation resistance	Minimum MΩ
CTE compatibility	Match to substrate

Performance Classes for Embedded Circuitry

IPC-6017 applies the standard three-class system defined in IPC-6011, with specific requirements for embedded components.

Class Definitions for Embedded Components

Class	Name	Embedded Component Applications
Class 1	General Electronic Products	Consumer embedded passives, cost-driven
Class 2	Dedicated Service Electronic Products	Industrial, automotive, communications
Class 3	High Reliability Electronic Products	Military, aerospace, medical, life-critical

Class Requirements Comparison

Requirement	Class 1	Class 2	Class 3
Resistance tolerance	±20%	±10%	±5% or tighter
Capacitance tolerance	±20%	±10%	±5% or tighter
Testing frequency	Sample	Lot sample	100% or per lot
Thermal cycling	Basic	Extended	Full qualification
Documentation	Minimal	Standard	Full traceability

Tolerance and Testing Requirements

One of the critical challenges with embedded components is achieving and verifying required tolerances.

Embedded Resistor Tolerance

Stage	Typical Tolerance	Notes
As-formed	±10-15%	Without trimming
After laser trim	±1%	Trimmed before lamination
After lamination	±1-2%	May shift slightly
After assembly	±1-2%	Thermal effects

Tolerance Improvement Methods

Method	Description	Achievable Tolerance
Laser trimming	Ablate resistor to adjust value	±1%
Process control	Tight material and etch control	±5%
Design margin	Use wider tolerance components	Design dependent
Active calibration	Digital correction in firmware	Application dependent

Testing Requirements

Test	Purpose	Method Reference
Resistance measurement	Verify value and tolerance	IPC-TM-650
Capacitance measurement	Verify value and tolerance	IPC-TM-650
Insulation resistance	Verify isolation	IPC-TM-650 2.6.3
Thermal stress	Reliability verification	IPC-TM-650
Microsection	Internal structure	IPC-TM-650 2.1.1
High-potential test	Dielectric integrity	Per specification

How IPC-6017 Works with Other IPC-6010 Specifications

Understanding the relationship between IPC-6017 and other specifications is essential for proper callout.

Specification Callout Example

A drawing might specify:

Element	Specification
Base board	IPC-6012 Class 2
Embedded resistors	IPC-6017A Class 2
Resistor material	IPC-4811, OhmegaPly 25 Ω/sq
Embedded capacitors	IPC-6017A Class 2
Capacitor material	IPC-4821, FaradFlex

Combined Requirements

Aspect	Primary Specification	Embedded Components
Overall board construction	IPC-6012/6013/6015/6018	N/A
Plated through holes	IPC-6012/6013/6015/6018	N/A
Conductor requirements	IPC-6012/6013/6015/6018	IPC-6017 for resistor elements
Embedded R/C/Active	N/A	IPC-6017
Embedded component materials	N/A	IPC-4811, IPC-4821

Design Considerations for Embedded Components

Successful embedded component implementation requires early design planning.

Design Flow Differences

Traditional Design	Embedded Component Design
Select parts from catalog	Design component values
Place on top/bottom layer	Assign to internal layers
Standard pad patterns	Custom geometry patterns
Auto-route connections	Manual routing to embedded elements
Silk screen designators	No external marking

Key Design Guidelines

Guideline	Recommendation
Layer assignment	Dedicate internal layers for embedded components
Resistor geometry	Length/width ratio determines value
Keep-out zones	No vias through embedded components
Test access	Provide probe points before lamination
Thermal relief	Manage heat from power resistors
Tolerance stacking	Account for cumulative variation

Frequently Asked Questions About IPC-6017

What is the difference between IPC-6017 and IPC-6012?

IPC-6012 is the base specification for rigid printed boards covering the overall board construction, plating, conductors, and general acceptance criteria. IPC-6017 is a supplemental specification that addresses only the embedded passive and active circuitry within the board. When you have a rigid board with embedded resistors or capacitors, you specify both: IPC-6012 for the board itself and IPC-6017 for the embedded components. IPC-6017 doesn’t replace IPC-6012—it adds specific requirements for embedded elements that IPC-6012 doesn’t cover.

Can embedded components be repaired if they fail?

No, embedded components cannot be repaired or replaced after the board is laminated. This is fundamentally different from surface-mount components that can be reworked. For this reason, IPC-6017 emphasizes testing embedded components before final lamination. Resistors are typically measured and laser-trimmed to value before the layers are stacked and pressed. If an embedded component is defective, the entire board must be scrapped. This non-reparability means embedded component technology requires tighter process control and quality assurance than traditional SMT assembly.

What tolerances are achievable for embedded resistors?

As-formed embedded resistors typically achieve ±10-15% tolerance due to material and processing variations. Using laser trimming before lamination, tolerances of ±1% are routinely achievable. After lamination and thermal processing, values may shift slightly, so ±1-2% is a practical specification for finished boards. For comparison, standard SMT chip resistors are available in ±0.1% tolerance, so embedded resistors are generally used for applications where ±1% is acceptable, or where circuit design can accommodate or digitally calibrate for wider tolerances.

What changed in IPC-6017A that designers should know about?

IPC-6017A (August 2021) dramatically expanded the specification scope from 10 pages to 28 pages, primarily by adding requirements for embedded active components. The original IPC-6017 covered only passive elements (resistors and capacitors). The A revision now addresses embedded integrated circuits, discrete semiconductors, sensors, MEMS devices, and optical components. If you’re designing boards with embedded ICs or sensors—increasingly common in IoT, medical, and automotive applications—IPC-6017A provides the qualification framework that didn’t previously exist.

What materials are commonly used for embedded resistors and capacitors?

For embedded resistors, the most common materials are OhmegaPly (thin-film nickel-phosphorus from Ohmega Technologies) and Ticer TCR (thin-film nickel-chrome-aluminum-silicon). These materials are laminated to copper foil and patterned using standard PCB processes. For embedded capacitors, FaradFlex (polymer composite from Oak-Mitsui) and 3M C-Ply (ceramic-filled polymer) are widely used. These high-dielectric-constant materials are placed between power and ground planes to create distributed decoupling capacitance. Material selection depends on required values, tolerances, and frequency performance.

Useful Resources

Official IPC Standards:

• IPC Store (IPC-6017A): shop.ipc.org/ipc-6017
• ANSI Store: webstore.ansi.org
• GlobalSpec: standards.globalspec.com

Related IPC Standards:

• IPC-4811: Specification for Embedded Passive Device Resistor Materials
• IPC-4821: Specification for Embedded Passive Device Capacitor Materials
• IPC-7092: Design and Assembly Process Implementation for Embedded Components
• IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
• IPC-6011: Generic Performance Specification for Printed Boards

Material Suppliers:

• Ohmega Technologies (OhmegaPly): ohmega.com
• Oak-Mitsui Technologies (FaradFlex): faradflex.com
• Ticer Technologies (TCR): ticer.com

Industry Resources:

• IPC Training and Certification: ipc.org
• IPC Designers Council
• SMTA (Surface Mount Technology Association)

Conclusion

IPC-6017 provides the essential framework for qualifying and specifying embedded passive and active circuitry within printed circuit boards. With the 2021 revision expanding scope to include active components, this specification has become increasingly relevant as the industry moves toward more integrated packaging solutions.

Key takeaways:

1. IPC-6017 supplements, doesn’t replace – Use alongside IPC-6012/6013/6015/6018
2. IPC-6017A added active components – Major 2021 expansion beyond just R/C
3. Embedded passives are mature – OhmegaPly, FaradFlex in production since 1970s
4. Tolerance requires trimming – Laser trim achieves ±1%, as-formed is ±10-15%
5. No rework possible – Test before lamination is critical
6. Material specs matter – Reference IPC-4811 (resistors) and IPC-4821 (capacitors)

Whether you’re designing compact IoT devices or high-reliability military systems, IPC-6017 ensures your embedded components meet the electrical, mechanical, and environmental requirements needed for reliable performance.