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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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Xilinx XC7Z045-1FBG676C: High-Performance Zynq-7000 SoC Overview & Specs

Product Details

Introduction to the Xilinx XC7Z045-1FBG676C

The Xilinx XC7Z045-1FBG676C is a highly advanced and versatile System-on-Chip (SoC) belonging to the industry-leading Zynq-7000 series. Designed specifically to handle computing-intensive tasks, this component seamlessly integrates the software programmability of an ARM® Cortex™-A9 processor with the hardware acceleration capabilities of a Kintex®-7 logic fabric. Whether you are engineering advanced driver-assistance systems (ADAS), high-definition broadcast video equipment, or secure aerospace technologies, this embedded processor delivers an exceptional balance of system performance, power efficiency, and design flexibility.

Key Features and Architecture

Robust Processing and Logic Capacity

At the heart of the XC7Z045-1FBG676C is a dual-core ARM Cortex-A9 MPCore running at up to 667MHz for the -1 speed grade. What truly sets this component apart is its integration with 350,000 logic cells based on the proven 28nm Kintex-7 architecture. This hybrid approach means software engineers can run complex operating systems, like embedded Linux, directly on the ARM cores, while hardware engineers parallelize intensive digital signal processing tasks within the programmable logic.

High-Speed Connectivity and Memory

To support high-bandwidth applications, this SoC includes 19.2 Mb of internal Block RAM and 900 DSP slices. It natively supports a wide array of peripheral interfaces, including Gigabit Ethernet, USB 2.0, CAN, and SPI. Furthermore, it boasts high-speed GTX transceivers, making it a highly reliable foundation for low-latency, high-throughput data pipelines.

XC7Z045-1FBG676C Technical Specifications

To help electronic engineers quickly evaluate this component for their next PCB design, below is a detailed breakdown of its core technical specifications and physical footprint.

Specification Detail
Manufacturer Xilinx (AMD)
Part Number XC7Z045-1FBG676C
Device Family Zynq-7000 (Kintex-7 Fabric)
Processor System (PS) Dual-core ARM® Cortex®-A9 MPCore™
Maximum Clock Speed 667 MHz (-1 Commercial Speed Grade)
Programmable Logic Cells 350,000
DSP Slices 900
Total Block RAM 19.2 Mb (545 x 36Kb blocks)
Package / Case 676-FCBGA (27×27 mm)
Operating Temperature 0°C to 85°C (Commercial Grade)

Ideal Applications for This Xilinx FPGA

Thanks to its massive logic capacity, robust dual-core processing system, and hybrid architecture, the XC7Z045-1FBG676C is perfectly suited for medium-to-high complexity embedded systems. Common industry applications include:

  • Video and Vision Processing: High-bandwidth capabilities make it ideal for real-time video analytics, machine vision cameras, and high-resolution 4K broadcasting equipment.

  • Industrial Automation: It excels in complex industrial environments, powering advanced motor control systems, robotic architectures, and industrial IoT (IIoT) edge gateways.

  • Aerospace & Defense: The robust digital signal processing power supports complex radar signal processing, secure communications, and high-performance software-defined radios (SDR).

Conclusion: Why Choose the XC7Z045-1FBG676C?

For hardware designers who need to push the system performance envelope without relying on a bulky multi-chip solution, the XC7Z045-1FBG676C stands out as a premier choice. By combining a hardened processing system with massive programmable logic resources, it effectively reduces overall board space, minimizes power consumption, and eliminates bandwidth bottlenecks between the CPU and FPGA. It remains a top-tier choice for modern, data-heavy embedded applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.