Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7Z045-3FFG676E Zynq-7000 SoC: High-Performance Embedded Solutions

Product Details

High-Performance Embedded Processing with Xilinx XC7Z045-3FFG676E

The Xilinx XC7Z045-3FFG676E is a premium, high-performance System-on-Chip (SoC) belonging to the flagship Zynq®-7000 family. Designed for complex applications demanding massive data throughput and tight hardware-software integration, this device seamlessly fuses a dual-core ARM® Cortex™-A9 processor with high-tier 28nm Kintex®-7 FPGA programmable logic.

By combining the software flexibility of an advanced processor with the hardware acceleration of a digital logic fabric, the XC7Z045-3FFG676E delivers unmatched system performance per watt. Whether you are developing advanced driver assistance systems (ADAS), high-end medical endoscopy imaging, or next-generation wireless infrastructure, this SoC provides the scalability your project needs. If you are sourcing reliable semiconductor components, explore our extensive inventory of Xilinx FPGA solutions to find the perfect match for your design.

Key Technical Specifications and Hardware Architecture

The “-3” speed grade in the XC7Z045-3FFG676E indicates it operates at the absolute highest performance tier within its series, pushing clock speeds up to 1 GHz. This ensures ultra-rapid data processing and minimal latency for deterministic, real-time industrial applications. Packaged in a compact 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG676), it optimizes PCB space while ensuring excellent thermal dissipation and superb signal integrity.

Technical Data Sheet Overview

Parameter Specifications
Product Series Zynq-7000 (Kintex-7 Based PL)
Part Number XC7Z045-3FFG676E
Processor Core Dual-core ARM® Cortex™-A9 MPCore™ with CoreSight™
Maximum Processor Frequency 1.0 GHz
Logic Cells 350,000
Look-Up Tables (LUTs) 218,600
Block RAM (BRAM) 19.2 Mb
DSP Slices 900
Available User I/Os 130 I/O pins
Package / Case 676-BBGA, FCBGA (27×27 mm)
Operating Temperature 0°C to 100°C (Junction Temperature $T_J$)

Target Applications and Industrial Benefits

Why choose the XC7Z045-3FFG676E for your next hardware deployment? The answer lies in its ability to offload compute-intensive math tasks from the CPU to the programmable logic fabric. This parallel processing capability makes it ideal for handling complex algorithms efficiently.

Optimized for Data-Intensive Industries

  • Computer Vision & AI: Perfect for real-time edge computing, high-frame-rate video analytics, and machine vision.

  • Aerospace and Defense: Delivers the rugged reliability and high DSP count required for secure software-defined radios.

  • Industrial Automation: Powers high-speed multi-axis motor control, industrial networking protocols, and robotics.

By selecting the XC7Z045-3FFG676E, embedded engineers can dramatically reduce total system power consumption and overall Bill of Materials (BOM) costs while maximizing long-term design flexibility.

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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.