The XC7Z045-2FFG676I represents AMD Xilinx’s flagship solution in the Zynq-7000 family, combining dual ARM Cortex-A9 processors with powerful Kintex-7 FPGA fabric. This advanced System on Chip (SoC) delivers exceptional performance for demanding embedded applications across aerospace, automotive, telecommunications, and industrial automation sectors.
Overview of XC7Z045-2FFG676I Specifications
The XC7Z045-2FFG676I integrates a sophisticated blend of processing power and programmable logic, making it ideal for applications requiring both flexible hardware acceleration and robust software processing capabilities.
Key Technical Specifications
| Specification |
Details |
| Processor |
Dual ARM Cortex-A9 MPCore with CoreSight |
| FPGA Architecture |
Kintex-7 FPGA Fabric |
| Logic Cells |
350,000 Logic Cells |
| Processing Speed |
800 MHz (ARM Processor), 733 MHz (MPU) |
| RAM |
256KB On-Chip Memory |
| Package Type |
676-Ball FCBGA (27mm x 27mm) |
| I/O Pins |
130 User I/O |
| Operating Temperature |
-40°C to 100°C (Industrial Grade) |
| Supply Voltage |
0.95V to 1.05V (Core), 1.2V/3.3V (I/O) |
Processor Architecture and Performance
Dual ARM Cortex-A9 Processing Power
The XC7Z045-2FFG676I features a dual-core ARM Cortex-A9 MPCore processor with CoreSight technology, delivering up to 2.5 DMIPS per MHz. Operating at 800MHz, this processing system provides exceptional computational performance for running Linux, real-time operating systems, and bare-metal applications.
Programmable Logic Capabilities
The integrated Kintex-7 FPGA fabric offers 350,000 logic cells, enabling designers to implement custom hardware accelerators, signal processing pipelines, and specialized interfaces that would be impossible with standard processors alone.
Memory and Storage Features
On-Chip Memory Configuration
| Memory Type |
Capacity |
Function |
| Block RAM |
19.1 Mb (36Kb blocks) |
Data buffering and caching |
| On-Chip RAM |
256KB |
Program and data storage |
| DDR Controller |
Up to 1GB DDR3/DDR3L |
External memory interface |
The XC7Z045-2FFG676I supports flexible memory configurations, allowing designers to optimize performance based on application requirements.
Connectivity and Interface Options
Comprehensive Peripheral Support
The XC7Z045-2FFG676I provides extensive connectivity options:
- Ethernet: Gigabit Ethernet MAC with hardware acceleration
- USB: USB 2.0 OTG (On-The-Go) support
- Serial Interfaces: UART, SPI, I2C for sensor and peripheral communication
- Storage Interfaces: SD/SDIO, MMC for mass storage
- CAN Bus: Controller Area Network for automotive applications
- External Memory: EBI/EMI interface for custom memory solutions
High-Speed Serial Transceivers
| Feature |
Specification |
| Programmable I/O |
LVCMOS (1.2V to 3.3V) |
| Differential Standards |
LVDS, SSTL |
| I/O Delay |
Programmable per pin |
| SerDes Support |
High-speed serial communication |
DSP and Signal Processing Capabilities
Dedicated DSP Blocks
The XC7Z045-2FFG676I incorporates optimized DSP48E1 slices for high-performance signal processing:
- 18 x 25-bit signed multiplier for fast arithmetic operations
- 48-bit accumulator for precision calculations
- 25-bit pre-adder for filter optimization
- Cascadeable architecture for complex algorithms
These DSP resources make the XC7Z045-2FFG676I ideal for applications requiring intensive mathematical computations, including digital signal processing, software-defined radio, and image processing.
Application Areas
Industrial Automation
The XC7Z045-2FFG676I excels in industrial control systems, providing:
- Real-time motion control with hardware acceleration
- Machine vision processing with FPGA-accelerated algorithms
- Industrial protocol implementation (EtherCAT, PROFINET)
- Predictive maintenance through advanced sensor fusion
Aerospace and Defense
Military and aerospace applications benefit from:
- High-reliability processing in extreme environments
- Secure boot and encryption capabilities
- Radiation-tolerant operation (industrial temperature range)
- Custom protocol implementation for legacy systems
Automotive Systems
Modern vehicles leverage the XC7Z045-2FFG676I for:
- Advanced Driver Assistance Systems (ADAS)
- In-vehicle infotainment processing
- CAN bus gateway and protocol conversion
- Sensor fusion for autonomous driving functions
Telecommunications Infrastructure
Network equipment utilizes this SoC for:
- Software-defined networking (SDN) acceleration
- Packet processing and deep packet inspection
- Base station signal processing
- Network security appliances
Development and Design Support
Software and Tools
Developers working with the XC7Z045-2FFG676I have access to comprehensive toolchains:
- Vivado Design Suite: Complete FPGA development environment
- SDK (Software Development Kit): Embedded software development
- PetaLinux: Linux distribution optimized for Zynq
- Bare-metal BSP: Low-level board support packages
Reference Designs
AMD Xilinx provides extensive reference designs and IP cores to accelerate development, including video processing pipelines, motor control examples, and communication protocol stacks.
Package and Thermal Considerations
FCBGA Package Details
The 676-ball Fine-pitch BGA package (27mm x 27mm) offers:
- Compact footprint for space-constrained designs
- Excellent thermal performance with exposed die
- 0.8mm ball pitch for high-density PCB routing
- Compatible with standard PCB manufacturing processes
Thermal Management
| Parameter |
Value |
| Junction Temperature Range |
-40°C to 100°C |
| Thermal Resistance |
~15°C/W (typical with heatsink) |
| Power Consumption |
Application dependent, 2-4W typical |
Proper thermal design ensures reliable operation across the full industrial temperature range.
Quality and Reliability
Manufacturing Standards
The XC7Z045-2FFG676I is manufactured using advanced 28nm technology, ensuring:
- High performance with low power consumption
- Excellent signal integrity at high speeds
- Long product lifecycle for industrial applications
- RoHS compliant and automotive-qualified versions available
Testing and Validation
Each device undergoes rigorous testing including:
- Full functional testing at speed
- Temperature characterization across range
- I/O timing validation
- Screening for automotive applications (AEC-Q100 where applicable)
Comparison with Related Devices
Zynq-7000 Family Positioning
| Device |
Logic Cells |
Processing System |
Primary Use Case |
| XC7Z045 |
350K |
Dual Cortex-A9 @ 800MHz |
High-performance embedded |
| XC7Z030 |
125K |
Dual Cortex-A9 @ 800MHz |
Mid-range applications |
| XC7Z020 |
85K |
Dual Cortex-A9 @ 667MHz |
General purpose embedded |
| XC7Z010 |
28K |
Single Cortex-A9 @ 667MHz |
Cost-sensitive designs |
The XC7Z045-2FFG676I offers the highest logic capacity in the Zynq-7000 family while maintaining the powerful dual-core processing system.
Getting Started with XC7Z045-2FFG676I
Evaluation Platforms
Several development boards feature the XC7Z045-2FFG676I:
- ZC706 Evaluation Kit (official Xilinx platform)
- Third-party development boards with expanded peripherals
- Custom evaluation modules for specific applications
Design Resources
Engineers can access comprehensive resources:
- Complete datasheets and reference manuals
- Application notes for common use cases
- Community forums and technical support
- Training materials and webinars
Power Supply Design Considerations
Voltage Requirements
The XC7Z045-2FFG676I requires multiple supply rails:
| Rail |
Voltage |
Purpose |
| VCCINT |
1.0V |
Core logic power |
| VCCAUX |
1.8V |
Auxiliary circuits |
| VCCO |
1.2V – 3.3V |
I/O banks |
| VCCPLL |
1.8V |
PLL power |
| VCCBRAM |
1.0V |
Block RAM |
Power Sequencing
Proper power sequencing is critical for device reliability. The recommended sequence ensures correct initialization and prevents latch-up conditions.
Integration with Xilinx FPGA Ecosystem
The XC7Z045-2FFG676I seamlessly integrates with the broader Xilinx FPGA ecosystem, leveraging decades of FPGA development experience and a vast library of proven IP cores. This compatibility ensures designers can migrate existing designs and reuse validated components.
Ordering Information and Availability
Part Number Breakdown
XC7Z045-2FFG676I decoding:
- XC7Z045: Device family and logic capacity
- -2: Speed grade (performance level)
- FFG676: Package type (676-ball FCBGA)
- I: Industrial temperature range
Package Variants
The Z7045 is available in multiple package options to suit different board designs, with the FFG676 offering an optimal balance of I/O count and package size.
Conclusion
The XC7Z045-2FFG676I represents a powerful solution for embedded systems requiring both flexible hardware acceleration and robust software processing. Its combination of dual ARM Cortex-A9 processors, extensive FPGA resources, and comprehensive peripheral support makes it ideal for demanding applications across multiple industries.
Whether you’re designing advanced industrial control systems, next-generation telecommunications equipment, or sophisticated automotive electronics, the XC7Z045-2FFG676I provides the performance, flexibility, and reliability needed for success.
