Overview of XQR17V16VQ44R FPGA Configuration Memory
The XQR17V16VQ44R is a radiation-hardened, 16-megabit configuration PROM specifically designed for storing FPGA bitstreams in harsh radiation environments. As part of Xilinx’s QPro series, this military-grade memory device delivers reliable configuration storage for mission-critical aerospace and defense applications where radiation tolerance is essential.
Key Features and Specifications
Radiation Hardness Capabilities
| Radiation Parameter |
Specification |
Unit |
| Single Event Latch-Up (SEL) |
Immune to LET >120 |
MeV/cm²/mg |
| Total Ionizing Dose (TID) |
50 |
kRad(Si) |
| Single Event Upset (SEU) |
0 |
cm² |
| Substrate Type |
Epitaxial |
– |
Memory and Performance Specifications
| Parameter |
Value |
Notes |
| Storage Capacity |
16 Mbit |
16,777,216 configuration bits |
| Serial Configuration Speed |
Up to 33 Mb/s |
Master/Slave Serial mode |
| Parallel Configuration Speed |
Up to 264 Mb/s |
SelectMAP mode at 33 MHz |
| Operating Temperature Range |
-55°C to +125°C |
Full military temperature |
| Supply Voltage |
3.3V |
VCC operating voltage |
| Data Retention |
20 years |
Guaranteed lifetime |
Technical Architecture and Configuration Modes
Dual Configuration Interface
The XQR17V16VQ44R supports two primary configuration modes optimized for different Xilinx FPGA deployment scenarios:
Master Serial Mode Configuration
In Master Serial mode, the FPGA generates its own configuration clock (CCLK) to drive the PROM. Data transfers sequentially through a single data line, providing a simple yet reliable configuration interface that requires minimal pin connections.
SelectMAP Parallel Mode Configuration
For applications requiring faster configuration times, the SelectMAP mode enables byte-wide parallel data transfer. This configuration method achieves speeds up to 264 Mb/s, significantly reducing system initialization time in complex FPGA designs.
Pin Configuration and Package Details
XQR17V16VQ44R Pinout (44-pin CLCC CK44 Package)
| Pin Function |
Pin Number |
Description |
| DATA[0] |
2 |
Primary data output/Serial mode |
| DATA[1] |
35 |
Parallel data bit 1 |
| DATA[2] |
4 |
Parallel data bit 2 |
| DATA[3] |
33 |
Parallel data bit 3 |
| DATA[4] |
15 |
Parallel data bit 4 |
| DATA[5] |
31 |
Parallel data bit 5 |
| DATA[6] |
20 |
Parallel data bit 6 |
| DATA[7] |
25 |
Parallel data bit 7 |
| CLK |
5 |
Clock input |
| RESET/OE |
19 |
Programmable polarity reset/output enable |
| CE |
21 |
Chip enable input |
| CEO |
27 |
Chip enable output (cascading) |
| BUSY |
30 |
Busy status indicator |
| VPP |
41 |
Programming voltage |
| VCC |
14, 22, 23, 32, 42, 44 |
Power supply pins |
| GND |
3, 12, 24, 34, 43 |
Ground pins |
Electrical Characteristics
DC Operating Parameters
| Parameter |
Symbol |
Min |
Max |
Unit |
| High-level Input Voltage |
VIH |
2.0 |
VCC |
V |
| Low-level Input Voltage |
VIL |
0 |
0.8 |
V |
| High-level Output Voltage |
VOH |
2.4 |
– |
V |
| Low-level Output Voltage |
VOL |
– |
0.4 |
V |
| Active Supply Current |
ICCA |
– |
100 |
mA |
| Standby Supply Current |
ICCS |
– |
1 |
mA |
| Input/Output Leakage Current |
IL |
-10 |
+10 |
μA |
AC Timing Specifications
| Timing Parameter |
Symbol |
Min |
Max |
Unit |
| Clock to Data Delay |
TCAC |
– |
20 |
ns |
| Output Enable to Data Delay |
TOE |
– |
15 |
ns |
| Chip Enable to Data Delay |
TCE |
– |
20 |
ns |
| Clock Period |
TCYC |
50 |
– |
ns |
| Clock Low Time |
TLC |
25 |
– |
ns |
| Clock High Time |
THC |
25 |
– |
ns |
| Data Float Delay |
TDF |
– |
35 |
ns |
Advanced Features and Capabilities
Cascading for Extended Memory
Multiple XQR17V16VQ44R devices can be daisy-chained to store longer bitstreams or multiple FPGA configurations. The CEO (Chip Enable Output) pin automatically enables the next PROM in the cascade chain when the current device reaches its terminal count, enabling seamless multi-device operation.
Programmable Reset Polarity
The RESET/OE pin features programmable polarity (active-high or active-low) for maximum compatibility with different FPGA architectures. This flexibility allows direct connection to FPGA INIT pins with appropriate pull-up/pull-down configurations.
Low-Power Standby Mode
When the CE input is driven high, the device enters a low-power standby mode consuming less than 1mA, ideal for power-constrained space applications and battery-operated systems.
Application Areas
Space and Satellite Systems
The radiation-hardened design makes the XQR17V16VQ44R ideal for satellite payload processors, communication systems, and onboard computing platforms where single-event effects must be mitigated.
Military and Defense Electronics
High-reliability military applications including avionics, radar systems, missile guidance, and electronic warfare equipment benefit from the device’s radiation tolerance and guaranteed 20-year data retention.
Nuclear Instrumentation
Scientific instruments operating in high-radiation environments such as particle accelerators, nuclear facilities, and radiation monitoring equipment rely on this PROM’s robust design.
High-Altitude Aviation
Commercial and military aircraft systems operating at high altitudes face increased cosmic radiation exposure, making radiation-hardened configuration memory essential for mission-critical avionics.
Design Integration Guidelines
Interface Connections
- FPGA to PROM Data Path: Connect DATA output(s) to the FPGA DIN input
- Clock Distribution: FPGA CCLK output drives PROM CLK input
- Cascade Chain: CEO output of first PROM connects to CE input of next device
- Reset Management: RESET/OE driven by FPGA INIT output ensures proper initialization
- Configuration Complete: CE input connected to FPGA DONE pin with pull-up resistor
Programming and Development Support
The XQR17V16VQ44R is fully supported by Xilinx ISE Foundation and ISE WebPACK software packages. Standard hexadecimal format files generated by the design tools are compatible with most commercial PROM programmers from leading manufacturers.
Quality and Reliability Standards
QML Certification
This device meets QML (Qualified Manufacturers List) Class V standards, ensuring the highest level of reliability for space and military applications through rigorous screening and testing protocols.
Temperature Testing
Guaranteed operation across the full military temperature range (-55°C to +125°C) ensures reliable performance in extreme thermal environments from deep space to desert warfare scenarios.
Long-Term Data Retention
With guaranteed 20-year data retention at operating temperatures, the XQR17V16VQ44R provides exceptional reliability for long-duration missions and systems requiring extended service life.
Ordering Information and Package Options
Device Nomenclature
XQR17V16VQ44R Breakdown:
- XQR: QPro Radiation Hardened series
- 17V16: 16 Mbit density configuration PROM
- VQ44: Package designation (44-pin ceramic)
- R: Temperature grade and flow designation
Available Grades
| Grade |
Temperature Range |
Flow Type |
| M-Grade |
-55°C to +125°C |
Standard military |
| V-Grade (QPRO_PLUS) |
-55°C to +125°C |
Enhanced screening |
Technical Support and Resources
For detailed implementation guidance, timing diagrams, and application notes, designers should reference the complete XQR17V16 datasheet (DS126) available from Xilinx. The device is fully compatible with standard FPGA configuration methodologies and integrates seamlessly into existing Xilinx FPGA design flows.
Conclusion
The XQR17V16VQ44R represents a proven solution for radiation-hardened FPGA configuration storage, combining high reliability, radiation tolerance, and flexible configuration modes. Its comprehensive feature set and military-grade qualification make it the optimal choice for aerospace, defense, and high-reliability applications requiring dependable configuration memory in challenging radiation environments.
