Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XCV1000-4BG560I: High-Performance Virtex FPGA for Advanced Digital Design

Product Details

The XCV1000-4BG560I is a powerful Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Virtex series, delivering exceptional performance for complex digital system applications. This industrial-grade FPGA combines massive logic capacity with high-speed operation, making it ideal for telecommunications, aerospace, defense, and high-performance computing applications.

Product Overview

The XCV1000-4BG560I represents cutting-edge programmable logic technology, offering designers unprecedented flexibility and processing power in a single chip solution. As part of the legacy Xilinx FPGA product family, this device continues to serve critical applications requiring proven reliability and performance.

Key Specifications

Parameter Value
Part Number XCV1000-4BG560I
Manufacturer AMD (Xilinx)
Product Family Virtex Series
Logic Cells 27,648 cells
System Gates 1,000,000 gates
Configurable Logic Blocks (CLBs) 6,144 CLBs
User I/O Pins 404 I/O
Speed Grade -4 (250 MHz max)
Package Type 560-LBGA (Low-profile Ball Grid Array)
Total Pins 560 pins
Operating Voltage 2.5V (2.375V – 2.625V)
Operating Temperature Industrial (-40°C to +100°C)

Technical Specifications Table

Feature Specification Description
Package Dimensions 42.5mm × 42.5mm Compact footprint for space-constrained designs
Ball Pitch 1.27mm Standard pitch for reliable PCB mounting
Package Type LBGA Exposed Pad Enhanced thermal dissipation
Configuration SRAM-based Reprogrammable architecture
Block RAM 131,072 bits Embedded memory for data buffering
Maximum Frequency 250 MHz High-speed clock operation
Power Supply 2.5V Core Low-power CMOS technology

Architecture and Logic Capacity

Logic Resources

The XCV1000-4BG560I features an impressive logic capacity that enables implementation of complex digital designs:

  • 27,648 Logic Cells: Provides extensive resources for implementing complex state machines, arithmetic functions, and control logic
  • 6,144 CLBs: Each configurable logic block contains multiple logic slices for maximum design flexibility
  • 1 Million System Gates: Equivalent gate count for traditional ASIC comparison

I/O Capabilities

With 404 user I/O pins, the XCV1000-4BG560I supports various interface standards and high pin-count applications:

  • Multiple voltage standards support
  • Programmable drive strength and slew rate
  • Input hysteresis for noise immunity
  • Registered inputs and outputs for timing optimization

Performance Characteristics

Speed Grade -4 Performance

The -4 speed grade designation indicates this FPGA offers excellent timing performance:

  • Maximum operating frequency up to 250 MHz
  • Optimized for high-speed data processing
  • Suitable for real-time signal processing applications
  • Low propagation delays for critical timing paths

Power Requirements

Power Parameter Specification
Core Voltage 2.5V ± 5%
I/O Voltage Multiple standards supported (1.5V to 3.3V)
Minimum Voltage 2.375V
Maximum Voltage 2.625V

Package Information

560-LBGA Package Features

The Low-profile Ball Grid Array package provides several advantages:

  • Compact Size: 42.5mm × 42.5mm footprint
  • High Pin Count: 560 solder balls for maximum I/O density
  • Thermal Performance: Exposed metal pad for efficient heat dissipation
  • PCB Compatibility: Standard 1.27mm ball pitch
  • Reliability: Excellent mechanical and electrical characteristics

Application Areas

Telecommunications Infrastructure

The XCV1000-4BG560I excels in telecommunications equipment:

  • Digital signal processing for base stations
  • Protocol conversion and packet processing
  • High-speed data switching
  • Network interface implementations

Industrial Automation

Ideal for demanding industrial control applications:

  • Motion control systems
  • PLC (Programmable Logic Controller) upgrades
  • Real-time data acquisition
  • Process monitoring and control

Aerospace and Defense

Meets requirements for mission-critical applications:

  • Radar signal processing
  • Guidance and navigation systems
  • Electronic warfare applications
  • Secure communications

Medical Equipment

Supports advanced medical device functionality:

  • Medical imaging systems
  • Patient monitoring equipment
  • Diagnostic instrument control
  • Signal conditioning and processing

High-Performance Computing

Enables acceleration of compute-intensive tasks:

  • Digital signal processing (DSP) algorithms
  • Encryption and security functions
  • Video and image processing
  • Scientific computing applications

Design and Development

Development Tools

The XCV1000-4BG560I is supported by comprehensive development tools:

  • Vivado Design Suite (legacy support)
  • ISE Design Suite (primary tool for Virtex series)
  • IP cores and reference designs
  • Simulation and verification tools
  • Place and route optimization

Design Implementation

Designers can leverage multiple methodologies:

  • Schematic entry for simple designs
  • VHDL and Verilog HDL for complex logic
  • IP integration for standard functions
  • Timing-driven synthesis and optimization

Quality and Reliability

Manufacturing Standards

  • Industrial Temperature Range: -40°C to +100°C operation
  • Quality Assurance: Rigorous testing and screening
  • ESD Protection: Meets industry standards for electrostatic discharge
  • Moisture Sensitivity: MSL-compliant packaging and handling

Long-Term Availability

While the XCV1000-4BG560I is considered a legacy product, it remains available for:

  • Existing design support
  • Production maintenance
  • Spare parts and replacements
  • Long lifecycle industrial applications

Comparison with Similar FPGAs

Feature XCV1000-4BG560I XCV800 XCV1600
System Gates 1,000,000 800,000 1,600,000
Logic Cells 27,648 22,144 43,904
User I/O 404 512 512
Package 560-LBGA 560-BGA 680-FGA

Purchasing Information

Availability

The XCV1000-4BG560I is available through:

  • Authorized distributors (DigiKey, Mouser, Arrow)
  • Direct from AMD/Xilinx for volume orders
  • Electronic component brokers for obsolete/hard-to-find inventory

Ordering Information

Full Part Number: XCV1000-4BG560I

Part Number Breakdown:

  • XCV: Virtex family designation
  • 1000: 1 million system gates
  • -4: Speed grade
  • BG560: Ball Grid Array, 560 pins
  • I: Industrial temperature range

Integration Guidelines

PCB Design Considerations

When designing with the XCV1000-4BG560I:

  • Follow AMD/Xilinx PCB design guidelines
  • Implement proper power supply decoupling
  • Plan thermal management for high-utilization designs
  • Consider signal integrity for high-speed interfaces
  • Allow adequate clearance around BGA footprint

Configuration Methods

The FPGA supports multiple configuration modes:

  • Master Serial mode
  • Slave Serial mode
  • SelectMAP parallel configuration
  • Boundary-scan (JTAG) programming

Support and Documentation

Available Resources

  • Comprehensive datasheets and specifications
  • User guides and application notes
  • Reference designs and example projects
  • Technical support from AMD/Xilinx
  • Community forums and knowledge bases

Why Choose XCV1000-4BG560I?

Key Advantages

  1. Proven Technology: Mature, well-documented FPGA architecture
  2. High Logic Capacity: Sufficient resources for complex designs
  3. Industrial-Grade: Reliable operation in harsh environments
  4. Flexible I/O: 404 user I/O pins for diverse interfacing needs
  5. Design Security: SRAM-based configuration prevents reverse engineering
  6. Performance: 250 MHz operation for demanding applications

Ideal For

  • Legacy system upgrades and replacements
  • Industrial control systems requiring proven reliability
  • Projects with established Virtex-based designs
  • Applications requiring long-term availability
  • Cost-effective solutions for moderate complexity designs

Environmental and Compliance

The XCV1000-4BG560I meets international standards:

  • RoHS compliant (lead-free available)
  • REACH compliant
  • Conflict minerals compliant
  • Standard industry packaging (anti-static protection)

Conclusion

The XCV1000-4BG560I remains a relevant and powerful FPGA solution for applications requiring proven technology, high reliability, and substantial logic capacity. Its combination of 27,648 logic cells, 404 I/O pins, and industrial-grade performance makes it suitable for telecommunications, aerospace, industrial automation, and many other demanding applications.

Whether you’re maintaining existing designs or developing new systems that benefit from mature, well-supported FPGA technology, the XCV1000-4BG560I delivers the performance and reliability needed for mission-critical applications.

For projects requiring cutting-edge FPGA capabilities with established design methodologies, the XCV1000-4BG560I offers an excellent balance of features, performance, and long-term support. Contact authorized distributors or AMD directly for pricing, availability, and technical support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.