The Xilinx XC7Z045-L2FFG900I is a premier system-on-chip (SoC) belonging to the renowned Zynq®-7000 family. Designed for industrial, automotive, and telecommunication applications that demand massive data processing capability alongside stringent power efficiency, this device seamlessly integrates a feature-rich dual-core ARM® Cortex™-A9 MPCore™ processor with a high-performance 28nm FPGA programmable logic fabric.
As an “-L2” speed grade variant, the XC7Z045-L2FFG900I is specifically engineered for low-power operation, running at lower core voltages to drastically reduce static and dynamic power consumption without sacrificing processing throughput.
Key Technical Features and Architecture
The architecture of the XC7Z045-L2FFG900I breaks the traditional boundaries between hardware and software. The Processing System (PS) and the Programmable Logic (PL) are interconnected via high-bandwidth AXI interfaces, allowing for ultra-low latency data transfers and efficient hardware acceleration.
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Dual-Core ARM Cortex-A9 Processing: Operates at high frequencies with integrated L1/L2 caches and a rich set of built-in peripherals (Gigabit Ethernet, USB, SDIO, SPI, I2C, and UART).
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Massive Programmable Logic Fabric: Packed with 350K Logic Cells and over 2,000 KB of block RAM, enabling complex digital signal processing (DSP) and custom IP implementation.
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Advanced Transceiver Capabilities: Features high-speed serial transceivers that support PCIe Gen2, SATA, and multi-gigabit protocols, making it perfect for high-bandwidth networking.
Target Applications for XC7Z045-L2FFG900I
Thanks to its robust FCBGA-900 packaging and industrial temperature rating (-40°C to 100°C), this SoC is built to thrive in harsh environments. Common use cases include:
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Advanced Driver Assistance Systems (ADAS) and autonomous driving compute nodes.
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High-end medical imaging and diagnostic equipment.
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Software-defined radio (SDR) and cellular baseband processing.
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Industrial automation, robotics, and smart factory control systems.
If you are designing next-generation embedded systems requiring maximum scalability and long lifecycle support, deploying a premium Xilinx FPGA solution ensures your hardware remains future-proof.
Technical Specifications
The table below highlights the critical hardware and electrical parameters of the XC7Z045-L2FFG900I:
| Parameter |
Specification / Value |
| Manufacturer |
AMD / Xilinx |
| Part Number |
XC7Z045-L2FFG900I |
| Architecture |
Zynq-7000 All Programmable SoC |
| Processor Core |
Dual-core ARM® Cortex™-A9 MPCore™ |
| Logic Cells |
350,000 |
| Look-Up Tables (LUTs) |
218,600 |
| Block RAM (BRAM) |
19.2 Mb (approx. 2,180 KB) |
| DSP Slices |
900 |
| Speed Grade |
-L2 (Low Power / High Performance) |
| Operating Temperature |
Industrial (-40°C to 100°C) |
| Package / Case |
FCBGA-900 (31×31 mm) |
| I/O Pins |
130 I/O, 362 High-Performance I/O |
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