The Ultimate Ventec PCB Material Guide for Engineers

Introduction: Why Ventec PCB Materials Matter

When you’re deep into a design review and the thermal simulation shows your power stage running hotter than expected, or when your signal integrity analysis reveals unacceptable insertion loss at 10 GHz, the material sitting beneath your copper traces suddenly becomes the most important decision you’ll make. After spending years working with various laminate suppliers, I’ve found Ventec PCB materials consistently deliver the performance specifications they promise, backed by solid documentation and responsive technical support.

Ventec International Group, a Taiwan Stock Exchange listed company (TWSE: 6672), has built a reputation as a world leader in copper clad laminates and prepregs. Their manufacturing facilities in Taiwan and China utilize world-class equipment from Japan and Taiwan, with service centers spanning Europe and America. What sets Ventec apart isn’t just the breadth of their product portfolio, but their commitment to quality certifications that matter: AS9100 Revision D for aerospace, IATF 16949:2016 for automotive, and ISO 9001:2015 across all operations.

This guide cuts through the marketing specifications to give you practical, application-focused information for selecting the right Ventec PCB material for your next project. Whether you’re designing automotive power electronics, aerospace avionics, or high-speed telecommunications equipment, you’ll find the technical details you need to make informed decisions.

Understanding Ventec Product Categories

Ventec organizes their extensive material portfolio into several distinct product families. Understanding this organization helps you quickly narrow down your options when facing a new design challenge.

Standard and High-Reliability FR-4 Materials

The foundation of Ventec’s offering starts with their FR-4 family. The VT-42 serves as their standard FR-4, suitable for general-purpose applications where cost optimization takes priority over extreme performance. For lead-free assembly compatibility and enhanced thermal reliability, the VT-47 and VT-481 materials step up with a glass transition temperature (Tg) of 180°C using a phenolic cured system.

The VT-47 has become something of an industry workhorse. Its combination of high Tg, excellent CAF (Conductive Anodic Filament) resistance, UV blocking capability, and low Z-axis CTE makes it appropriate for applications ranging from servers and routers to automotive and medical equipment. The material is available in thicknesses from 0.002″ to 0.200″ with copper foil weights from 1/4 oz to 12 oz.

tec-speed: Signal Integrity and High-Frequency Materials

Ventec’s tec-speed product line addresses the growing demand for high-speed and low-loss PCB materials. This range covers everything from mid-loss (Df 0.015) to ultra-low-loss (Df 0.002) specifications, with dielectric constants (Dk) ranging between 3.2 and 3.8.

Key products in the tec-speed family include:

• tec-speed 2.0 (VT-464): Entry-level low-loss material for general high-speed applications
• tec-speed 3.0 (VT-464L): Enhanced thermal conductivity at 1.15 W/mK with Dk of 3.5
• tec-speed 5.0 (VT-464G): Low-loss halogen-free option
• tec-speed 6.0 (VT-462S): Ultra-low-loss for demanding signal integrity requirements
• tec-speed 7.0H (VT-463H): High-performance material for advanced applications
• tec-speed 20.0 (VT-870, VTM-1000i): PTFE-based materials for RF and microwave applications with Dk as low as 3.0 and Df of 0.002

tec-thermal: Thermal Management and IMS Solutions

For applications where heat dissipation is critical, Ventec’s tec-thermal range delivers ceramic-filled halogen-free dielectric technology with thermal conductivities ranging from 1.0 W/mK to 10.0 W/mK.

The VT-4B series forms the core of the IMS (Insulated Metal Substrate) offering:

• VT-4B1: Designed for bending and forming, 1.0 W/mK thermal conductivity
• VT-4B3: Standard IMS material, 3.0 W/mK thermal conductivity
• VT-4B5: High-performance IMS at 3.5 W/mK
• VT-4B5H: High Tg (180°C) version with 4.2 W/mK and UL-certified 155°C MOT
• VT-4B5L: Premium variant with 3.6 W/mK and excellent solder joint reliability
• VT-4B5 SP: Selective preference substrate for direct-to-metal connections
• VT-4B7: High-performance at 7.0 W/mK
• VT-4BC: Maximum thermal performance up to 10.0 W/mK

Polyimide Materials for Extreme Environments

When standard FR-4 can’t handle the heat, Ventec’s polyimide portfolio steps in. The VT-901 series represents their flagship polyimide offering, with a glass transition temperature of 250°C and decomposition temperature (Td) of 395°C. These materials meet NASA requirements for no visible bromine and are IPC-4101 QPL listed to specification sheets 40 and 41.

The VT-901 finds applications in:

• Satellite and aerospace systems
• Military and defense electronics
• Downhole drilling equipment
• Burn-in boards
• Engine and flight control systems

The VT-90H provides a cost-effective alternative with HB flammability rating and non-brominated formulation, while the VT-901HW offers enhanced wire bondability for chip-on-board applications.

Halogen-Free Materials

Environmental regulations continue to drive demand for halogen-free PCB materials. Ventec’s halogen-free portfolio includes the VT-441 and VT-447 series, offering excellent environmental credentials without compromising thermal or electrical performance. These materials comply with RoHS directives and are suitable for applications where halogen content must be minimized.

Core Ventec Material Specifications Comparison

The following table provides a quick reference for comparing key specifications across Ventec’s most commonly used materials:

Part Number	Category	Tg (°C)	Dk @1GHz	Df @1GHz	Thermal Cond.	Application
VT-42	Standard FR-4	135-140	4.2-4.5	0.018-0.020	0.3 W/mK	General Purpose
VT-47	High-Tg FR-4	180	4.2-4.4	0.015-0.018	0.75 W/mK	Lead-Free, Multilayer
VT-447	Halogen-Free	175	4.2-4.5	0.015-0.018	0.4 W/mK	Eco-Compliant
VT-464L	tec-speed 3.0	200	3.5	0.006-0.008	1.15 W/mK	High-Speed Digital
VT-901	Polyimide	250	3.8-4.2	0.008-0.012	0.35 W/mK	Aerospace, Military
VT-4B5H	IMS	180	4.0-4.5	0.015-0.020	4.2 W/mK	LED, Power Electronics
VT-870	tec-speed 20.0	280+	3.0-3.48	0.002-0.0037	0.25 W/mK	RF/Microwave

Industry-Specific Solutions: autolam and aerolam

Ventec has developed two specialized material portfolios to address the unique requirements of the automotive and aerospace/defense industries.

autolam: Automotive Electronics Solutions

The autolam portfolio addresses the diverse requirements of modern automotive electronics, from advanced driver-assistance systems (ADAS) to powertrain electrification. Ventec’s IATF 16949:2016 certification demonstrates their commitment to automotive quality standards. Major OEMs including Ford, Tesla, Volkswagen Group (Audi, Skoda, Seat), BMW, Mercedes-Benz, Renault-Nissan, Jaguar Land Rover, and McLaren rely on Ventec materials for their electronic systems.

Key considerations for automotive applications include:

• Temperature cycling resistance for under-hood environments
• CAF resistance for humid conditions
• High thermal conductivity for EV power electronics
• Low-loss materials for radar and connectivity systems

aerolam: Aerospace and Defense Solutions

The aerolam portfolio caters to the complete spectrum of aerospace and defense applications, from benign command-and-control center environments to high-performance fielded systems that must withstand extreme temperatures, vibration, g-forces, salt spray, and humidity. Ventec’s AS9100D certification backs their commitment to aerospace quality standards.

The aerolam portfolio includes:

• VT-901: IPC QPL listed polyimide for mission-critical applications
• VT-90H: Cost-effective halogen-free polyimide with UL-94 HB rating
• tec-speed 20.0 and 30.0: Low-loss materials for multi-GHz applications up to V/W-band and millimeter-wave frequencies
• VT-447V: IPC QPL listed halogen-free material with 150°C MOT

Processing Guidelines for Ventec Materials

Proper handling and processing of Ventec PCB materials is essential for achieving optimal results. Here are key considerations from the manufacturer’s process guidelines.

Storage and Handling

• Store laminates flat in a cool, dry environment
• Prepreg should be stored at 23°C or less with 50% RH or less
• Extended prepreg storage should be at reduced temperature of 5°C
• Reseal opened prepreg bags within 48 hours
• Total prepreg exposure to open environment should not exceed 8 hours
• Implement first-in-first-out inventory system with lot tracking

Lamination Parameters (VT-47 Example)

1. Heating Rate: Programmable press: 1.5-3.0°C/min; Manual press: 3-6°C/min
2. Curing: >60 minutes at more than 185°C (material temperature)
3. Full Pressure: ≥300 psi
4. Vacuum: Continue until material temperature exceeds 140°C

Drilling Parameters (0.3-1.0mm holes)

• Spindle Speed: 120-180 KRPM
• Feed Rate: 120-220 inch/min
• Retract Rate: 596-1000 inch/min
• Chip Load: 0.6-2.0 mil/rev

Pro Tip: Undercut drill bits yield better quality on smaller holes. The desmear rate for VT-47 is lower than conventional FR-4, requiring minor process adjustments.

Quality Certifications and Standards

Ventec’s commitment to quality is demonstrated through their comprehensive certification portfolio and IPC Qualified Products Listings.

Facility Certifications

• AS9100 Revision D: Aviation, space, and defense quality standard (facilities in Asia, UK, Germany, and USA)
• IATF 16949:2016: International Automotive Task Force quality standard
• ISO 9001:2015: Quality management system certification

IPC Qualified Products Listings

Ventec was the first copper clad laminate manufacturer to have a polyimide material added to the IPC-4101 Qualified Products Listing. This independent endorsement validates their production controls and materials for high-reliability mil/aero applications. QPL-listed materials include:

• VT-901 and VT-90H (Specification Sheets 40 and 41)
• VT-447V (Halogen-free with 150°C MOT)
• VT-441V (High CAF resistance with 150°C MOT)

Material Selection Decision Framework

Selecting the right Ventec PCB material requires balancing multiple factors. Here’s a systematic approach to guide your decision.

Step 1: Define Your Critical Requirements

1. Operating Temperature Range: What maximum temperature will the board experience during operation and assembly?
2. Signal Frequency: Are you working with RF, high-speed digital, or standard signals?
3. Thermal Dissipation: How much heat must the substrate conduct away from components?
4. Environmental Compliance: Do you need halogen-free or other environmental certifications?
5. Industry Standards: What certifications (AS9100, IATF 16949, IPC QPL) are required?

Step 2: Quick Selection Guide

Application Requirement	Recommended Ventec Material
General purpose, cost-sensitive	VT-42
Lead-free assembly, multilayer boards	VT-47, VT-481
Environmental compliance required	VT-441, VT-447 series
High-speed digital (1-10 Gbps)	tec-speed 2.0 to 6.0 (VT-464, VT-462S)
RF/Microwave (>10 GHz)	tec-speed 20.0 to 30.0 (VT-870, VT-6880)
High thermal dissipation (LED, power)	VT-4B series (VT-4B3 to VT-4BC)
Extreme temperatures (>200°C)	VT-901, VT-90H
Aerospace/Defense with IPC QPL	VT-901 (QPL /40, /41), VT-447V

Useful Resources and Downloads

Access these resources for detailed technical information on Ventec PCB materials:

Official Ventec Resources

• Ventec Product Database: ventec-group.com/products/all-products/
• Technical Datasheets: Available for each product on ventec-group.com
• Process Guidelines (PGL): Downloadable from product pages
• autolam Material Guide: ventec-group.com/autolam-material-guide/
• aerolam Portfolio: ventec-group.com/aerolam-base-material-solutions-for-aerospace-electronics/

Industry Standards References

• IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards
• IPC-4103: Specification for PTFE and Non-PTFE Materials for High Frequency Applications
• IPC QPL Database: ipcvalidation.org
• UL File E214381: Ventec UL certification reference

Third-Party Material Selectors

• PCB Directory: pcbdirectory.com/equipment/products/pcb-laminate
• Sierra Circuits Material Selector: protoexpress.com/tools/pcb-material-selector/

Frequently Asked Questions

1. What is the difference between VT-47 and standard FR-4?

VT-47 is Ventec’s high-Tg FR-4 with a glass transition temperature of 180°C compared to 130-140°C for standard FR-4. It features a phenolic cured system that provides better thermal reliability, CAF resistance, and UV blocking. VT-47 is compatible with lead-free assembly processes requiring higher reflow temperatures, making it the go-to choice for multilayer boards and applications with elevated thermal requirements.

2. When should I choose VT-901 polyimide over high-Tg FR-4?

Select VT-901 when your application requires operation above 200°C, must meet NASA outgassing requirements, needs IPC QPL certification for mil/aero applications, or requires exceptional thermal cycling performance. Typical applications include aerospace systems, downhole drilling equipment, burn-in boards, and high-temperature automotive under-hood electronics. The higher material cost is justified when FR-4’s temperature limitations become a reliability risk.

3. How do I select the right tec-speed material for my application?

Start by determining your required signal frequency and acceptable loss budget. For high-speed digital applications up to 10 Gbps, tec-speed 2.0 to 6.0 provides a good balance of performance and cost. For RF and microwave applications above 10 GHz, move to tec-speed 20.0 or 30.0 (PTFE-based materials). Consider the dissipation factor (Df) as the primary selection criterion since lower Df means less signal loss at higher frequencies.

4. What thermal conductivity do I need for my power electronics design?

For LED applications with moderate power density, VT-4B3 (3.0 W/mK) typically suffices. High-power LED arrays and power modules often require VT-4B5 (3.5 W/mK) or VT-4B5H (4.2 W/mK). For maximum thermal performance in demanding applications like high-power inverters, VT-4B7 (7.0 W/mK) or VT-4BC (10.0 W/mK) may be necessary. Always perform thermal simulation to validate your material choice before committing to production.

5. Are Ventec materials compatible with standard PCB fabrication processes?

Yes, Ventec materials are designed for compatibility with standard PCB fabrication processes. However, high-Tg and specialty materials require adjusted processing parameters. For example, VT-47 has a lower desmear rate than conventional FR-4, requiring process adjustments. Ventec provides detailed Process Guidelines (PGL) for each material with specific recommendations for lamination, drilling, desmearing, and other fabrication steps. Always consult the specific material’s process guide and work with your fabrication partner to optimize results.

Conclusion

Ventec PCB materials offer a comprehensive solution for virtually any application, from cost-optimized consumer electronics to mission-critical aerospace systems. Their organized product portfolio, spanning standard FR-4 through high-performance polyimide and specialty IMS materials, provides engineers with clear paths to the right material selection.

The key to successful material selection lies in clearly defining your application requirements, understanding the trade-offs between performance characteristics, and working closely with both Ventec’s technical support and your PCB fabrication partner. With proper material selection and process optimization, Ventec materials deliver the reliability and performance that demanding applications require.

For your next design project, start with the specifications tables and selection guide in this article, then dive into the specific datasheets and process guidelines for your chosen material. The investment in proper material selection pays dividends throughout the product lifecycle in reduced failures, improved performance, and satisfied customers.