Product Description
If you are developing advanced embedded systems that demand intense processing power alongside high-speed hardware programmability, the Xilinx XC7Z035-1FFG900I is an industry-leading solution. Belonging to the renowned Zynq-7000 All Programmable SoC (System on Chip) family, this device seamlessly integrates a software-centric dual-core ARM Cortex-A9 processor with high-performance 28nm Kintex-7 logic. Whether you are scaling industrial automation or designing specialized aerospace equipment, utilizing a reliable Xilinx FPGA architecture ensures superior system performance, lower power consumption, and maximum design flexibility.
Key Advantages of the XC7Z035-1FFG900I
The XC7Z035-1FFG900I stands out by tightly coupling the Processor System (PS) and Programmable Logic (PL) on a single die. This monolithic integration effectively eliminates the bandwidth bottlenecks and high power consumption typically found in traditional multi-chip computing solutions.
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Industrial-Grade Durability: The “I” designation in the XC7Z035-1FFG900I part number signifies an industrial operating temperature range of -40°C to +100°C. This makes the chip highly resilient and suitable for deployment in harsh environmental conditions.
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High-Bandwidth Connectivity: Equipped with high-speed GTX transceivers, this SoC supports massive data throughput, making it ideal for modern networking protocols and high-definition video applications.
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Reduced Board Space: By combining the ARM processor and FPGA fabric within a single 900-pin FFG900 package, hardware engineers can significantly reduce PCB footprint and simplify board routing.
Technical Specifications
To help hardware engineers and system architects quickly evaluate this SoC, the core metrics are outlined below.
Processor System (PS) Highlights
The processing core is built to handle complex operating systems, such as Linux or RTOS, and software-driven tasks efficiently. It includes integrated memory controllers and a rich set of peripheral interfaces (SPI, I2C, CAN, UART).
Programmable Logic (PL) Capabilities
Based on the advanced Kintex-7 architecture, the PL side offers exceptional digital signal processing (DSP) capabilities and high logic density. This hardware acceleration is perfect for real-time sensor processing and custom algorithmic execution.
| Feature Category |
Specification / Value |
| Manufacturer |
Xilinx (AMD) |
| Product Family |
Zynq-7000 SoC |
| Processor Core |
Dual-core ARM® Cortex®-A9 MPCore™ |
| Maximum CPU Speed |
Up to 800 MHz (Speed Grade -1) |
| FPGA Logic Equivalent |
Kintex-7 Architecture |
| Logic Cells |
275,000 |
| DSP Slices |
900 |
| Block RAM |
17.6 Mb |
| Transceivers |
16x GTX (Up to 12.5 Gb/s) |
| Operating Temperature |
-40°C to 100°C (Industrial Grade) |
| Package / Case |
900-BBGA, FCBGA (FFG900) |
Primary Applications
Because of its robust feature set and adaptable architecture, the XC7Z035-1FFG900I is widely adopted across multiple demanding sectors:
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Industrial IoT & Motor Control: Enables real-time data processing and low-latency feedback loops for automated machinery.
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Machine Vision & Broadcast: Highly capable of handling complex, high-definition video pipelines and image recognition tasks.
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Aerospace & Defense: Delivers the secure, high-reliability embedded computing necessary for flight systems and radar processing.
Conclusion
The Xilinx XC7Z035-1FFG900I remains a top-tier choice for developers looking to bridge the gap between software versatility and hardware execution. By choosing this SoC, engineering teams can accelerate their time-to-market, lower overall system costs, and achieve unparalleled computational density for next-generation embedded designs.
