Rogers RT/duroid 6202PR: Complete Guide to High-Frequency PCB Laminate

If you’ve been working on RF or microwave circuits that require embedded planar resistors, you’ve probably come across Rogers RT/duroid 6202PR. This material has become a go-to choice for engineers designing phased array antennas, radar systems, and complex multilayer microwave structures. In this guide, I’ll break down everything you need to know about RT/duroid 6202PR PCB laminate, from its core properties to practical fabrication tips that will save you headaches in production.

What is RT/duroid 6202PR?

RT/duroid 6202PR is a ceramic-filled, woven glass-reinforced polytetrafluoroethylene (PTFE) composite laminate manufactured by Rogers Corporation. The “PR” in the name stands for “Planar Resistor,” which tells you exactly what makes this material special. It’s an extension of the successful RT/duroid 6002 and 6202 product lines, specifically engineered to work with resistive copper foils for tight-tolerance embedded resistor applications.

What sets RT/duroid 6202PR apart from standard high-frequency laminates is its combination of excellent RF performance with the mechanical stability needed to manufacture precision planar resistors. The limited woven glass reinforcement provides dimensional stability of 0.05 to 0.07 mils/inch, which is critical when you’re trying to hit resistor tolerances approaching ±5%.

Why Engineers Choose RT/duroid 6202PR PCB Material

From my experience working with various Rogers PCB materials, RT/duroid 6202PR fills a specific niche that other laminates struggle to address. Here’s what makes it compelling for high-frequency designs:

The material offers a low and stable dielectric constant (Dk of 2.94 or 2.98 depending on thickness) combined with an extremely low dissipation factor of 0.0020 at 10 GHz. This translates to minimal signal loss in your microwave circuits. But the real selling point is the compatibility with resistive foils from suppliers like Ohmega Technologies, enabling you to integrate precision resistors directly into your PCB stackup.

RT/duroid 6202PR Material Composition and Structure

Understanding what goes into RT/duroid 6202PR helps explain its performance characteristics. The material consists of three main components working together:

PTFE Matrix

The base material is polytetrafluoroethylene (PTFE), the same fluoropolymer used across the RT/duroid family. PTFE provides the low dielectric constant and low loss tangent that make this material suitable for microwave frequencies. It’s chemically inert and handles a wide temperature range without significant property changes.

Ceramic Filler

Ceramic particles are dispersed throughout the PTFE matrix. This ceramic loading serves multiple purposes: it fine-tunes the dielectric constant, improves thermal conductivity compared to unfilled PTFE, and enhances the mechanical properties of the composite. The ceramic fill also contributes to the material’s excellent dimensional stability.

Woven Glass Reinforcement

Unlike unreinforced PTFE laminates, RT/duroid 6202PR incorporates a limited amount of woven glass fabric. This reinforcement is what gives the material its outstanding dimensional stability, which is absolutely critical for planar resistor applications where you need tight positional tolerances after etching. The glass content is carefully controlled to maintain good RF performance while adding the necessary mechanical rigidity.

RT/duroid 6202PR Technical Specifications

Here’s a comprehensive breakdown of the RT/duroid 6202PR specifications. These values come directly from Rogers’ official datasheet and represent typical performance you can expect:

Electrical Properties

Property	Value	Test Conditions	Test Method
Dielectric Constant (Dk)	2.90 ±0.04 (0.005″ & 0.020″)	10 GHz, 23°C	IPC-TM-650, 2.5.5.5
Dielectric Constant (Dk)	2.98 ±0.04 (0.010″)	10 GHz, 23°C	IPC-TM-650, 2.5.5.5
Dissipation Factor (Df)	0.0020	10 GHz, 23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of Dk	+13 ppm/°C	10 GHz, 0-100°C	IPC-TM-650, 2.5.5.5
Volume Resistivity	10^10 MΩ·cm	Condition A	ASTM D257
Surface Resistivity	10^9 MΩ	Condition A	ASTM D257

Mechanical Properties

Property	Value	Direction	Test Method
Tensile Modulus	1007 MPa (146 kpsi)	X, Y	ASTM D638
Ultimate Stress	4.3%	X, Y	ASTM D638
Ultimate Strain	4.9%	X, Y	ASTM D638
Compressive Modulus	1035 MPa (150 kpsi)	Z	ASTM D638
Dimensional Stability	0.07 mm/m (mil/inch)	X, Y	IPC-TM-650 2.4.3.9

Thermal Properties

Property	Value	Test Method
Thermal Conductivity	0.68 W/m·K	ASTM C518
CTE (In-plane)	15 ppm/°C	IPC-TM-650 2.4.41
CTE (Z-axis)	30 ppm/°C	IPC-TM-650 2.4.41
Decomposition Temperature (Td)	500°C	ASTM D3850
Moisture Absorption	0.1%	IPC-TM-650, 2.6.2.1

Physical Specifications

Property	Value
Density	2.1 g/cm³
Specific Heat	0.93 J/g/K (0.22 BTU/lb/°F)
Flammability Rating	V-0 (UL94)
Lead-Free Process Compatible	Yes

Available Thicknesses and Copper Cladding Options

RT/duroid 6202PR comes in several standard configurations. Knowing what’s readily available versus what requires custom ordering can significantly impact your project timeline.

Standard Dielectric Thicknesses

Thickness (inches)	Thickness (mm)	Tolerance
0.010″	0.254 mm	±0.0007″
0.020″	0.508 mm	±0.0015″

Non-standard thicknesses of 0.005″ (0.127mm) and 0.015″ (0.381mm) are also available but may require longer lead times.

Standard Panel Sizes

Size (inches)	Size (mm)
12″ × 18″	305 mm × 457 mm
24″ × 18″	610 mm × 457 mm

Additional panel sizes can be ordered through Rogers’ customer service.

Copper Cladding Options

RT/duroid 6202PR supports a wide range of copper foil types:

Electrodeposited Copper Foil:

• ½ oz (18 µm) – Standard designation: HH/HH
• 1 oz (35 µm) – Standard designation: H1/H1
• ¼ oz to 2 oz available

Rolled Copper Foil:

• ½ oz (18 µm) – Standard designation: 5R/5R
• 1 oz (35 µm) – Standard designation: 1R/1R
• 2 oz also available

Reverse Treated Foil:

• ½ oz, 1 oz, and 2 oz options

Resistive Foil (for planar resistor applications):

• ½ oz and 1 oz electrodeposited copper with resistive layer
• Compatible with Ohmega Technologies foils

Initial Design Values for Resistive Foil

When designing with resistive foils on RT/duroid 6202PR, use these nominal values as starting points:

Foil Nominal (ohm/square)	Laminate Nominal (ohm/square)
25	27
50	60
100	157

Read more Rogers PCBs:

Key Advantages of RT/duroid 6202PR for High-Frequency PCB Design

Low Loss Performance

With a dissipation factor of just 0.0020 at 10 GHz, RT/duroid 6202PR delivers excellent high-frequency performance. This low loss translates directly to better antenna efficiency, lower insertion loss in filters and couplers, and improved overall system performance in your microwave circuits.

Exceptional Dimensional Stability

The 0.05 to 0.07 mils/inch dimensional stability is what enables tight tolerance planar resistors. This stability also benefits non-resistor applications where you need precise registration for multilayer boards or where thermal cycling could cause layer-to-layer misalignment in less stable materials.

Matched CTE with Copper

The in-plane coefficient of thermal expansion (CTE) of 15 ppm/°C closely matches copper’s CTE. This matching is crucial for surface mount assembly reliability, especially in applications that experience thermal cycling. Mismatched CTE between the laminate and copper can lead to lifted pads, cracked solder joints, and long-term reliability issues.

Extremely Low TCDk

The thermal coefficient of dielectric constant at +13 ppm/°C means your circuit’s electrical characteristics remain stable across temperature variations. This is particularly important for LNAs, PAs, and other circuits where Dk changes could shift operating frequencies or degrade return loss.

Multilayer Compatibility

RT/duroid 6202PR works well with various bonding systems including thermosetting adhesives (FR-4, RO4400) and thermoplastic films (3001 bonding film, FEP, ULTRALAM 3908, PFA, PTFE). This flexibility in bonding options makes it easier to integrate into hybrid multilayer stackups.

RT/duroid 6202PR Applications

The unique combination of RF performance and planar resistor capability makes RT/duroid 6202PR ideal for several demanding applications:

Phased Array Antennas

Modern phased array systems require precise phase control across hundreds or thousands of antenna elements. RT/duroid 6202PR’s dimensional stability and consistent Dk help maintain phase accuracy across the array, while the planar resistor capability enables integration of termination and matching resistors directly into the antenna feed network.

Ground-Based and Airborne Radar Systems

Military and commercial radar systems demand materials that can handle temperature extremes while maintaining electrical performance. RT/duroid 6202PR’s low TCDk and good thermal stability make it well-suited for these challenging environments. The material’s aerospace heritage within the RT/duroid family provides confidence for mission-critical applications.

GPS Antenna Systems

Global Positioning System antennas require consistent performance to maintain location accuracy. The low loss and stable dielectric properties of RT/duroid 6202PR help ensure reliable GPS reception across varying environmental conditions.

Beamforming Networks

Complex beamforming networks for radar and communication systems benefit from RT/duroid 6202PR’s ability to integrate planar resistors for power division and termination. This integration reduces component count and improves RF performance by eliminating discrete resistor parasitics.

Power Backplanes

High-reliability power distribution systems use RT/duroid 6202PR for its stable electrical properties and good thermal management. The material handles the thermal demands of power circuits while maintaining signal integrity for control signals.

Commercial Aircraft Collision Avoidance Systems

TCAS and other aircraft safety systems require extremely reliable materials. RT/duroid 6202PR’s proven track record in aerospace applications and its ability to maintain consistent performance over the aircraft’s operational envelope make it a trusted choice for these life-safety systems.

Complex Multilayer Microwave Circuits

Any application requiring multiple RF layers with precise interlayer registration benefits from RT/duroid 6202PR’s dimensional stability. The material processes well through conventional PTFE lamination cycles while maintaining tighter tolerances than less stable alternatives.

RT/duroid 6202PR PCB Fabrication Guidelines

Successfully processing RT/duroid 6202PR requires understanding some PTFE-specific considerations. Here are practical tips based on standard fabrication practices:

Photoresist Application

RT/duroid 6202PR is compatible with most photoresist systems used in RF PCB manufacturing. No special surface preparation beyond standard cleaning is typically required for good photoresist adhesion.

Etching Considerations

Standard copper etching systems work well with RT/duroid 6202PR. However, if you’re using resistive foils, follow the etching recommendations from the foil supplier (such as Ohmega Technologies) rather than standard copper etch parameters. Resistive foils often require specific etch chemistries to achieve proper resistor definition.

Oxide Treatment for Multilayer Bonding

RT/duroid 6202PR is compatible with most oxide and oxide alternative processes. Use the process recommended by your adhesive system supplier, ensuring it’s also compatible with any resistive foil in your stackup. Getting this wrong can lead to delamination or resistor performance issues.

Drilling

For multilayer boards, drill in stacks of one panel at most. Use phenolic composite entry boards (0.010″ to 0.030″ thick) and exit boards (>0.060″). The ceramic filler in RT/duroid 6202PR causes more tool wear than standard FR-4, so adjust your drill parameters and tool replacement schedules accordingly.

Plating

RT/duroid 6202PR is compatible with both traditional electroless copper and direct deposit metallization processes. Bake the cores at 120-150°C for 30-90 minutes before metal deposition unless you’re using plasma treatment, which also serves as a vacuum bake. After initial metallization, build up 0.0001″ to 0.0003″ (0.0025-0.0076mm) of flash copper to support hole walls through subsequent processing.

Soldermask Application

Care should be taken to preserve the post-etch dielectric surface texture, as this topography promotes soldermask adhesion. Rinse and bake panels prior to soldermask application for best results.

Multilayer Bond Cycle

The press cycle depends on your chosen adhesive system. For thermoplastic films, cooling under pressure is required. Work with your bonding material supplier to optimize the lamination profile for your specific stackup.

RT/duroid 6202PR vs Other Rogers Materials

Choosing the right material depends on your specific application requirements. Here’s how RT/duroid 6202PR compares to other popular Rogers laminates:

RT/duroid 6202PR vs RT/duroid 6002

Parameter	RT/duroid 6202PR	RT/duroid 6002
Dk (10 GHz)	2.90-2.98	2.94
Df (10 GHz)	0.0020	0.0012
Glass Reinforcement	Yes (woven)	No (microfiber)
Dimensional Stability	0.05-0.07 mils/inch	Lower
Planar Resistor Support	Yes	No
Best For	Planar resistor applications	Lower loss, non-resistor applications

RT/duroid 6002 offers slightly lower loss but lacks the woven glass reinforcement and resistive foil compatibility. Choose 6202PR when you need planar resistors or maximum dimensional stability.

RT/duroid 6202PR vs RT/duroid 6202

Parameter	RT/duroid 6202PR	RT/duroid 6202
Dk (10 GHz)	2.90-2.98	2.94
Df (10 GHz)	0.0020	0.0015
Resistive Foil Compatibility	Optimized	Standard
Best For	Tight tolerance planar resistors	General high-frequency circuits

RT/duroid 6202 is the base material without the specific optimizations for resistive foil processing. If you don’t need planar resistors, 6202 may offer slightly better loss performance.

RT/duroid 6202PR vs RT/duroid 5880

Parameter	RT/duroid 6202PR	RT/duroid 5880
Dk (10 GHz)	2.90-2.98	2.20
Df (10 GHz)	0.0020	0.0009
Glass Reinforcement	Yes (woven)	Yes (microfiber)
Dimensional Stability	Excellent	Good
Best For	Planar resistors, radar	Lowest loss applications

RT/duroid 5880 offers lower Dk and significantly lower loss, making it preferred for applications where absolute minimum insertion loss is critical. However, it doesn’t support planar resistors and has less dimensional stability than 6202PR.

When to Choose RT/duroid 6202PR

Select RT/duroid 6202PR when your design requires:

• Integrated planar resistors with tight tolerance
• Maximum dimensional stability for complex multilayer boards
• Good RF performance combined with mechanical reliability
• Compatibility with thermal cycling environments
• Aerospace and defense applications with stringent reliability requirements

Useful Resources and Downloads

Here are official resources for RT/duroid 6202PR that every design engineer should have on hand:

Official Rogers Corporation Resources

RT/duroid 6202PR Laminate Data Sheet Direct download from Rogers Corporation containing all specifications and test data. URL: https://www.rogerscorp.com/-/media/project/rogerscorp/documents/advanced-electronics-solutions/english/data-sheets/rt-duroid-6202pr-laminate-data-sheet.pdf

RT/duroid 6202PR Fabrication Guidelines Detailed processing recommendations for PCB fabricators. URL: https://quanticohmega.com/wp-content/uploads/Fabrication-Guidelines-RT-duroid-6202PR-High-Frequency-Laminates.pdf

Rogers Laminate Properties Tool Online tool to compare and filter Rogers laminates by properties. URL: https://www.rogerscorp.com/advanced-electronics-solutions/rt-duroid-laminates/rt-duroid-6202pr-laminates

Rogers Technology Support Hub Access to calculators, technical papers, and application notes. URL: https://www.rogerscorp.com/technology-support-hub

Product Safety Information Sheet (PSIS) Safety and handling information for RT/duroid 6202, 6202PR. Available in English, Chinese, and French from Rogers website.

Design Tools

MWI-2010 Microwave Impedance Calculator Rogers’ tool for calculating impedance and line widths on their materials.

Rogers Product Selector Guide Online guide for selecting the right Rogers material for your application. URL: https://www.rogerscorp.com/advanced-electronics-solutions/laminates-prepregs/product-selector

Sample Requests

Rogers provides material samples for evaluation through their online request system. This is valuable for qualification testing before committing to a design.

Frequently Asked Questions About RT/duroid 6202PR

What does “PR” stand for in RT/duroid 6202PR?

The “PR” designation stands for “Planar Resistor.” This indicates that RT/duroid 6202PR has been specifically optimized for use with resistive copper foils, enabling the fabrication of precision embedded planar resistors directly on the PCB substrate. The material’s excellent dimensional stability (0.05 to 0.07 mils/inch) allows fabricators to achieve resistor tolerances approaching ±5% when using compatible foils from suppliers like Ohmega Technologies.

What is the dielectric constant (Dk) of RT/duroid 6202PR?

RT/duroid 6202PR has a dielectric constant that varies slightly with thickness. At 10 GHz and 23°C, the Dk is 2.90 ±0.04 for 0.005″ and 0.020″ thicknesses, and 2.98 ±0.04 for 0.010″ thickness. When designing circuits, use the “Design Dk” values provided by Rogers, which account for manufacturing variations and provide more accurate impedance calculations. The thermal coefficient of Dk is +13 ppm/°C, meaning the dielectric constant remains stable across typical operating temperature ranges.

Is RT/duroid 6202PR suitable for multilayer PCB construction?

Yes, RT/duroid 6202PR is well-suited for multilayer PCB construction. The material is compatible with a broad range of bonding systems including thermosetting adhesives (FR-4 prepreg, RO4400) and thermoplastic films (3001 bonding film, FEP, ULTRALAM 3908, PFA, PTFE). Its excellent dimensional stability helps maintain layer-to-layer registration throughout the lamination process. Rogers’ technical service engineers can assist with adhesive selection based on your specific electrical, thermal, and processing requirements.

How does RT/duroid 6202PR compare to standard FR-4 for high-frequency applications?

RT/duroid 6202PR significantly outperforms FR-4 in high-frequency applications. FR-4 has a Dk around 4.2-4.5 with Df of 0.015-0.025 at 1 GHz, which increases substantially at higher frequencies. In contrast, RT/duroid 6202PR maintains Dk of approximately 2.94 and Df of 0.0020 at 10 GHz. This means RT/duroid 6202PR offers roughly 10x lower dielectric loss, more stable electrical properties versus frequency, and better phase consistency. For any application above a few hundred MHz where signal integrity matters, the performance difference is substantial.

What frequency range is RT/duroid 6202PR suitable for?

RT/duroid 6202PR performs well from DC through millimeter-wave frequencies. Its low and stable dielectric properties make it suitable for applications up to Ku-band (12-18 GHz) and beyond. The material is commonly used in L-band, S-band, C-band, and X-band radar systems, satellite communications, and GPS applications. For frequencies above 20-30 GHz, you may want to evaluate the specific loss requirements of your application, as some engineers prefer RT/duroid 5880 or similar ultra-low-loss materials for the highest frequency applications where every fraction of a dB matters.

Design Considerations and Best Practices for RT/duroid 6202PR PCB

Getting the best performance from RT/duroid 6202PR requires attention to several design and manufacturing considerations. Here are practical tips that will help you avoid common pitfalls.

Impedance Calculation Tips

When calculating transmission line impedances on RT/duroid 6202PR, use the “Design Dk” value rather than the “Process Dk.” The Design Dk is an average from multiple tested lots and provides more accurate predictions of your final circuit performance. Rogers’ MWI-2010 Microwave Impedance Calculator incorporates the correct Dk values and is the recommended tool for initial line width calculations.

Remember that the Dk varies slightly with thickness. For 0.010″ material, use Dk of 2.98, while 0.005″ and 0.020″ materials should use Dk of 2.90. This variation stems from the ratio of resin to glass reinforcement at different thicknesses and must be accounted for in your simulations.

Working with Planar Resistors

The planar resistor capability is what distinguishes RT/duroid 6202PR from other laminates in the 6000 series. To achieve the tight tolerances this material enables:

Resistor Layout: Keep resistor geometries as simple as possible. Straight line resistors are easier to control than meandered patterns. When you must use bends, maintain consistent line widths through the turns to avoid current crowding effects.

Tolerance Budget: While ±5% resistor tolerances are achievable, plan for some margin in your design. The actual tolerance depends on your fabricator’s capabilities, the resistor geometry, and the specific resistive foil being used. Discuss tolerance expectations with your fabricator early in the design process.

Temperature Coefficient: Resistive foils have their own temperature coefficient of resistance (TCR) separate from the laminate’s TCDk. Consider both when designing for temperature-sensitive applications. The foil supplier’s datasheet provides TCR values.

Design Rules: Work with your fabricator to establish minimum resistor line widths and spacing. Narrower lines are more susceptible to process variation, impacting resistance accuracy.

Thermal Management Considerations

While RT/duroid 6202PR has better thermal conductivity (0.68 W/m·K) than unfilled PTFE, it’s still modest compared to specialized thermal materials. For high-power applications:

Heat Spreading: Use sufficient copper weight on both sides of power traces to spread heat laterally before it conducts through the dielectric.

Thermal Vias: In multilayer designs, thermal vias can help conduct heat from internal layers to external heat sinks. Keep in mind that via metallization adds inductance that may affect RF performance.

Metal Backing: For the highest power applications, consider RT/duroid 6202PR clad with aluminum, brass, or copper plates. Rogers can provide metal-backed laminates for these demanding applications.

Signal Integrity in High-Speed Designs

For digital signals transitioning through RT/duroid 6202PR regions of a hybrid board:

Controlled Impedance: The low Dk of RT/duroid 6202PR means wider traces for a given impedance compared to higher-Dk materials. Account for this when transitioning between material types in a hybrid stackup.

Differential Pairs: The excellent Dk uniformity of RT/duroid 6202PR helps maintain consistent differential impedance across the board. This is particularly valuable for high-speed serial interfaces operating in the GHz range.

Ground Plane Integrity: Maintain continuous ground planes beneath signal traces. Any gaps or slots in the ground plane create return path discontinuities that degrade signal integrity and increase EMI.

Hybrid Stackup Design

Many designs combine RT/duroid 6202PR with other materials in a hybrid multilayer PCB. When designing hybrid stackups:

Dk Matching: Large differences in Dk between adjacent layers can cause impedance discontinuities at layer transitions. While some mismatch is often unavoidable, minimize it where possible.

Bonding Material Selection: The bonding material becomes part of your electrical stackup. Account for its Dk and thickness when calculating impedances. RO4400 series prepregs are popular choices for bonding RT/duroid materials in hybrid constructions.

Registration Tolerance: RT/duroid 6202PR’s excellent dimensional stability is one of its advantages, but your overall stackup registration depends on all materials in the build. Discuss registration capabilities with your fabricator for complex hybrids.

Manufacturing File Preparation

Providing complete and accurate manufacturing files helps ensure your RT/duroid 6202PR boards are built correctly:

Material Callout: Clearly specify RT/duroid 6202PR in your fabrication notes, including the specific thickness, copper weight, and foil type required.

Resistor Documentation: If using planar resistors, provide a separate resistor layer indicating target values and tolerances for each resistor. Include test points for resistance verification.

Stackup Drawing: A detailed stackup drawing showing all layers, materials, thicknesses, and copper weights prevents misunderstandings and ensures accurate quotes.

Quality Control and Testing for RT/duroid 6202PR PCB

Ensuring your finished boards meet specifications requires appropriate testing throughout the manufacturing process and during incoming inspection.

In-Process Testing

Planar Resistor Verification: Resistor values should be measured after etching and before any subsequent processing steps that might affect readings. Your fabricator should provide measurement data showing actual resistance values versus targets.

Impedance Testing: Time Domain Reflectometry (TDR) can verify characteristic impedance of transmission lines. Request TDR data for critical controlled-impedance traces.

Dk Verification: For critical applications, resonant test structures can verify the actual Dk of the fabricated boards. This is particularly important for filters, antennas, and other circuits sensitive to dielectric properties.

Incoming Inspection

When receiving RT/duroid 6202PR boards, check for:

Visual Inspection: Look for delamination, voids, scratches on dielectric surfaces, and proper copper pattern definition. PTFE materials show contamination more readily than FR-4, so cleanliness is important.

Dimensional Verification: Confirm overall board dimensions, hole locations, and feature placement against design specifications.

Electrical Testing: Verify resistance values for any planar resistors, check continuity of traces, and test isolation between circuits.

Cost Considerations for RT/duroid 6202PR

RT/duroid 6202PR is a specialty high-frequency laminate with pricing that reflects its performance capabilities. Understanding cost factors helps optimize your design:

Material Cost Factors

Base Material Cost: RT/duroid materials cost significantly more than FR-4. Expect pricing several times higher per square foot for the raw laminate.

Resistive Foil Premium: If using resistive foil for planar resistors, this adds additional cost over standard copper cladding.

Custom Thicknesses: Non-standard thicknesses (0.005″ and 0.015″) may have longer lead times and potential price premiums versus the standard 0.010″ and 0.020″ options.

Fabrication Cost Factors

PTFE Experience: Not all PCB fabricators are equipped or experienced with PTFE materials. Those with RF/microwave expertise typically command premium pricing but deliver better results.

Tooling Consumption: The ceramic filler in RT/duroid 6202PR causes accelerated drill bit wear compared to FR-4. Fabricators factor this into their pricing.

Lower Yield: PTFE materials generally have lower processing yields than standard laminates, particularly for complex multilayer designs. This gets reflected in piece prices.

Cost Optimization Strategies

Panel Utilization: Work with your fabricator to optimize panel layouts and minimize material waste. Smaller boards arranged efficiently on a panel reduce per-board material costs.

Design Simplification: Reducing layer count, using standard thicknesses, and minimizing exotic processing steps all help control costs.

Volume Pricing: Prototype quantities are expensive per board. If your application moves to production volumes, costs per board decrease significantly.

Final Thoughts on RT/duroid 6202PR

RT/duroid 6202PR occupies a unique position in the Rogers material portfolio. It combines the RF performance expected from the RT/duroid family with the dimensional stability and resistive foil compatibility needed for precision planar resistor applications. For engineers designing phased array antennas, radar systems, or any high-frequency circuit requiring embedded resistors, RT/duroid 6202PR deserves serious consideration.

The material does require attention to fabrication details, particularly when working with resistive foils. Partner with an experienced RF PCB fabricator who has processed RT/duroid materials and understands the specific requirements for your application. With proper design and fabrication, RT/duroid 6202PR delivers reliable, repeatable performance in demanding high-frequency applications.

Whether you’re developing next-generation radar systems for aerospace applications or designing commercial 5G infrastructure, RT/duroid 6202PR provides the foundation for high-performance microwave circuits that meet the tightest specifications.