Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7Z100-L2FFG1156I High-Performance SoC (Industrial)

Product Details

Product Description

When designing advanced embedded systems, engineers need a processing solution that balances immense computational power with complete hardware flexibility. The Xilinx XC7Z100-L2FFG1156I stands out as the highest-density device in the renowned Zynq-7000 All Programmable SoC (System on Chip) family. Combining a robust ARM processor with exceptional programmable logic, this component is engineered specifically for demanding, high-bandwidth applications.

Unmatched Architecture of the XC7Z100-L2FFG1156I

The architecture of the Xilinx XC7Z100-L2FFG1156I is what truly sets it apart from traditional processors. It seamlessly integrates a dual-core ARM Cortex-A9 MPCore processing system (PS) with Xilinx 28nm Kintex-7 programmable logic (PL). This tight hardware-software integration allows developers to build highly customized, low-latency systems.

Because it is an “L2” variant, it offers a distinct low-power advantage without sacrificing its top-tier processing performance. Furthermore, the “I” designation ensures reliable, continuous operation across a harsh industrial temperature range of -40°C to 100°C.

Technical Specifications

To understand the true capability of this SoC, it is essential to look at the numbers. Below is a detailed breakdown of the core technical specifications for the XC7Z100-L2FFG1156I.

Specification Technical Detail
Manufacturer AMD / Xilinx
Part Number XC7Z100-L2FFG1156I
Processor Core Dual-Core ARM Cortex-A9 MPCore
Maximum Speed Up to 800 MHz
FPGA Architecture Kintex-7 Programmable Logic
Logic Cells 444,000
DSP Slices 2,020
Block RAM 26.5 Mb
Transceivers 16x GTX (up to 12.5 Gb/s)
Package / Case 1156-BBGA, FCBGA (35×35 mm)
Operating Temperature -40°C to 100°C (Industrial)

Key Target Applications

Thanks to its massive 444K logic cell capacity and high-speed transceivers, this component is strictly designed for enterprise-grade and industrial hardware. It is purpose-built for:

  • Aerospace and Defense: Secure military communications, radar signal processing, and advanced avionics.

  • Broadcast Equipment: High-end video processing and 4K/8K real-time video transmission.

  • Medical Imaging: Real-time diagnostics, MRI algorithms, and ultrasound image processing.

  • Industrial Automation: Machine vision and complex, multi-axis motor control.

Why Invest in this Zynq-7000 SoC?

Using a highly integrated SoC like the XC7Z100-L2FFG1156I reduces your overall bill of materials (BOM), minimizes physical board footprint, and drastically improves system power efficiency compared to pairing a discrete processor with an external chip. It provides the ultimate platform for hardware acceleration.

Whether you are prototyping a complex defense array or finalizing a medical imaging device, selecting the right silicon is critical. If you are looking to integrate a high-performance Xilinx FPGA into your next design, the XC7Z100-L2FFG1156I delivers the processing bandwidth, massive memory, and low-power efficiency required to bring your most ambitious technical projects to life.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.