Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

Xilinx XC7Z030-2FFG676E: High-Performance Zynq-7000 SoC Technical Guide

Product Details

Xilinx XC7Z030-2FFG676E: High-Performance Zynq-7000 SoC Overview

The Xilinx XC7Z030-2FFG676E stands as a pinnacle of integrated engineering, representing the powerful Zynq®-7000 SoC family. By combining a dual-core ARM® Cortex™-A9 processor with high-performance Xilinx 28nm Artix®-7 or Kintex®-7 based programmable logic, this system-on-chip delivers unparalleled flexibility and processing power for demanding industrial, medical, and communication applications.

Whether you are designing for high-speed digital signal processing (DSP), motor control, or complex networking infrastructure, the XC7Z030-2FFG676E provides the scalability and reliability required for modern high-performance embedded systems.

Key Technical Specifications

Engineers and system architects rely on the Zynq-7000 series for its unique ability to handle intensive parallel processing within the FPGA fabric while managing system-level tasks via the hardened ARM processor. Below are the core technical details for the XC7Z030-2FFG676E.

Feature Specification
Series Zynq-7000
Part Number XC7Z030-2FFG676E
Processor Core Dual-core ARM Cortex-A9
Programmable Logic Cells 125,000
Max Operating Frequency 800 MHz (Processor)
Package Type FFG676 (676-pin BGA)
I/O Count 250
Operating Temperature 0°C to 100°C (Extended)
Transceivers 4 x 6.6 Gb/s

Why Choose the XC7Z030-2FFG676E?

The “2” speed grade and “E” temperature rating make this component ideal for designs requiring a balance of efficient power consumption and high-speed execution. Because the Zynq-7000 architecture allows for tightly coupled communication between the processing system (PS) and programmable logic (PL), designers can achieve lower latency than traditional processor-plus-FPGA setups.

If you are sourcing components for your next project, explore our full range of high-quality hardware at Xilinx FPGA.

Design Flexibility and Integration

The integration of specialized IP blocks, including memory controllers, Gigabit Ethernet, and USB 2.0 interfaces, significantly reduces the total bill of materials (BOM). The XC7Z030-2FFG676E allows developers to offload compute-heavy algorithms into the FPGA fabric, ensuring the ARM processors remain available for OS management, connectivity, and user interface tasks.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.