Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XQVR600-4CB228M: Radiation-Hardened FPGA for Space Applications

Product Details

Overview of XQVR600-4CB228M Radiation-Hardened Field Programmable Gate Array

The XQVR600-4CB228M represents a high-performance radiation-hardened field programmable gate array designed specifically for aerospace and satellite applications. As part of the QPro Virtex 2.5V Radiation-Hardened FPGA family, this device delivers exceptional reliability in extreme radiation environments while maintaining the flexibility of programmable logic solutions.

Key Specifications and Technical Features

Core XQVR600-4CB228M Technical Parameters

Specification Value
System Gates 661,111 gates
Logic Cells 15,552 cells
Process Technology 0.22µm 5-layer epitaxial CMOS
Operating Voltage 2.5V
Package Type 228-Pin Ceramic Quad Flat Pack (CQFP)
Speed Grade -4 (only supported grade)
Manufacturing Grade Military-spec (M-grade)

Advanced Radiation Hardening Capabilities

The XQVR600-4CB228M incorporates industry-leading radiation protection features essential for space missions:

Radiation Parameter Specification
Total Ionizing Dose (TID) Guaranteed to 100 Krad(Si)
Single Event Latchup (SEL) Immune to LET = 125 MeV·cm²/mg
Single Event Upset (SEU) Immunity achievable with recommended redundancy
Operating Temperature Range -55°C to +125°C (full military range)

XQVR600-4CB228M Architecture and Performance

High-Performance Programmable Logic Design

Built on the revolutionary Virtex architecture, the XQVR600-4CB228M delivers superior performance through optimized place-and-route efficiency. The device features a rich hierarchy of interconnect resources that enable system clock rates up to 200 MHz, making it suitable for demanding real-time processing applications.

Configurable Logic Resources

The XQVR600-4CB228M provides flexible logic implementation options:

  • Configurable Logic Blocks (CLBs) with dual 4-input LUTs
  • Distributed RAM capabilities (16-bit, 32-bit configurations)
  • 16-bit shift register functionality
  • Dedicated carry logic for high-speed arithmetic operations
  • Abundant registers with clock enable and dual set/reset

System-Level Integration Features

Feature Description
Block RAM Embedded memory blocks for data storage
Multiplier Support Dedicated hardware for DSP operations
I/O Standards Multiple I/O support including PCI compliance
Internal Bussing 3-state bus architecture
Boundary Scan IEEE 1149.1 JTAG support
Temperature Sensing On-die temperature monitoring

Applications for XQVR600-4CB228M Space-Grade FPGA

Aerospace and Defense Applications

The XQVR600-4CB228M serves critical roles in space-based systems:

Satellite Systems

  • Communication payload processing
  • Attitude determination and control systems
  • Data handling and storage subsystems
  • Telemetry and command processing

Deep Space Missions

  • Scientific instrument controllers
  • Image processing systems
  • Navigation and guidance computers
  • Power management systems

Military Space Applications

  • Secure communications
  • Surveillance systems
  • Electronic warfare platforms
  • Reconnaissance satellites

XQVR600-4CB228M Design and Development Support

Development Tools and Software

The Xilinx FPGA development ecosystem provides comprehensive support for the XQVR600-4CB228M:

  • ISE Design Suite for synthesis and implementation
  • Simulation tools for design verification
  • IP core libraries for rapid development
  • Timing analysis and optimization tools
  • Configuration and programming utilities

Quality and Reliability Standards

Certification Details
QML Certification MIL-PRF-38535 qualified
Manufacturing Flow QPro process with enhanced screening
Traceability Full lot traceability and documentation
Testing 100% electrical parameter testing

Comparison with Similar Radiation-Hardened FPGAs

XQVR600-4CB228M vs. Other QPro Virtex Devices

Device Model System Gates Logic Cells Package Options
XQVR300-4CB228M 322,970 6,912 228-Pin CQFP
XQVR600-4CB228M 661,111 15,552 228-Pin CQFP
XQVR1000-4CG560M 1,000,000+ Higher density 560-Pin CCGA (obsolete)

Design Considerations for XQVR600-4CB228M Implementation

Radiation Mitigation Techniques

For optimal reliability in space environments, designers should implement:

Triple Modular Redundancy (TMR)

Implementing TMR across critical logic paths significantly improves SEU tolerance, though it increases resource utilization by approximately 3.2× and may impact performance by roughly 10%.

Configuration Scrubbing

Regular monitoring and correction of configuration memory helps maintain system integrity during extended missions.

Error Detection and Correction

Built-in capabilities combined with system-level error handling ensure continuous operation.

Thermal Management

Operating across the full military temperature range requires careful thermal design:

  • Heat sink selection for space vacuum conditions
  • Thermal analysis for worst-case power dissipation
  • Temperature monitoring using on-die sensors
  • Derating considerations for long-term reliability

Ordering Information and Package Details

XQVR600-4CB228M Part Number Breakdown

XQVR600 - 4 - CB - 228 - M
   |      |    |     |    └─ Manufacturing Grade (M = Military)
   |      |    |     └────── Pin Count
   |      |    └──────────── Package Type (CB = Ceramic Quad Flat Pack)
   |      └───────────────── Speed Grade (-4 only)
   └──────────────────────── Device Type

Package Specifications

Parameter Specification
Package Material Ceramic
Lead Finish Gold plated or compatible
Moisture Sensitivity Not applicable (hermetic)
Pin Pitch Standard CQFP pitch
Thermal Characteristics Suitable for space vacuum

Pricing and Availability of XQVR600-4CB228M

The XQVR600-4CB228M typically commands premium pricing due to its radiation-hardened qualification and low-volume production. Historical reference pricing for 100-piece quantities has been approximately $7,000 per unit, though current pricing may vary based on:

  • Order quantity and lead time
  • Specific screening requirements
  • Additional testing or documentation needs
  • Market conditions and availability

Technical Documentation and Resources

Essential XQVR600-4CB228M Documentation

  • Datasheet DS028: Complete electrical and mechanical specifications
  • Application Notes: SEU mitigation techniques and design guidelines
  • User Guides: Configuration and programming procedures
  • Radiation Test Reports: Detailed characterization data
  • Reliability Reports: Quality and failure rate information

Frequently Asked Questions About XQVR600-4CB228M

What makes the XQVR600-4CB228M suitable for space applications?

The device features radiation-hardened-by-process technology with guaranteed performance up to 100 Krad(Si) total ionizing dose and immunity to single-event latchup, making it ideal for long-duration space missions.

How does the XQVR600-4CB228M compare to commercial Virtex FPGAs?

While based on the same architectural foundation, the XQVR600-4CB228M uses specialized manufacturing processes and enhanced screening to ensure reliability in radiation environments, unlike commercial variants.

What development tools support the XQVR600-4CB228M?

Xilinx ISE Design Suite provides full support including synthesis, simulation, place-and-route, and configuration generation specifically optimized for QPro Virtex devices.

Can the XQVR600-4CB228M be reprogrammed in orbit?

Yes, the FPGA is fully reconfigurable, allowing design updates and modifications even after launch, providing exceptional flexibility for evolving mission requirements.

Conclusion: Why Choose XQVR600-4CB228M for Space Systems

The XQVR600-4CB228M radiation-hardened FPGA represents a proven solution for space-based systems requiring high reliability, flexibility, and performance. With extensive flight heritage, comprehensive radiation characterization, and robust development tool support, this device enables faster time-to-launch compared to ASIC alternatives while maintaining the ability to update designs throughout the mission lifecycle.

For aerospace engineers and satellite system designers, the XQVR600-4CB228M offers an optimal balance of capability, reliability, and programmability essential for success in harsh space environments.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.