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Xilinx XC7VX330T-3FFG1157E Virtex-7 FPGA — Features, Specs & Applications
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Product Description (Yoast-optimized, ~480 words)
XC7VX330T-3FFG1157E: Xilinx Virtex-7 FPGA for High-Performance Designs
The XC7VX330T-3FFG1157E is a high-performance Virtex-7 XT family FPGA manufactured by Xilinx (now part of AMD) on a 28nm HPL (High-Performance, Low-Power) process. Built for bandwidth-intensive applications, this device combines substantial logic capacity, embedded DSP resources, and high-speed GTH transceivers in a single 1157-ball flip-chip BGA package. Engineers specify the XC7VX330T-3FFG1157E for wired communications, video processing, radar systems, test and measurement equipment, and ASIC prototyping platforms where raw throughput and deterministic performance matter.
Why Engineers Choose the XC7VX330T-3FFG1157E
Decoding the part number gives a quick snapshot of the device: XC7V indicates the Virtex-7 series, X330T denotes the XT variant with approximately 330K logic cells, -3 specifies the highest standard speed grade, FFG1157 defines the flip-chip fine-pitch BGA package with 1157 balls, and E marks extended commercial operating temperature. This combination delivers one of the strongest performance-per-watt profiles in the Virtex-7 line-up for mid-to-high density designs.
Designers needing guidance on board layout, impedance control, or HDI stackups for this BGA can consult experienced Xilinx FPGA PCB partners to avoid fan-out and signal integrity pitfalls on the 1157-ball footprint.
Key Technical Specifications
| Parameter |
Value |
| Manufacturer |
Xilinx / AMD |
| Family |
Virtex-7 XT |
| Process Technology |
28 nm HPL |
| Logic Cells |
326,400 |
| CLB Flip-Flops |
408,000 |
| CLB LUTs |
204,000 |
| Maximum Distributed RAM |
4,388 Kb |
| Block RAM |
27,000 Kb (750 × 36 Kb blocks) |
| DSP Slices (DSP48E1) |
1,120 |
| Speed Grade |
-3 (fastest standard) |
| Operating Temperature |
0°C to 85°C (Extended Commercial) |
| Package |
FFG1157, Flip-Chip BGA |
| Package Dimensions |
35 × 35 mm, 1.0 mm pitch |
| Core Voltage (VCCINT) |
1.0 V |
| Status |
Active |
I/O and High-Speed Interface Capability
| Interface |
Specification |
| Maximum User I/O |
600 |
| I/O Banks |
Supports HP (High-Performance) and HR (High-Range) banks |
| GTH Transceivers |
24 channels |
| GTH Line Rate |
Up to 13.1 Gb/s per lane |
| PCI Express Blocks |
2 integrated PCIe Gen3 × 8 hard blocks |
| Memory Controller Support |
DDR3 SDRAM up to 1,866 Mb/s |
| Configuration Options |
JTAG, Master/Slave SPI, BPI, Serial, SelectMAP |
Typical Applications
The XC7VX330T-3FFG1157E is widely deployed in 100G/40G line cards, OTN muxponders, software-defined radio, medical imaging, phased-array radar, 4K/8K video pipelines, and semiconductor test equipment. Its mix of GTH transceivers, hard PCIe blocks, and DSP slices makes it well-suited for packet processing, digital signal processing, and real-time data acquisition workloads.
Development Tool Support
This FPGA is supported by the Xilinx Vivado Design Suite. Designers benefit from IP cores for Ethernet, Interlaken, PCIe, DDR3/DDR4 memory controllers, and RapidIO, which shorten time-to-market for complex bandwidth-heavy systems.
Ordering and Availability
Contact our sales team for current stock levels, lead times, and volume pricing on the XC7VX330T-3FFG1157E. Authentic components, full traceability, and MSL-compliant handling are provided on every shipment.
