Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XQVR600-1CB228V: Radiation-Hardened FPGA for Space and Aerospace Applications

Product Details

Overview of XQVR600-1CB228V Radiation-Hardened FPGA

The XQVR600-1CB228V represents a high-performance radiation-hardened field-programmable gate array (FPGA) from the Xilinx QPro Virtex 2.5V family. This advanced programmable logic device delivers exceptional reliability for mission-critical space, satellite, and aerospace applications where radiation tolerance is paramount. With 661,111 system gates and 15,552 configurable cells, this Xilinx FPGA provides the computational power needed for complex space-based systems.

Key Specifications and Technical Features

Core Architecture Specifications

Specification Details
Part Number XQVR600-1CB228V
Family QPro Virtex 2.5V Radiation-Hardened
System Gates 661,111 (661.111K)
Logic Cells 15,552
Process Technology 0.22µm CMOS, 5-layer metal
Supply Voltage 2.5V (±5%)
Speed Grade -4 (Standard)
Package Type CB228 – Ceramic Quad Flat Pack
Pin Count 228 pins
Operating Temperature -55°C to +125°C

Radiation Hardening Capabilities

Radiation Parameter Specification
Total Ionizing Dose (TID) Guaranteed to 100 Krads (Si)
Single Event Latch-up (SEL) Immune
Single Event Upset (SEU) Characterized and documented
Manufacturing Grade Class V (QPro-PLUS available)

Advanced FPGA Architecture and Performance

Programmable Logic Resources

The XQVR600-1CB228V utilizes an optimized architecture that balances density with routing efficiency. The device features:

  • Configurable Logic Blocks (CLBs): High-density array for complex logic implementation
  • Look-Up Tables (LUTs): Configurable as 16-bit shift registers, dual-ported RAM, or standard logic functions
  • Embedded Memory: Distributed RAM capabilities within logic fabric
  • I/O Resources: Maximum of 162 user I/O pins for CB228 package
  • Clock Management: Dedicated delay-locked loops (DLLs) for precise clock control

Signal Processing and Memory

Feature Capability
Block RAM Configurable memory blocks
Distributed RAM 16-bit, 32-bit configurations
Shift Registers 16-bit configurable shift registers
Register Resources Abundant flip-flops with synchronous/asynchronous controls

Applications for Space and Defense Systems

Primary Application Areas

The XQVR600-1CB228V excels in demanding environments requiring radiation tolerance:

  1. Satellite Communications: Signal processing for LEO, MEO, and GEO satellites
  2. Space Exploration: Proven in Mars missions including JPL’s Mars Exploration Rover
  3. Military Aerospace: Avionics, radar systems, and secure communications
  4. Scientific Instrumentation: Space telescopes and sensor data processing
  5. Nuclear Environments: Ground-based systems in high-radiation areas

Mission-Critical Advantages

  • In-Orbit Reconfigurability: Update functionality without physical access
  • Single-Event Upset Mitigation: Built-in features to maintain data integrity
  • Long-Term Reliability: Guaranteed performance over mission lifetime
  • Reduced Development Time: Off-the-shelf availability versus custom ASIC development

Package and Physical Characteristics

CB228 Ceramic Quad Flat Pack Details

Parameter Specification
Package Material Ceramic (hermetically sealed)
Lead Finish Gold plated
Form Factor Quad Flat Pack (QFP)
Maximum I/O 162 pins
Thermal Performance Enhanced for space vacuum conditions

SMD Classification Options

Available with Standard Microcircuit Drawing (SMD) numbers for military procurement:

  • Base SMD: 5962R9957301QYC
  • Lid SMD: 5962R9957301QZC

Design and Development Support

Software Tools Compatibility

The XQVR600-1CB228V integrates seamlessly with industry-standard design tools:

  • Xilinx ISE Design Suite: Complete design environment
  • Vivado Design Suite: Advanced synthesis and implementation
  • IP Core Libraries: Pre-verified cores for common functions
  • Simulation Tools: ModelSim, Questa compatibility

Development Resources

Resource Type Description
Datasheets Complete electrical and timing specifications
Application Notes SEU mitigation techniques, design guidelines
Reference Designs Space-qualified IP cores
Technical Support Xilinx Radiation Test Consortium (XRTC) data

Electrical Characteristics and Power Management

Supply Voltage Requirements

The XQVR600-1CB228V operates on dual supply voltages:

  • VCCINT: 2.5V ±5% (internal logic core)
  • VCCO: 1.2V to 3.6V (I/O banks, interface-dependent)

Power Consumption

Operating current varies based on design utilization:

  • Typical standby current: ~4.0 mA
  • Dynamic power scales with switching activity
  • Advanced power management features minimize consumption

Quality and Reliability Standards

Aerospace Manufacturing Standards

The XQVR600-1CB228V meets stringent space-grade requirements:

  • MIL-PRF-38535: Military performance specification for hybrid microcircuits
  • Class V Screening: Particle impact noise detection (PIND), X-ray inspection, destructive physical analysis (DPA)
  • Extended Burn-in: Comprehensive testing beyond commercial standards
  • Lot Acceptance Testing: Method 1019 verification at total dose levels

Environmental Testing

Test Parameter Condition
Temperature Cycling -55°C to +125°C
Thermal Vacuum Space environment simulation
Vibration Launch load profiles
Radiation Testing Heavy ion, proton, gamma exposure

Competitive Advantages Over Alternative Solutions

Why Choose XQVR600-1CB228V?

  1. Proven Heritage: Deployed in successful space missions since early 2000s
  2. Cost-Effective: Eliminates multi-million dollar ASIC development costs
  3. Flexible Architecture: Adaptable to changing mission requirements
  4. Rapid Deployment: Off-the-shelf availability reduces time-to-orbit
  5. Comprehensive Documentation: Extensive radiation characterization data

Comparison with Custom ASICs

Factor XQVR600-1CB228V Custom ASIC
Development Cost Low (design tools only) High ($2M-$10M+)
Time to Deployment Months 18-36 months
Design Flexibility High (reprogrammable) None (fixed)
Risk Level Low (proven silicon) High (first-pass success)

Ordering Information and Part Number Breakdown

Understanding the Part Number

XQVR600-1CB228V breaks down as follows:

  • XQ: QPro radiation-hardened family prefix
  • VR: Virtex Radiation-hardened series
  • 600: 600,000 system gate density indicator
  • -1: Speed grade designation
  • CB: Ceramic package type
  • 228: Pin count
  • V: Temperature grade (V-grade: -55°C to +125°C)

Available Package Options

While the CB228 is common, verify availability of alternative packages for different I/O requirements:

  • CG560: Ceramic Column Grid Array (for higher I/O count applications)
  • Multiple speed grades available upon request

Design Considerations for Space Applications

Radiation Mitigation Techniques

Designers implementing the XQVR600-1CB228V should consider:

  1. Triple Modular Redundancy (TMR): Voting logic for critical functions
  2. Configuration Scrubbing: Periodic readback and reconfiguration
  3. EDAC Protection: Error detection and correction for memory blocks
  4. Watchdog Timers: System health monitoring

Thermal Management in Vacuum

Space environments require special thermal considerations:

  • No convective cooling available
  • Radiative cooling design critical
  • Conductive paths to spacecraft structure
  • Operating junction temperature monitoring

Frequently Asked Questions

What is the difference between XQVR600 variants?

The XQVR600 family includes multiple package and grade options. The “-1” speed grade may differ from the more common “-4” grade in timing specifications. Always verify specific part number requirements with current datasheets.

Is the XQVR600-1CB228V suitable for commercial applications?

While technically capable, this device is specifically designed and priced for space/military applications. Commercial users should consider standard Virtex series FPGAs for cost-effectiveness.

What development boards are available?

Space-grade FPGAs typically don’t have commercial evaluation boards. Development is done using qualified flight hardware or engineering models. Contact Xilinx aerospace representatives for development support.

How does pricing compare to commercial FPGAs?

Radiation-hardened FPGAs command premium pricing reflecting extensive testing and qualification. Budget $3,500-$7,000+ per unit in production quantities, versus $10-$1,000 for commercial equivalents.

Technical Support and Resources

Documentation Access

Engineers can access comprehensive technical documentation:

  • Product specification datasheets (DS028)
  • User guides for architecture and implementation
  • Application notes for radiation effects
  • Xilinx Radiation Test Consortium reports

Where to Get Additional Support

For technical inquiries about the XQVR600-1CB228V:

  1. Xilinx Aerospace & Defense: Specialized support team
  2. Authorized Distributors: Mouser, Digi-Key, authorized space-qualified suppliers
  3. Online Resources: Xilinx documentation portal, community forums
  4. Design Services: Third-party space-qualified design houses

Conclusion: The Right Choice for Space-Critical Applications

The XQVR600-1CB228V radiation-hardened FPGA represents the optimal balance of performance, reliability, and flexibility for space and aerospace applications. With proven flight heritage, comprehensive radiation tolerance, and robust support infrastructure, this device enables mission success in the harshest environments.

Whether designing satellite payloads, planetary exploration systems, or military avionics, the XQVR600-1CB228V delivers the programmable logic capabilities needed for next-generation space systems. Its combination of 661K system gates, radiation hardening to 100 Krads, and temperature tolerance from -55°C to +125°C makes it an indispensable component in the aerospace engineer’s toolkit.

For procurement, technical specifications, or application-specific guidance, consult with Xilinx aerospace representatives or authorized distributors specializing in space-qualified components.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.