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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Intel Stratix & Arria FPGA Series: High-Performance FPGA Comparison

When you’re specifying FPGAs for high-performance applications, Intel’s Stratix and Arria families represent the pinnacle of programmable logic capability. Having worked on designs spanning from Stratix IV through the latest generations, I can tell you the choice between these families—and the specific devices within them—fundamentally shapes your project’s performance ceiling, power budget, and cost structure.

This guide provides a practical comparison of Intel’s high-performance FPGA families, covering everything from the EP4SE230F29I3N and EP4SGX70 in the Stratix IV lineup to the 5SGXEA7N2F45C2 in Stratix V, and extending through the Arria series including devices like the EP1AGX50DF780C6N, EP2AGX125EF29I5N, 5AGXMA3D4F31I3N, and the current-generation 10AX027H4F34E3SG.

Understanding Intel’s High-Performance FPGA Portfolio

Intel’s FPGA lineup (inherited from the Altera acquisition in 2015) splits into distinct performance tiers. At the top sits the Stratix family—the flagship line for applications demanding maximum logic density, transceiver speeds, and DSP capability. Below that, the Arria family offers a compelling balance of performance and power efficiency for mid-range applications.

Stratix Family Overview

The Stratix line has evolved through multiple generations:

GenerationProcess NodeKey InnovationStatus
Stratix IV40nmFirst high-speed transceiversMature/Legacy
Stratix V28nmEnhanced transceivers, HyperFlexMature
Stratix 1014nmHeterogeneous 3D SiP, AI tilesCurrent

Arria Family Overview

The Arria series targets the sweet spot between cost and capability:

GenerationProcess NodeKey InnovationStatus
Arria GX90nmFirst Arria with transceiversLegacy
Arria II GX40nmCost-optimized transceiversMature/Legacy
Arria V28nmHard floating-point DSPMature
Arria 1020nm25.78 Gbps transceiversCurrent

Stratix IV: The 40nm High-Performance Foundation

The Stratix IV family represents the 40nm generation of Intel’s high-performance FPGAs. Despite being a mature product line, you’ll still encounter these devices in legacy systems and applications where the cost of requalification outweighs migration benefits.

Stratix IV Device Variants

Intel designed three distinct variants for different application requirements:

VariantFocusTransceiver SpeedKey Applications
Stratix IV GXHigh-speed serialUp to 8.5 GbpsNetworking, telecom
Stratix IV ELogic densityNoneASIC prototyping, compute
Stratix IV GTBackplaneUp to 11.3 GbpsLong-reach optical

EP4SGX70 Specifications

The EP4SGX70 sits at the entry point of the Stratix IV GX family, offering a compelling combination of logic capacity and transceiver count:

ParameterEP4SGX70
ALMs29,040
Logic Elements72,600
M9K Memory Blocks462
M144K Memory Blocks16
Total RAM Bits4,713 Kb
DSP Blocks (18×18)132
Transceivers (8.5G)Up to 16
User I/OUp to 372
Package OptionsF780, F1152

The EP4SGX70 delivers 700+ GMACS of DSP performance, making it suitable for wireless infrastructure, video processing, and test equipment applications.

EP4SE230F29I3N Specifications

For applications requiring pure logic density without transceivers, the EP4SE230F29I3N from the Stratix IV E family provides substantial resources:

ParameterEP4SE230
ALMs91,200
Logic Elements228,000
M9K Memory Blocks1,235
M144K Memory Blocks22
Total RAM Bits14,625 Kb
DSP Blocks (18×18)1,288
TransceiversNone
User I/OUp to 744
PackageF29 (1152-pin FBGA)

The “I3” suffix indicates industrial temperature grade (-40°C to +100°C junction), critical for harsh environment deployments.

Stratix V: 28nm Performance Leadership

Stratix V brought substantial improvements over its predecessor, including Intel’s HyperFlex architecture precursor, enhanced transceivers, and significantly more on-chip memory.

Stratix V Device Variants

VariantFocusTransceiver SpeedKey Features
Stratix V GXGeneral high-speedUp to 14.1 GbpsBalanced capability
Stratix V GSDSP-optimizedUp to 14.1 GbpsMore DSP blocks
Stratix V GTBackplane/opticalUp to 28.05 GbpsHighest transceiver speed
Stratix V ELogic densityNoneMaximum LEs

5SGXEA7N2F45C2 Specifications

The 5SGXEA7N2F45C2 represents one of the most capable devices in the Stratix V GX lineup, commonly found on development boards like the Terasic DE5-Net:

Parameter5SGXEA7N2F45C2
ALMs234,720
Logic Elements622,000
M20K Memory Blocks2,560
MLAB Memory Blocks14,668
Total RAM Bits57.16 Mb
Variable-Precision DSP256
18×18 Multipliers512
Transceivers (12.5G)36
User I/OUp to 840
PackageF45 (1932-pin FBGA)
PCIe Hard IPGen3 x8

This device powers demanding applications including 100G networking, high-frequency trading systems, and advanced radar processing.

Stratix V Architecture Advantages

Several architectural improvements distinguish Stratix V from earlier generations:

Variable-Precision DSP Blocks: Unlike the fixed 18×18 multipliers in Stratix IV, Stratix V DSP blocks support configurable precision from 9×9 to 36×36 bits, plus hardened IEEE 754 floating-point support—a first for FPGAs.

Enhanced Memory Architecture: The M20K blocks (20Kbit each) provide more efficient memory utilization than the M9K/M144K combination in Stratix IV. MLABs enable distributed memory implementation without consuming logic resources.

Improved Transceivers: With data rates up to 28.05 Gbps (GT variant) and hardened PCS for common protocols, Stratix V transceivers significantly reduce development time for high-speed serial designs.

Arria GX and Arria II: Cost-Optimized Transceivers

For applications where Stratix-level performance isn’t necessary but you still need integrated transceivers, the Arria GX and Arria II families provide excellent value.

EP1AGX50DF780C6N Specifications

The EP1AGX50DF780C6N belongs to the original Arria GX family, targeting cost-sensitive transceiver applications:

ParameterEP1AGX50
ALMs20,064
Logic Elements50,160
M512 Memory Blocks370
M4K Memory Blocks183
M-RAM Blocks2
Total RAM Bits2,475 Kb
DSP Blocks128
Transceivers4-8 (up to 3.125 Gbps)
User I/OUp to 514
PackageF780 (780-pin FBGA)

The “C6” speed grade offers the best performance for applications like Gigabit Ethernet, PCIe Gen1, and CPRI interfaces.

EP2AGX125EF29I5N Specifications

Moving to the 40nm generation, the EP2AGX125EF29I5N from Arria II GX provides substantially more capability:

ParameterEP2AGX125
ALMs49,640
Logic Elements124,100
M9K Memory Blocks495
Total RAM Bits6,570 Kb
DSP Blocks (18×18)288
TransceiversUp to 16 (6.375 Gbps)
User I/OUp to 452
PackageF29 (1152-pin FBGA)

The Arria II architecture introduced the Adaptive Logic Module (ALM) that would become standard across Intel’s FPGA lines, delivering significantly better logic efficiency than previous-generation architectures.

Arria II Key Applications

Arria II devices found widespread adoption in:

  • Wireless Infrastructure: CPRI and OBSAI interfaces for base station equipment
  • Broadcast Equipment: Triple-rate SDI processing
  • Network Processing: 10G/40G line cards
  • Industrial Automation: Motion control and machine vision

Arria V and Arria 10: Modern Mid-Range Performance

5AGXMA3D4F31I3N Specifications

The 5AGXMA3D4F31I3N represents Arria V’s capability for SoC applications, combining FPGA fabric with an integrated ARM processor:

Parameter5AGXMA3D4F31I3N
ALMs42,240
Logic Elements110,000
M10K Memory Blocks684
MLAB Memory Blocks2,640
Total RAM Bits7.38 Mb
Variable-Precision DSP112
Transceivers18 (10.3125 Gbps)
Hard ProcessorDual-core ARM Cortex-A9
User I/OUp to 288
PackageF31 (896-pin FBGA)

The integrated ARM processor enables true heterogeneous computing, handling control plane functions while the FPGA fabric accelerates data plane processing.

10AX027H4F34E3SG Specifications

The 10AX027H4F34E3SG showcases Arria 10’s 20nm performance:

Parameter10AX027H4F34E3SG
ALMs101,620
Logic Elements270,000
M20K Memory Blocks1,512
Total RAM Bits32.4 Mb
Variable-Precision DSP1,518
TransceiversUp to 48 (17.4 Gbps)
User I/OUp to 384
PackageF34 (1152-pin FBGA)
Hard IPPCIe Gen3 x8, DDR4

Arria 10 devices deliver up to 40% lower power consumption than previous-generation FPGAs while maintaining comparable or better performance—a critical advantage for power-constrained deployments.

Read more about Altera articles:

Stratix vs Arria: Making the Right Choice

Performance Comparison

MetricArria 10Stratix VStratix 10
Max Logic Elements1.15M952K5.5M
Max On-chip Memory65 Mb72 Mb229 Mb
Max Transceiver Speed25.78 Gbps28.05 Gbps57.8 Gbps
Max Transceivers966696
Process Node20nm28nm14nm
Typical Power70W100W+225W

When to Choose Stratix

Select Stratix-class devices when your application requires:

Maximum Logic Density: ASIC prototyping, large-scale compute accelerators, and complex system integration demand the hundreds of thousands (or millions) of logic elements only Stratix provides.

Highest Transceiver Performance: Applications like 400G Ethernet, coherent optical transport, and advanced radar require the 28+ Gbps transceivers available in Stratix GT/TX variants.

Memory-Intensive Processing: Video analytics, financial modeling, and AI inference benefit from Stratix’s massive on-chip memory capacity.

Compute Acceleration: Data center workloads including database acceleration, compression, and encryption see significant speedups from Stratix-based accelerator cards.

When to Choose Arria

Arria devices make more sense when:

Power Budget Constraints: Arria’s 40% power reduction versus previous generations enables deployment in 1U servers, embedded systems, and power-sensitive edge applications.

Cost Sensitivity: For production volumes where BOM cost matters, Arria delivers compelling price-performance ratios.

Adequate Performance: Many applications—including 100G networking, video transcoding, and industrial automation—perform excellently on Arria without requiring Stratix resources.

Form Factor Requirements: Arria-based accelerator cards fit in single PCIe slots and 1U chassis where Stratix solutions cannot.

Power and Thermal Considerations

Managing power consumption and thermal dissipation critically impacts high-performance FPGA designs.

Power Consumption Comparison

DeviceTypical TDPIdle PowerMaximum Power
EP4SGX70~15W~8W~25W
EP4SE230F29I3N~25W~12W~40W
5SGXEA7N2F45C2~40W~15W~75W
EP2AGX125EF29I5N~12W~5W~20W
Arria 10 GX 1150~45W~15W~70W
Stratix 10 GX 2800~100W~30W~225W

Thermal Design Guidelines

For Stratix IV and Stratix V designs:

  • Junction temperature limit: 100°C (commercial), 100°C (industrial)
  • Use the Intel Power Play Early Power Estimator
  • Plan for adequate airflow (typically 200+ LFM for high-power devices)
  • Consider vapor chamber or heat pipe heatsinks for maximum configurations

For Arria designs:

  • Lower thermal requirements enable passive cooling in many applications
  • Still budget for adequate PCB copper and thermal vias
  • Watch core voltage regulator efficiency at light loads

Development Tools and Software Support

All Intel high-performance FPGAs use the Quartus development environment, but version requirements differ:

FPGA FamilyMinimum Quartus VersionRecommended Version
Stratix IVQuartus II 9.1Quartus II 13.1
Stratix VQuartus II 12.0Quartus Prime 17.1+
Arria GXQuartus II 7.2Quartus II 13.1
Arria II GXQuartus II 9.1Quartus II 13.1
Arria VQuartus II 12.0Quartus Prime 17.1+
Arria 10Quartus Prime 15.1Quartus Prime Pro 21.3+
Stratix 10Quartus Prime Pro 17.0Quartus Prime Pro 21.3+

Development Kit Availability

Device FamilyDevelopment KitKey Features
Stratix IV GXDE4PCIe, DDR2, HSMC
Stratix V GXDE5-NetPCIe Gen3, DDR3, 4×SFP+
Arria II GXArria II GX Dev KitPCIe, DDR2/DDR3, HSMC
Arria 10 GXArria 10 GX Dev KitPCIe Gen3, DDR4, QSFP+
Stratix 10Stratix 10 GX Dev KitPCIe Gen3, DDR4, 100G

Migration Paths and Compatibility

Planning for device migration requires understanding pin compatibility and feature differences.

Vertical Migration Within Families

Intel supports vertical migration (moving between device densities within a package family) for most high-performance devices:

Stratix IV GX Migration: EP4SGX70 → EP4SGX110 → EP4SGX180 → EP4SGX230 (within same package)

Stratix V GX Migration: 5SGXA3 → 5SGXA5 → 5SGXA7 → 5SGXEA7 (with careful pin planning)

Arria 10 Migration: Extensive migration paths within GX/GT/SX variants sharing package footprints

Cross-Generation Migration

Moving from Stratix IV to Stratix V or Stratix V to Stratix 10 requires:

  • Complete PCB redesign (different pinouts and power requirements)
  • Quartus project migration (automatic conversion available)
  • IP core updates (some legacy IP requires replacement)
  • Verification regression (timing and functionality verification)

Real-World Application Examples

Data Center Acceleration

Intel’s PAC (Programmable Accelerator Card) lineup demonstrates the Stratix/Arria positioning:

CardFPGAPowerMemoryTarget Workloads
PAC A10Arria 10 GX75W8GB DDR4Database, imaging
PAC D5005Stratix 10 SX215W32GB DDR4Analytics, video, AI

Telecommunications

Wireless Base Stations: Arria 10 devices handle CPRI/eCPRI interfaces and digital front-end processing in remote radio units where power and size constraints dominate.

Optical Transport: Stratix 10 GT devices with 58G PAM4 transceivers enable 400G coherent optical modules for long-haul networks.

Test and Measurement

Protocol analyzers and high-speed data capture systems leverage Stratix V and 5SGXEA7N2F45C2 for their combination of high-speed transceivers and substantial memory bandwidth.

Resources and Downloads

Intel Documentation

ResourceURL
Intel FPGA Documentationhttps://www.intel.com/content/www/us/en/programmable/documentation/
Stratix IV HandbookSearch “Stratix IV Device Handbook”
Stratix V HandbookSearch “Stratix V Device Handbook”
Arria 10 HandbookSearch “Arria 10 Device Handbook”
Quartus Downloadhttps://www.intel.com/content/www/us/en/software-kit/programmable/fpga.html

Third-Party Resources

ResourceDescription
FPGAkey.comPart number search, pricing, datasheets
Mouser/DigiKeyAuthorized distribution, stock availability
TerasicDevelopment boards and reference designs
Intel FPGA ForumsCommunity technical support

Frequently Asked Questions

What is the difference between Stratix IV GX and Stratix IV E?

Stratix IV GX devices include high-speed transceivers (up to 8.5 Gbps) for serial communication protocols, while Stratix IV E devices focus purely on logic density without integrated transceivers. Choose GX variants like the EP4SGX70 for networking and communications applications requiring SerDes interfaces. Select E variants like the EP4SE230F29I3N for ASIC prototyping or compute-intensive applications where all pins can be dedicated to parallel I/O.

Can I migrate designs from Stratix IV to Stratix V?

Direct pin-compatible migration between Stratix IV and Stratix V is not supported—the architectures differ significantly. However, Quartus provides project migration tools that handle HDL conversion and IP updates. Plan for PCB redesign, power supply modifications (different voltage requirements), and thorough verification. Most RTL code ports without major changes, though timing closure may require optimization for the new architecture.

Which Arria device should I use for 10G Ethernet applications?

For 10G Ethernet, the Arria II GX family (devices like EP2AGX125EF29I5N) provides an excellent cost-performance balance with 6.375 Gbps transceivers. For 25G or multiple 10G channels with future expansion headroom, consider Arria 10 GX devices. The 10AX027H4F34E3SG offers 17.4 Gbps transceivers with hard 10G/25G Ethernet MAC IP, simplifying implementation while reducing logic utilization.

What Quartus version supports Stratix V 5SGXEA7N2F45C2?

The 5SGXEA7N2F45C2 requires Quartus II 12.0 or later for initial support, but I recommend Quartus Prime 17.1 or newer for the best optimization results and most complete IP library. Current Quartus Prime Pro versions (21.x+) continue supporting Stratix V while providing the latest timing closure algorithms and debugging capabilities.

How do power requirements compare between Arria and Stratix families?

Power consumption differs substantially between families. Arria devices typically consume 40-70W at full utilization, fitting in 1U server slots with standard cooling. Stratix V devices like the 5SGXEA7N2F45C2 may reach 75W+ under heavy loading. Stratix 10 devices can exceed 200W, requiring 2U form factors and dedicated cooling. Always use Intel’s Power Play Estimator with your actual design—default estimates often understate real consumption for complex designs.

PCB Design Considerations for High-Performance FPGAs

Designing PCBs for Stratix IV, Stratix V, and Arria devices requires careful attention to power delivery, signal integrity, and thermal management.

Power Distribution Network

High-performance Intel FPGAs require multiple voltage rails with tight regulation:

RailStratix IVStratix VArria 10Purpose
VCCINT0.9V0.85V0.9VCore logic
VCCIO1.2-3.3V1.2-3.0V1.2-3.0VI/O banks
VCCA2.5V2.5V2.5VAnalog PLLs
VCCT/VCCR1.1V1.1V1.0VTransceiver TX/RX

Design Guidelines:

  • Use dedicated power planes for each rail
  • Place bulk capacitors (100μF-470μF) near power entry points
  • Distribute ceramic decoupling capacitors (0.1μF, 1μF) across the device
  • Intel’s on-package decoupling reduces but doesn’t eliminate PCB requirements
  • Target PDN impedance below 5mΩ at frequencies up to 100MHz

High-Speed Signal Routing

For transceiver-equipped devices like EP4SGX70, 5SGXEA7N2F45C2, and EP2AGX125EF29I5N:

Differential Pair Requirements:

  • Maintain 100Ω differential impedance (±10%)
  • Match pair lengths within 5 mils
  • Route on adjacent layers when layer transitions required
  • Use ground-referenced stripline for best noise immunity
  • Avoid routing near switching power supplies or digital buses

Reference Clock Distribution:

  • Distribute low-jitter clocks to PLL reference inputs
  • Use clock buffers for fan-out rather than passive splits
  • Shield clock traces from noisy signals
  • Consider dedicated clock routing layers

Thermal Management Strategies

High-performance FPGAs generate significant heat requiring careful thermal design:

For Stratix IV/V Devices:

  • Heatsink attachment via thermal interface material (TIM)
  • Active cooling (fans) typically required above 30W
  • Consider vapor chamber heatsinks for 5SGXEA7N2F45C2 class devices
  • Ensure adequate airflow across PCB (200+ LFM)

For Arria Devices:

  • Passive cooling often sufficient for low-power variants
  • Still recommend heatsinks for industrial temperature operation
  • Thermal vias under device improve heat transfer to inner planes
  • Monitor junction temperature via on-chip sensors

Programming and Configuration

Understanding configuration options helps optimize boot time and security.

Configuration Modes

ModeDescriptionBoot TimeBest For
Active SerialFPGA controls serial flash100-500msProduction
Passive SerialExternal controllerVariableDevelopment
JTAGDirect bitstream loadFastDebug
Fast Passive Parallel8/16-bit parallelFastestLarge devices

Security Features

Modern Intel FPGAs include design protection:

Stratix V and Arria 10:

  • AES-256 bitstream encryption
  • Tamper detection and response
  • Secure boot with authentication
  • Anti-clone eFuse protection

Configuration for Production:

  1. Generate encrypted bitstream using Quartus
  2. Program encryption key via JTAG (one-time)
  3. Store encrypted configuration in flash
  4. Device decrypts on each power-up

Cost Optimization Strategies

Maximizing value from high-performance FPGA investments requires strategic planning.

Device Selection Guidelines

Right-Sizing Logic:

  • Target 70-80% utilization for production designs
  • Leave 20% margin for ECO fixes and feature additions
  • Consider slower speed grades if timing allows
  • Industrial grade commands 30-50% premium over commercial

Transceiver Planning:

  • Transceivers represent significant die area and cost
  • Use devices with exactly the channels needed
  • EP4SGX70 vs EP4SGX530: 16 vs 48 transceivers
  • Don’t pay for unused transceiver blocks

Development Cost Reduction

IP Core Strategy:

  • Leverage Intel’s free IP cores (PCIe, DDR, Ethernet)
  • Consider third-party IP for specialized functions
  • Reuse proven RTL across projects
  • Invest in verification IP to reduce debug time

Tool Optimization:

  • Use Quartus Standard Edition for cost-sensitive projects
  • Pro Edition required for Stratix 10 and advanced features
  • ModelSim-Intel FPGA Edition free for simulation
  • Consider DSP Builder for algorithm development

Conclusion

Selecting between Intel’s Stratix and Arria FPGA families requires balancing performance requirements against power, cost, and form factor constraints. The Stratix IV and Stratix V generations continue serving demanding applications where their combination of logic density, memory bandwidth, and transceiver capability remains unmatched in their respective technology nodes.

For new designs, Arria 10 often provides the optimal balance—delivering substantial capability at lower power and cost than Stratix alternatives. Devices like the 10AX027H4F34E3SG handle most networking, video, and industrial applications admirably. When your requirements genuinely exceed what Arria can deliver—whether in logic elements, memory capacity, or transceiver speeds—Stratix 10 awaits with the resources to match essentially any FPGA-applicable workload.

Understanding the capabilities and trade-offs of specific devices like the EP4SGX70, EP4SE230F29I3N, 5SGXEA7N2F45C2, EP1AGX50DF780C6N, EP2AGX125EF29I5N, and 5AGXMA3D4F31I3N enables informed decisions that optimize both technical performance and project economics. The key is matching device capability to actual application requirements—neither underprovisioning (leading to late-stage redesigns) nor overspecifying (wasting budget on unused resources).

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.